High Temperature Gas-cooled Reactors

High Temperature Gas-cooled Reactors
Author: Tetsuaki Takeda
Publisher: Academic Press
Total Pages: 500
Release: 2021-02-24
Genre: Technology & Engineering
ISBN: 012821032X

High-Temperature Gas Reactors is the fifth volume in the JSME Series on Thermal and Nuclear Power Generation. Series Editor Yasuo Koizumi and his Volume editors Tetsuaki Takeda and Yoshiyuki Inagaki present the latest research on High-Temperature Gas Reactor (HTGR) development and utilization, beginning with an analysis of the history of HTGRs. A detailed analysis of HTGR design features, including reactor core design, cooling tower design, pressure vessel design, I&C factors and safety design, provides readers with a solid understanding of how to develop efficient and safe HTGR within a nuclear power plant.The authors combine their knowledge to present a guide on the safety of HTGRs throughout the entire reactor system, drawing on their unique experience to pass on lessons learned and best practices to support professionals and researchers in their design and operation of these advanced reactor types. Case studies of critical testing carried out by the authors provide the reader with firsthand information on how to conduct tests safely and effectively and an understanding of which responses are required in unexpected incidents to achieve their research objectives. An analysis of technologies and systems in development and testing stages offer the reader a look to the future of HTGRs and help to direct and inform their further research in heat transfer, fluid-dynamics, fuel options and advanced reactor facility selection.This volume is of interest for nuclear and thermal energy engineers and researchers focusing on HTGRs, HTGR plant designers and operators, regulators, post graduate students of nuclear engineering, national labs, government officials and agencies in power and energy policy and regulations. - Written by the leaders and pioneers in nuclear research at the Japanese Society of Mechanical Engineers and draws upon their combined wealth of knowledge and experience - Includes real examples and case studies from Japan, the US and Europe to provide a deeper learning opportunity with practical benefits - Considers the societal impact and sustainability concerns and goals throughout the discussion - Includes safety factors and considerations, as well as unique results from performance testing of HTGR systems

High Temperature Materials and Mechanisms

High Temperature Materials and Mechanisms
Author: Yoseph Bar-Cohen
Publisher: CRC Press
Total Pages: 586
Release: 2014-03-03
Genre: Science
ISBN: 1466566450

The use of high-temperature materials in current and future applications, including silicone materials for handling hot foods and metal alloys for developing high-speed aircraft and spacecraft systems, has generated a growing interest in high-temperature technologies. High Temperature Materials and Mechanisms explores a broad range of issues related to high-temperature materials and mechanisms that operate in harsh conditions. While some applications involve the use of materials at high temperatures, others require materials processed at high temperatures for use at room temperature. High-temperature materials must also be resistant to related causes of damage, such as oxidation and corrosion, which are accelerated with increased temperatures. This book examines high-temperature materials and mechanisms from many angles. It covers the topics of processes, materials characterization methods, and the nondestructive evaluation and health monitoring of high-temperature materials and structures. It describes the application of high temperature materials to actuators and sensors, sensor design challenges, as well as various high temperature materials and mechanisms applications and challenges. Utilizing the knowledge of experts in the field, the book considers the multidisciplinary nature of high temperature materials and mechanisms, and covers technology related to several areas including energy, space, aerospace, electronics, and metallurgy. Supplies extensive references at the end of each chapter to enhance further study Addresses related science and engineering disciplines Includes information on drills, actuators, sensors and more A comprehensive resource of information consolidated in one book, this text greatly benefits students in materials science, aerospace and mechanical engineering, and physics. It is also an ideal resource for professionals in the industry.

