The International Journal Of Microcircuits And Electronic Packaging
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Integrated Circuit, Hybrid, and Multichip Module Package Design Guidelines
Author | : Michael Pecht |
Publisher | : John Wiley & Sons |
Total Pages | : 470 |
Release | : 1994-03-31 |
Genre | : Technology & Engineering |
ISBN | : 9780471594468 |
Circuit designers, packaging engineers, printed board fabricators, and procurement personnel will find this book's microelectronic package design-for-reliability guidelines and approaches essential for achieving their life-cycle, cost-effectiveness, and on-time delivery goals. Its uniquely organized, time-phased approach to design, development, qualification, manufacture, and in-service management shows you step-by-step how to: * Define realistic system requirements in terms of mission profile, operating life, performance expectations, size, weight, and cost * Define the system usage environment so that all operating, shipping, and storage conditions, including electrical, thermal, radiation, and mechanical loads, are assessed using realistic data * Identify potential failure modes, sites, mechanisms, and architecture-stress interactions--PLUS appropriate measures you can take to reduce, eliminate, or accommodate expected failures * Characterize materials and processes by the key controllable factors, such as types and levels of defects, variations in material properties and dimensions, and the manufacturing and assembly processes involved * Use experiment, step-stress, and accelerated methods to ensure optimum design before production begins Detailed design guidelines for substrate...wire and wire, tape automated, and flip-chip bonding...element attachment and case, lead, lead and lid seals--incorporating dimensional and geometric configurations of package elements, manufacturing and assembly conditions, materials selection, and loading conditions--round out this guide's comprehensive coverage. Detailed guidelines for substrate...wire and wire, tape automated, and flip-chip bonding...element attachment and case, lead, lead and lid seals--incorporating dimensional and geometric configurations of package elements, manufacturing and assembly conditions, materials selection, and loading conditions--round out this guide's comprehensive coverage. of related interest... PHYSICAL ARCHITECTURE OF VLSI SYSTEMS --Allan D. Kraus, Robert Hannemann and Michael Pecht For the professional engineer involved in the design and manufacture of products containing electronic components, here is a comprehensive handbook to the theory and methods surrounding the assembly of microelectronic and electronic components. The book focuses on computers and consumer electronic products with internal subsystems that reflect mechanical design constraints, cost limitations, and aesthetic and ergonomic concerns. Taking a total system approach to packaging, the book systematically examines: basic chip and computer architecture; design and layout; interassembly and interconnections; cooling scheme; materials selection, including ceramics, glasses, and metals; stress, vibration, and acoustics; and manufacturing and assembly technology. 1994 (0-471-53299-1) pp. SOLDERING PROCESSES AND EQUIPMENT --Michael G. Pecht This comprehensive, fundamentals first handbook outlines the soldering methods and techniques used in the manufacture of microelectronic chips and electronic circuit boards. In a clear, easy-to-access format, the book discusses: soldering processes and classification; the material dynamics of heat soldering when assembling differing materials; wave and reflow soldering; controlling contamination during manufacturing cleanings; techniques for assuring reliability and quality control during manufacturing; rework, repair, and manual assembly; the modern assembly / repair station; and more. The book also provides clear guidelines on assembly techniques as well as an appendix of various solder equipment manufacturers. 1993 (0-471-59167-X) 312 pp.
The Electronic Packaging Handbook
Author | : Glenn R. Blackwell |
Publisher | : CRC Press |
Total Pages | : 648 |
Release | : 2017-12-19 |
Genre | : Technology & Engineering |
ISBN | : 9781420049848 |
The packaging of electronic devices and systems represents a significant challenge for product designers and managers. Performance, efficiency, cost considerations, dealing with the newer IC packaging technologies, and EMI/RFI issues all come into play. Thermal considerations at both the device and the systems level are also necessary. The Electronic Packaging Handbook, a new volume in the Electrical Engineering Handbook Series, provides essential factual information on the design, manufacturing, and testing of electronic devices and systems. Co-published with the IEEE, this is an ideal resource for engineers and technicians involved in any aspect of design, production, testing or packaging of electronic products, regardless of whether they are commercial or industrial in nature. Topics addressed include design automation, new IC packaging technologies, materials, testing, and safety. Electronics packaging continues to include expanding and evolving topics and technologies, as the demand for smaller, faster, and lighter products continues without signs of abatement. These demands mean that individuals in each of the specialty areas involved in electronics packaging-such as electronic, mechanical, and thermal designers, and manufacturing and test engineers-are all interdependent on each others knowledge. The Electronic Packaging Handbook elucidates these specialty areas and helps individuals broaden their knowledge base in this ever-growing field.
