Testing Of Interposer Based 25d Integrated Circuits
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| Author | : Ran Wang |
| Publisher | : Springer |
| Total Pages | : 192 |
| Release | : 2017-03-20 |
| Genre | : Technology & Engineering |
| ISBN | : 3319547143 |
This book provides readers with an insightful guide to the design, testing and optimization of 2.5D integrated circuits. The authors describe a set of design-for-test methods to address various challenges posed by the new generation of 2.5D ICs, including pre-bond testing of the silicon interposer, at-speed interconnect testing, built-in self-test architecture, extest scheduling, and a programmable method for low-power scan shift in SoC dies. This book covers many testing techniques that have already been used in mainstream semiconductor companies. Readers will benefit from an in-depth look at test-technology solutions that are needed to make 2.5D ICs a reality and commercially viable.
| Author | : Sundarapandian Vaidyanathan |
| Publisher | : Springer |
| Total Pages | : 513 |
| Release | : 2017-02-15 |
| Genre | : Technology & Engineering |
| ISBN | : 3319517244 |
This book reports on the latest advances in and applications of memristors, memristive devices and systems. It gathers 20 contributed chapters by subject experts, including pioneers in the field such as Leon Chua (UC Berkeley, USA) and R.S. Williams (HP Labs, USA), who are specialized in the various topics addressed in this book, and covers broad areas of memristors and memristive devices such as: memristor emulators, oscillators, chaotic and hyperchaotic memristive systems, control of memristive systems, memristor-based min-max circuits, canonic memristors, memristive-based neuromorphic applications, implementation of memristor-based chaotic oscillators, inverse memristors, linear memristor devices, delayed memristive systems, flux-controlled memristive emulators, etc. Throughout the book, special emphasis is given to papers offering practical solutions and design, modeling, and implementation insights to address current research problems in memristors, memristive devices and systems. As such, it offers a valuable reference book on memristors and memristive devices for graduate students and researchers with a basic knowledge of electrical and control systems engineering.
| Author | : Tolga Tekin |
| Publisher | : Woodhead Publishing |
| Total Pages | : 431 |
| Release | : 2016-11-01 |
| Genre | : Computers |
| ISBN | : 008100513X |
Current data centre networks, based on electronic packet switches, are experiencing an exponential increase in network traffic due to developments such as cloud computing. Optical interconnects have emerged as a promising alternative offering high throughput and reduced power consumption. Optical Interconnects for Data Centers reviews key developments in the use of optical interconnects in data centres and the current state of the art in transforming this technology into a reality. The book discusses developments in optical materials and components (such as single and multi-mode waveguides), circuit boards and ways the technology can be deployed in data centres. Optical Interconnects for Data Centers is a key reference text for electronics designers, optical engineers, communications engineers and R&D managers working in the communications and electronics industries as well as postgraduate researchers. - Summarizes the state-of-the-art in this emerging field - Presents a comprehensive review of all the key aspects of deploying optical interconnects in data centers, from materials and components, to circuit boards and methods for integration - Contains contributions that are drawn from leading international experts on the topic
| Author | : M.R. Oliver |
| Publisher | : Springer Science & Business Media |
| Total Pages | : 444 |
| Release | : 2004-01-26 |
| Genre | : Technology & Engineering |
| ISBN | : 9783540431817 |
This book contains a comprehensive review of CMP (Chemical-Mechanical Planarization) technology, one of the most exciting areas in the field of semiconductor technology. It contains detailed discussions of all aspects of the technology, for both dielectrics and metals. The state of polishing models and their relation to experimental results are covered. Polishing tools and consumables are also covered. The leading edge issues of damascene and new dielectrics as well as slurryless technology are discussed.
| Author | : Muhannad S. Bakir |
| Publisher | : Artech House |
| Total Pages | : 551 |
| Release | : 2008-11-30 |
| Genre | : Technology & Engineering |
| ISBN | : 1596932473 |
This cutting-edge book on off-chip technologies puts the hottest breakthroughs in high-density compliant electrical interconnects, nanophotonics, and microfluidics at your fingertips, integrating the full range of mathematics, physics, and technology issues together in a single comprehensive source. You get full details on state-of-the-art I/O interconnects and packaging, including mechanically compliant I/O approaches, fabrication, and assembly, followed by the latest advances and applications in power delivery design, analysis, and modeling. The book explores interconnect structures, materials, and packages for achieving high-bandwidth off-chip electrical communication, including optical interconnects and chip-to-chip signaling approaches, and brings you up to speed on CMOS integrated optical devices, 3D integration, wafer stacking technology, and through-wafer interconnects.
