Testing Of Interposer Based 25d Integrated Circuits
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Author | : Ran Wang |
Publisher | : Springer |
Total Pages | : 192 |
Release | : 2017-03-20 |
Genre | : Technology & Engineering |
ISBN | : 3319547143 |
This book provides readers with an insightful guide to the design, testing and optimization of 2.5D integrated circuits. The authors describe a set of design-for-test methods to address various challenges posed by the new generation of 2.5D ICs, including pre-bond testing of the silicon interposer, at-speed interconnect testing, built-in self-test architecture, extest scheduling, and a programmable method for low-power scan shift in SoC dies. This book covers many testing techniques that have already been used in mainstream semiconductor companies. Readers will benefit from an in-depth look at test-technology solutions that are needed to make 2.5D ICs a reality and commercially viable.
Author | : Jose Luis Huertas Díaz |
Publisher | : Springer Science & Business Media |
Total Pages | : 310 |
Release | : 2010-02-23 |
Genre | : Technology & Engineering |
ISBN | : 0387235213 |
Test and Design-for-Testability in Mixed-Signal Integrated Circuits deals with test and design for test of analog and mixed-signal integrated circuits. Especially in System-on-Chip (SoC), where different technologies are intertwined (analog, digital, sensors, RF); test is becoming a true bottleneck of present and future IC projects. Linking design and test in these heterogeneous systems will have a tremendous impact in terms of test time, cost and proficiency. Although it is recognized as a key issue for developing complex ICs, there is still a lack of structured references presenting the major topics in this area. The aim of this book is to present basic concepts and new ideas in a manner understandable for both professionals and students. Since this is an active research field, a comprehensive state-of-the-art overview is very valuable, introducing the main problems as well as the ways of solution that seem promising, emphasizing their basis, strengths and weaknesses. In essence, several topics are presented in detail. First of all, techniques for the efficient use of DSP-based test and CAD test tools. Standardization is another topic considered in the book, with focus on the IEEE 1149.4. Also addressed in depth is the connecting design and test by means of using high-level (behavioural) description techniques, specific examples are given. Another issue is related to test techniques for well-defined classes of integrated blocks, like data converters and phase-locked-loops. Besides these specification-driven testing techniques, fault-driven approaches are described as they offer potential solutions which are more similar to digital test methods. Finally, in Design-for-Testability and Built-In-Self-Test, two other concepts that were taken from digital design, are introduced in an analog context and illustrated for the case of integrated filters. In summary, the purpose of this book is to provide a glimpse on recent research results in the area of testing mixed-signal integrated circuits, specifically in the topics mentioned above. Much of the work reported herein has been performed within cooperative European Research Projects, in which the authors of the different chapters have actively collaborated. It is a representative snapshot of the current state-of-the-art in this emergent field.
Author | : Peter Shepherd |
Publisher | : McGraw-Hill Professional Publishing |
Total Pages | : 248 |
Release | : 1996 |
Genre | : Technology & Engineering |
ISBN | : |
All aspects of chip realization for both digital and analog circuits are covered. Electronics engineers are shown how to choose appropriate technololgy and circuit architecture, and plan the IC design. They'll gain expert information on power consaiderations, the advantages and disadvantages of each IC architecture, and aspects of design for testability.
Author | : Yichuang Sun |
Publisher | : IET |
Total Pages | : 411 |
Release | : 2008-05-30 |
Genre | : Technology & Engineering |
ISBN | : 0863417450 |
This book provides a comprehensive discussion of automatic testing, diagnosis and tuning of analogue, mixed-signal and RF integrated circuits, and systems in a single source. As well as fundamental concepts and techniques, the book reports systematically the state of the arts and future research directions of those areas. A complete range of circuit components are covered and test issues from the SoC perspective. An essential reference for researchers and engineers in mixed signal testing, postgraduate and senior undergraduate students.
Author | : J. Altet |
Publisher | : Springer Science & Business Media |
Total Pages | : 212 |
Release | : 2013-03-09 |
Genre | : Technology & Engineering |
ISBN | : 1475736355 |
Temperature has been always considered as an appreciable magnitude to detect failures in electric systems. In this book, the authors present the feasibility of considering temperature as an observable for testing purposes, with full coverage of the state of the art.
Author | : Ian A. Grout |
Publisher | : Springer Science & Business Media |
Total Pages | : 396 |
Release | : 2005-08-22 |
Genre | : Technology & Engineering |
ISBN | : 9781846280238 |
Using the book and the software provided with it, the reader can build his/her own tester arrangement to investigate key aspects of analog-, digital- and mixed system circuits Plan of attack based on traditional testing, circuit design and circuit manufacture allows the reader to appreciate a testing regime from the point of view of all the participating interests Worked examples based on theoretical bookwork, practical experimentation and simulation exercises teach the reader how to test circuits thoroughly and effectively
Author | : Sudarshan Bahukudumbi |
Publisher | : Artech House |
Total Pages | : 198 |
Release | : 2010 |
Genre | : Technology & Engineering |
ISBN | : 1596939907 |
Wafer-level testing refers to a critical process of subjecting integrated circuits and semiconductor devices to electrical testing while they are still in wafer form. Burn-in is a temperature/bias reliability stress test used in detecting and screening out potential early life device failures. This hands-on resource provides a comprehensive analysis of these methods, showing how wafer-level testing during burn-in (WLTBI) helps lower product cost in semiconductor manufacturing. Engineers learn how to implement the testing of integrated circuits at the wafer-level under various resource constraints. Moreover, this unique book helps practitioners address the issue of enabling next generation products with previous generation testers. Practitioners also find expert insights on current industry trends in WLTBI test solutions.
Author | : James T. Healy |
Publisher | : |
Total Pages | : 264 |
Release | : 1981 |
Genre | : Technology & Engineering |
ISBN | : |
Author | : Erik P. DeBenedictis |
Publisher | : |
Total Pages | : 90 |
Release | : 1983 |
Genre | : Integrated circuits |
ISBN | : |
Author | : Guru Sivaraman |
Publisher | : |
Total Pages | : 236 |
Release | : 1994 |
Genre | : |
ISBN | : |