Heat and cold storage with PCM

Heat and cold storage with PCM
Author: Harald Mehling
Publisher: Springer Science & Business Media
Total Pages: 316
Release: 2008-08-15
Genre: Science
ISBN: 354068557X

The years 2006 and 2007 mark a dramatic change of peoples view regarding c- mate change and energy consumption. The new IPCC report makes clear that - mankind plays a dominant role on climate change due to CO emissions from en- 2 ergy consumption, and that a significant reduction in CO emissions is necessary 2 within decades. At the same time, the supply of fossil energy sources like coal, oil, and natural gas becomes less reliable. In spring 2008, the oil price rose beyond 100 $/barrel for the first time in history. It is commonly accepted today that we have to reduce the use of fossil fuels to cut down the dependency on the supply countries and to reduce CO emissions. The use of renewable energy sources and 2 increased energy efficiency are the main strategies to achieve this goal. In both strategies, heat and cold storage will play an important role. People use energy in different forms, as heat, as mechanical energy, and as light. With the discovery of fire, humankind was the first time able to supply heat and light when needed. About 2000 years ago, the Romans started to use ceramic tiles to store heat in under floor heating systems. Even when the fire was out, the room stayed warm. Since ancient times, people also know how to cool food with ice as cold storage.

Applications of High Temperature Superconductors to Electric Power Equipment

Applications of High Temperature Superconductors to Electric Power Equipment
Author: Swarn S. Kalsi
Publisher: John Wiley & Sons
Total Pages: 228
Release: 2011-04-18
Genre: Technology & Engineering
ISBN: 1118110099

The only one-stop reference to design, analysis, and manufacturing concepts for power devices utilizing HTS. High temperature superconductors (HTS) have been used for building many devices for electric grids worldwide and for large ship propulsion motors for the U.S. Navy. And yet, there has been no single source discussing theory and design issues relating to power applications of HTS—until now. This book provides design and analysis for various devices and includes examples of devices built over the last decade. Starting with a complete overview of HTS, the subsequent chapters are dedicated to specific devices: cooling and thermal insulation systems; rotating AC and DC machines; transformers; fault current limiters; power cables; and Maglev transport. As applicable, each chapter provides a history of the device, principles, configuration, design and design challenges, prototypes, and manufacturing issues, with each ending with a summary of the material covered. The design analysis and design examples provide critical insight for readers to successfully design their own devices. Original equipment manufacturer (OEM) designers, industry and utilities users, universities and defense services research groups, and senior/postgraduate engineering students and instructors will rely on this resource. "HTS technology reduces electric losses and increases the efficiency of power equipment. This book by Swarn Kalsi, a leading expert on the HTS subject, provides a survey of the HTS technology and the design rules, performance analyses, and manufacturing concepts for power application-related devices. It compares conventional and HTS technology approaches for device design and provides significant examples of devices utilizing the HTS technology today. The book is useful for a broad spectrum of professionals worldwide: students, teaching staff, and OEM designers as well as users in industry and electric utilities." —Professor Dr. Rolf Hellinger, Research and Technologies Corporate Technology, Siemens AG

High Temperature Electronics

High Temperature Electronics
Author: F. Patrick McCluskey
Publisher: CRC Press
Total Pages: 354
Release: 1996-12-13
Genre: Technology & Engineering
ISBN: 9780849396236

The development of electronics that can operate at high temperatures has been identified as a critical technology for the next century. Increasingly, engineers will be called upon to design avionics, automotive, and geophysical electronic systems requiring components and packaging reliable to 200 °C and beyond. Until now, however, they have had no single resource on high temperature electronics to assist them. Such a resource is critically needed, since the design and manufacture of electronic components have now made it possible to design electronic systems that will operate reliably above the traditional temperature limit of 125 °C. However, successful system development efforts hinge on a firm understanding of the fundamentals of semiconductor physics and device processing, materials selection, package design, and thermal management, together with a knowledge of the intended application environments. High Temperature Electronics brings together this essential information and presents it for the first time in a unified way. Packaging and device engineers and technologists will find this book required reading for its coverage of the techniques and tradeoffs involved in materials selection, design, and thermal management and for its presentation of best design practices using actual fielded systems as examples. In addition, professors and students will find this book suitable for graduate-level courses because of its detailed level of explanation and its coverage of fundamental scientific concepts. Experts from the field of high temperature electronics have contributed to nine chapters covering topics ranging from semiconductor device selection to testing and final assembly.