| Author | : Manho Lee |
| Publisher | : Springer |
| Total Pages | : 0 |
| Release | : 2016-09-27 |
| Genre | : Technology & Engineering |
| ISBN | : 9789401779494 |
Through Silicon Via (TSV) is a key technology for realizing three-dimensional integrated circuits (3D ICs) for future high-performance and low-power systems with small form factors. This book covers both qualitative and quantitative approaches to give insights of modeling TSV in a various viewpoints such as signal integrity, power integrity and thermal integrity. Most of the analysis in this book includes simulations, numerical modelings and measurements for verification. The author and co-authors in each chapter have studied deep into TSV for many years and the accumulated technical know-hows and tips for related subjects are comprehensively covered.
| Author | : Daniel Lu |
| Publisher | : Springer |
| Total Pages | : 974 |
| Release | : 2016-11-18 |
| Genre | : Technology & Engineering |
| ISBN | : 3319450980 |
Significant progress has been made in advanced packaging in recent years. Several new packaging techniques have been developed and new packaging materials have been introduced. This book provides a comprehensive overview of the recent developments in this industry, particularly in the areas of microelectronics, optoelectronics, digital health, and bio-medical applications. The book discusses established techniques, as well as emerging technologies, in order to provide readers with the most up-to-date developments in advanced packaging.
| Author | : Yung-cheng Lee |
| Publisher | : World Scientific |
| Total Pages | : 363 |
| Release | : 2018-01-03 |
| Genre | : Technology & Engineering |
| ISBN | : 9813229373 |
MEMS sensors and actuators are enabling components for smartphones, AR/VR, and wearable electronics. MEMS packaging is recognized as one of the most critical activities to design and manufacture reliable MEMS. A unique challenge to MEMS packaging is how to protect moving MEMS devices during manufacturing and operation. With the introduction of wafer level capping and encapsulation processes, this barrier is removed successfully. In addition, MEMS devices should be integrated with their electronic chips with the smallest footprint possible. As a result, 3D packaging is applied to connect the devices vertically for the most effective integration. Such 3D packaging also paves the way for further heterogenous integration of MEMS devices, electronics, and other functional devices.This book consists of chapters written by leaders developing products in a MEMS industrial setting and faculty members conducting research in an academic setting. After an introduction chapter, the practical issues are covered: through-silicon vias (TSVs), vertical interconnects, wafer level packaging, motion sensor-to-CMOS bonding, and use of printed circuit board technology to fabricate MEMS. These chapters are written by leaders developing MEMS products. Then, fundamental issues are discussed, topics including encapsulation of MEMS, heterogenous integration, microfluidics, solder bonding, localized sealing, microsprings, and reliability.
| Author | : George F. Viamontes |
| Publisher | : Springer Science & Business Media |
| Total Pages | : 193 |
| Release | : 2009-08-04 |
| Genre | : Technology & Engineering |
| ISBN | : 9048130654 |
Quantum Circuit Simulation covers the fundamentals of linear algebra and introduces basic concepts of quantum physics needed to understand quantum circuits and algorithms. It requires only basic familiarity with algebra, graph algorithms and computer engineering. After introducing necessary background, the authors describe key simulation techniques that have so far been scattered throughout the research literature in physics, computer science, and computer engineering. Quantum Circuit Simulation also illustrates the development of software for quantum simulation by example of the QuIDDPro package, which is freely available and can be used by students of quantum information as a "quantum calculator."
| Author | : Joel P. Dunsmore |
| Publisher | : John Wiley & Sons |
| Total Pages | : 852 |
| Release | : 2020-06-29 |
| Genre | : Technology & Engineering |
| ISBN | : 1119477131 |
Handbook of Microwave Component Measurements Second Edition is a fully updated, complete reference to this topic, focusing on the modern measurement tools, such as a Vector Network Analyzer (VNA), gathering in one place all the concepts, formulas, and best practices of measurement science. It includes basic concepts in each chapter as well as appendices which provide all the detail needed to understand the science behind microwave measurements. The book offers an insight into the best practices for ascertaining the true nature of the device-under-test (DUT), optimizing the time to setup and measure, and to the greatest extent possible, remove the effects of the measuring equipment from that result. Furthermore, the author writes with a simplicity that is easily accessible to the student or new engineer, yet is thorough enough to provide details of measurement science for even the most advanced applications and researchers. This welcome new edition brings forward the most modern techniques used in industry today, and recognizes that more new techniques have developed since the first edition published in 2012. Whilst still focusing on the VNA, these techniques are also compatible with other vendor's advanced equipment, providing a comprehensive industry reference.