Influence of Temperature on Microelectronics and System Reliability
Author | : Pradeep Lall |
Publisher | : CRC Press |
Total Pages | : 327 |
Release | : 2020-07-09 |
Genre | : Technology & Engineering |
ISBN | : 0429611110 |
This book raises the level of understanding of thermal design criteria. It provides the design team with sufficient knowledge to help them evaluate device architecture trade-offs and the effects of operating temperatures. The author provides readers a sound scientific basis for system operation at realistic steady state temperatures without reliability penalties. Higher temperature performance than is commonly recommended is shown to be cost effective in production for life cycle costs. The microelectronic package considered in the book is assumed to consist of a semiconductor device with first-level interconnects that may be wirebonds, flip-chip, or tape automated bonds; die attach; substrate; substrate attach; case; lid; lid seal; and lead seal. The temperature effects on electrical parameters of both bipolar and MOSFET devices are discussed, and models quantifying the temperature effects on package elements are identified. Temperature-related models have been used to derive derating criteria for determining the maximum and minimum allowable temperature stresses for a given microelectronic package architecture. The first chapter outlines problems with some of the current modeling strategies. The next two chapters present microelectronic device failure mechanisms in terms of their dependence on steady state temperature, temperature cycle, temperature gradient, and rate of change of temperature at the chip and package level. Physics-of-failure based models used to characterize these failure mechanisms are identified and the variabilities in temperature dependence of each of the failure mechanisms are characterized. Chapters 4 and 5 describe the effects of temperature on the performance characteristics of MOS and bipolar devices. Chapter 6 discusses using high-temperature stress screens, including burn-in, for high-reliability applications. The burn-in conditions used by some manufacturers are examined and a physics-of-failure approach is described. The
Low and High Dielectric Constant Materials
Author | : Rajendra Singh |
Publisher | : The Electrochemical Society |
Total Pages | : 242 |
Release | : 2000 |
Genre | : Technology & Engineering |
ISBN | : 9781566772297 |
Semiconductor Advanced Packaging
Author | : John H. Lau |
Publisher | : Springer Nature |
Total Pages | : 513 |
Release | : 2021-05-17 |
Genre | : Technology & Engineering |
ISBN | : 9811613761 |
The book focuses on the design, materials, process, fabrication, and reliability of advanced semiconductor packaging components and systems. Both principles and engineering practice have been addressed, with more weight placed on engineering practice. This is achieved by providing in-depth study on a number of major topics such as system-in-package, fan-in wafer/panel-level chip-scale packages, fan-out wafer/panel-level packaging, 2D, 2.1D, 2.3D, 2.5D, and 3D IC integration, chiplets packaging, chip-to-wafer bonding, wafer-to-wafer bonding, hybrid bonding, and dielectric materials for high speed and frequency. The book can benefit researchers, engineers, and graduate students in fields of electrical engineering, mechanical engineering, materials sciences, and industry engineering, etc.
Food Packaging
Author | : Rui M. S. da Cruz |
Publisher | : CRC Press |
Total Pages | : 289 |
Release | : 2019-11-11 |
Genre | : Science |
ISBN | : 0429665725 |
Food Packaging: Innovations and Shelf-life covers recently investigated developments in food packaging and their influence in food quality preservation, shelf-life extension, and simulation techniques. Additionally, the book discusses the environmental impact and sustainable solutions of food packaging. This book is divided into seven chapters, written by worldwide experts. The book is an ideal reference source for university students, food engineers and researchers from R&D laboratories working in the area of food science and technology. Professionals from institutions related to food packaging.
State-of-the-Art Program on Compound Semiconductors 49 (SOTAPOCS 49) -and- Nitrides and Wide-Bandgap Semiconductors for Sensors, Photonics, and Electronics 9
Author | : J. Wang |
Publisher | : The Electrochemical Society |
Total Pages | : 240 |
Release | : 2008-10 |
Genre | : Compound semiconductors |
ISBN | : 1566776538 |
This issue of ECS Transactions focuses on issues pertinent to materials growth, characterization, processing, development, application of compound semiconductor materials and devices, including nitrides and wide-bandgap semiconductors.
Failure Modes and Mechanisms in Electronic Packages
Author | : P. Singh |
Publisher | : Springer Science & Business Media |
Total Pages | : 391 |
Release | : 2012-12-06 |
Genre | : Technology & Engineering |
ISBN | : 1461560292 |
With the proliferation of packaging technology, failure and reliability have become serious concerns. This invaluable reference details processes that enable detection, analysis and prevention of failures. It provides a comprehensive account of the failures of device packages, discrete component connectors, PCB carriers and PCB assemblies.
Improving Product Reliability
Author | : Mark A. Levin |
Publisher | : John Wiley & Sons |
Total Pages | : 346 |
Release | : 2003-05-07 |
Genre | : Technology & Engineering |
ISBN | : 9780470854495 |
The design and manufacture of reliable products is a major challenge for engineers and managers. This book arms technical managers and engineers with the tools to compete effectively through the design and production of reliable technology products.