Proceedings of the Third International Symposium on Microstructures and Microfabricated Systems
Author | : Peter J. Hesketh |
Publisher | : The Electrochemical Society |
Total Pages | : 234 |
Release | : 1997 |
Genre | : Science |
ISBN | : 9781566771320 |
Download The Proceedings Of The Third International Conference On Solid State And Integrated Circuit Technology full books in PDF, epub, and Kindle. Read online free The Proceedings Of The Third International Conference On Solid State And Integrated Circuit Technology ebook anywhere anytime directly on your device. Fast Download speed and no annoying ads. We cannot guarantee that every ebooks is available!
Author | : Peter J. Hesketh |
Publisher | : The Electrochemical Society |
Total Pages | : 234 |
Release | : 1997 |
Genre | : Science |
ISBN | : 9781566771320 |
Author | : |
Publisher | : Academic Press |
Total Pages | : 435 |
Release | : 1998-07-02 |
Genre | : Technology & Engineering |
ISBN | : 0080864503 |
This volume addresses the subject of materials science, specifically the materials aspects, device applications, and fabricating technology of SiC.
Author | : Xin-She Yang |
Publisher | : Springer Nature |
Total Pages | : 1119 |
Release | : 2023-09-14 |
Genre | : Technology & Engineering |
ISBN | : 981993236X |
This book gathers selected high-quality research papers presented at the Eighth International Congress on Information and Communication Technology, held at Brunel University, London, on 20–23 February 2023. It discusses emerging topics pertaining to information and communication technology (ICT) for managerial applications, e-governance, e-agriculture, e-education and computing technologies, the Internet of Things (IoT) and e-mining. Written by respected experts and researchers working on ICT, the book offers a valuable asset for young researchers involved in advanced studies. The work is presented in four volumes.
Author | : Philip Garrou |
Publisher | : John Wiley & Sons |
Total Pages | : 798 |
Release | : 2011-09-22 |
Genre | : Technology & Engineering |
ISBN | : 352762306X |
The first encompassing treatise of this new, but very important field puts the known physical limitations for classic 2D electronics into perspective with the requirements for further electronics developments and market necessities. This two-volume handbook presents 3D solutions to the feature density problem, addressing all important issues, such as wafer processing, die bonding, packaging technology, and thermal aspects. It begins with an introductory part, which defines necessary goals, existing issues and relates 3D integration to the semiconductor roadmap of the industry. Before going on to cover processing technology and 3D structure fabrication strategies in detail. This is followed by fields of application and a look at the future of 3D integration. The contributions come from key players in the field, from both academia and industry, including such companies as Lincoln Labs, Fraunhofer, RPI, ASET, IMEC, CEA-LETI, IBM, and Renesas.
Author | : Rohit Sharma |
Publisher | : CRC Press |
Total Pages | : 328 |
Release | : 2018-09-03 |
Genre | : Technology & Engineering |
ISBN | : 1351831593 |
Three-dimensional (3D) integration of microsystems and subsystems has become essential to the future of semiconductor technology development. 3D integration requires a greater understanding of several interconnected systems stacked over each other. While this vertical growth profoundly increases the system functionality, it also exponentially increases the design complexity. Design of 3D Integrated Circuits and Systems tackles all aspects of 3D integration, including 3D circuit and system design, new processes and simulation techniques, alternative communication schemes for 3D circuits and systems, application of novel materials for 3D systems, and the thermal challenges to restrict power dissipation and improve performance of 3D systems. Containing contributions from experts in industry as well as academia, this authoritative text: Illustrates different 3D integration approaches, such as die-to-die, die-to-wafer, and wafer-to-wafer Discusses the use of interposer technology and the role of Through-Silicon Vias (TSVs) Presents the latest improvements in three major fields of thermal management for multiprocessor systems-on-chip (MPSoCs) Explores ThruChip Interface (TCI), NAND flash memory stacking, and emerging applications Describes large-scale integration testing and state-of-the-art low-power testing solutions Complete with experimental results of chip-level 3D integration schemes tested at IBM and case studies on advanced complementary metal–oxide–semiconductor (CMOS) integration for 3D integrated circuits (ICs), Design of 3D Integrated Circuits and Systems is a practical reference that not only covers a wealth of design issues encountered in 3D integration but also demonstrates their impact on the efficiency of 3D systems.
Author | : Hongjiang Song |
Publisher | : Lulu.com |
Total Pages | : 316 |
Release | : 2014-03-21 |
Genre | : Technology & Engineering |
ISBN | : 1312051302 |
This text is developed from the notes of a VLSI circuit design class (EEE598) the author offered in Engineering School at Arizona State University. The materials cover the structural design approaches of VLSI operational amplifier circuits based on the symmetry principle, symmetry circuit structures, prototype circuits, and symmetry scaling/transformation techniques.