High-Temperature Solid Oxide Fuel Cells for the 21st Century

High-Temperature Solid Oxide Fuel Cells for the 21st Century
Author: Kevin Kendall
Publisher: Elsevier
Total Pages: 522
Release: 2015-11-21
Genre: Technology & Engineering
ISBN: 0124104835

High-temperature Solid Oxide Fuel Cells, Second Edition, explores the growing interest in fuel cells as a sustainable source of energy. The text brings the topic of green energy front and center, illustrating the need for new books that provide comprehensive and practical information on specific types of fuel cells and their applications. This landmark volume on solid oxide fuel cells contains contributions from experts of international repute, and provides a single source of the latest knowledge on this topic. - A single source for all the latest information on solid oxide fuel cells and their applications - Illustrates the need for new, more comprehensive books and study on the topic - Explores the growing interest in fuel cells as viable, sustainable sources of energy

High-Temperature Electronics

High-Temperature Electronics
Author: Randall Kirschman
Publisher: Wiley-IEEE Press
Total Pages: 0
Release: 1998-09-01
Genre: Technology & Engineering
ISBN: 9780780334779

"HIGH-TEMPERATURE ELECTRONICS provides expert coverage of the applications, characteristics, design, selection, and operation of electronic devices and circuits at temperatures above the conventional limit of 125 degrees Celsius. This edited volume contains approximately 100 key reprinted papers covering a wide range of topics related to high-temperature electronics, eight invited papers, extensive references, and a comprehensive bibliography. Containing more than 200 pages of new material, it brings the reader a well-rounded review of high-temperature electronics from its beginnings decades ago through the present and beyond to possible future technologies. The scope of HIGH TEMPERATURE ELECTRONICS includes active components from standard and advanced semiconductor materials, passive components, as well as technologies for metallizations, interconnections, and the assembly and packaging of electronic components. This book will provide active researchers, technology developers, managers, materials scientists, and advanced students with a sound fundamental grounding in high-temperature electronics technology." Sponsored by: IEEE Components, Packaging, and Manufacturing Technology Society.

Influence of Temperature on Microelectronics and System Reliability

Influence of Temperature on Microelectronics and System Reliability
Author: Pradeep Lall
Publisher: CRC Press
Total Pages: 332
Release: 2020-07-09
Genre: Technology & Engineering
ISBN: 0429605595

This book raises the level of understanding of thermal design criteria. It provides the design team with sufficient knowledge to help them evaluate device architecture trade-offs and the effects of operating temperatures. The author provides readers a sound scientific basis for system operation at realistic steady state temperatures without reliability penalties. Higher temperature performance than is commonly recommended is shown to be cost effective in production for life cycle costs. The microelectronic package considered in the book is assumed to consist of a semiconductor device with first-level interconnects that may be wirebonds, flip-chip, or tape automated bonds; die attach; substrate; substrate attach; case; lid; lid seal; and lead seal. The temperature effects on electrical parameters of both bipolar and MOSFET devices are discussed, and models quantifying the temperature effects on package elements are identified. Temperature-related models have been used to derive derating criteria for determining the maximum and minimum allowable temperature stresses for a given microelectronic package architecture. The first chapter outlines problems with some of the current modeling strategies. The next two chapters present microelectronic device failure mechanisms in terms of their dependence on steady state temperature, temperature cycle, temperature gradient, and rate of change of temperature at the chip and package level. Physics-of-failure based models used to characterize these failure mechanisms are identified and the variabilities in temperature dependence of each of the failure mechanisms are characterized. Chapters 4 and 5 describe the effects of temperature on the performance characteristics of MOS and bipolar devices. Chapter 6 discusses using high-temperature stress screens, including burn-in, for high-reliability applications. The burn-in conditions used by some manufacturers are examined and a physics-of-failure approach is described. The

Coatings for High-Temperature Structural Materials

Coatings for High-Temperature Structural Materials
Author: National Research Council
Publisher: National Academies Press
Total Pages: 102
Release: 1996-05-13
Genre: Technology & Engineering
ISBN: 0309176026

This book assesses the state of the art of coatings materials and processes for gas-turbine blades and vanes, determines potential applications of coatings in high-temperature environments, identifies needs for improved coatings in terms of performance enhancements, design considerations, and fabrication processes, assesses durability of advanced coating systems in expected service environments, and discusses the required inspection, repair, and maintenance methods. The promising areas for research and development of materials and processes for improved coating systems and the approaches to increased coating standardization are identified, with an emphasis on materials and processes with the potential for improved performance, quality, reproducibility, or manufacturing cost reduction.