Author | : Christian Gontrand |
Publisher | : Bentham Science Publishers |
Total Pages | : 225 |
Release | : 2014-04-21 |
Genre | : Technology & Engineering |
ISBN | : 1608058263 |
The number of transistors in integrated circuits doubles every two years, as stipulated by Moore’s law, and this has been the driving force for the huge development of the microelectronics industry in the past 50 years – currently advanced to the nanometric scale. This e-book is dedicated to electronic noises and parasites, accounting for issues involving substrate coupling and interconnections, in the perspective of the 3D integration: a second track for enhancing integration, also compatible with Moore’s law. This reference explains the modeling of 3D circuits without delving into the latest advances, but highlights crucial problems, for instance electro-thermo-mechanical problems, which could be addressed through 3D modeling. The book also explains electromagnetic interferences , at different modeling levels (device and circuit) oriented towards 3D integration technologies. It also covers substrate noise, such as disturbances of digital blocks, power bounces, phase noise in oscillators, both at the device level, such as carriers or field fluctuations, and circuit levels. The entanglement between interconnect and substrate is also discussed. This e-book serves as a reference for advanced graduates or researchers in the field of micro and nano electronics interested in topics relevant to electromagnetic interference or the ‘noise’ domain, at device or circuit and system levels
Author | : Samar K. Saha |
Publisher | : CRC Press |
Total Pages | : 548 |
Release | : 2018-09-03 |
Genre | : Technology & Engineering |
ISBN | : 148224067X |
Compact Models for Integrated Circuit Design: Conventional Transistors and Beyond provides a modern treatise on compact models for circuit computer-aided design (CAD). Written by an author with more than 25 years of industry experience in semiconductor processes, devices, and circuit CAD, and more than 10 years of academic experience in teaching compact modeling courses, this first-of-its-kind book on compact SPICE models for very-large-scale-integrated (VLSI) chip design offers a balanced presentation of compact modeling crucial for addressing current modeling challenges and understanding new models for emerging devices. Starting from basic semiconductor physics and covering state-of-the-art device regimes from conventional micron to nanometer, this text: Presents industry standard models for bipolar-junction transistors (BJTs), metal-oxide-semiconductor (MOS) field-effect-transistors (FETs), FinFETs, and tunnel field-effect transistors (TFETs), along with statistical MOS models Discusses the major issue of process variability, which severely impacts device and circuit performance in advanced technologies and requires statistical compact models Promotes further research of the evolution and development of compact models for VLSI circuit design and analysis Supplies fundamental and practical knowledge necessary for efficient integrated circuit (IC) design using nanoscale devices Includes exercise problems at the end of each chapter and extensive references at the end of the book Compact Models for Integrated Circuit Design: Conventional Transistors and Beyond is intended for senior undergraduate and graduate courses in electrical and electronics engineering as well as for researchers and practitioners working in the area of electron devices. However, even those unfamiliar with semiconductor physics gain a solid grasp of compact modeling concepts from this book.
Author | : Sajal K Das |
Publisher | : Elsevier |
Total Pages | : 849 |
Release | : 2012-01-31 |
Genre | : Business & Economics |
ISBN | : 0124158153 |
Introduction: Securing Cyber-Physical Infrastructures--An Overview Part 1: Theoretical Foundations of Security Chapter 1: Security and Vulnerability of Cyber-Physical Infrastructure Networks: A Control-Theoretic Approach Chapter 2: Game Theory for Infrastructure Security -- The Power of Intent-Based Adversary Models Chapter 3: An Analytical Framework for Cyber-Physical Networks Chapter 4: Evolution of Widely Spreading Worms and Countermeasures : Epidemic Theory and Application Part 2: Security for Wireless Mobile Networks Chapter 5: Mobile Wireless Network Security Chapter 6: Robust Wireless Infrastructure against Jamming Attacks Chapter 7: Security for Mobile Ad Hoc Networks Chapter 8: Defending against Identity-Based Attacks in Wireless Networks Part 3: Security for Sensor Networks Chapter 9: Efficient and Distributed Access Control for Sensor Networks Chapter 10: Defending against Physical Attacks in Wireless Sensor Networks Chapter 11: Node Compromise Detection in Wireless Sensor N ...
Author | : Yuan Xie |
Publisher | : Springer Science & Business Media |
Total Pages | : 292 |
Release | : 2009-12-02 |
Genre | : Technology & Engineering |
ISBN | : 144190784X |
We live in a time of great change. In the electronics world, the last several decades have seen unprecedented growth and advancement, described by Moore’s law. This observation stated that transistor density in integrated circuits doubles every 1. 5–2 years. This came with the simultaneous improvement of individual device perf- mance as well as the reduction of device power such that the total power of the resulting ICs remained under control. No trend remains constant forever, and this is unfortunately the case with Moore’s law. The trouble began a number of years ago when CMOS devices were no longer able to proceed along the classical scaling trends. Key device parameters such as gate oxide thickness were simply no longer able to scale. As a result, device o- state currents began to creep up at an alarming rate. These continuing problems with classical scaling have led to a leveling off of IC clock speeds to the range of several GHz. Of course, chips can be clocked higher but the thermal issues become unmanageable. This has led to the recent trend toward microprocessors with mul- ple cores, each running at a few GHz at the most. The goal is to continue improving performance via parallelism by adding more and more cores instead of increasing speed. The challenge here is to ensure that general purpose codes can be ef?ciently parallelized. There is another potential solution to the problem of how to improve CMOS technology performance: three-dimensional integrated circuits (3D ICs).