Technology And Application Of Aligned Wafer Bonding For Three Dimensional Microstructures And Microdevices
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Handbook of 3D Integration, Volume 3
Author | : Philip Garrou |
Publisher | : John Wiley & Sons |
Total Pages | : 484 |
Release | : 2014-04-22 |
Genre | : Technology & Engineering |
ISBN | : 3527670122 |
Edited by key figures in 3D integration and written by top authors from high-tech companies and renowned research institutions, this book covers the intricate details of 3D process technology. As such, the main focus is on silicon via formation, bonding and debonding, thinning, via reveal and backside processing, both from a technological and a materials science perspective. The last part of the book is concerned with assessing and enhancing the reliability of the 3D integrated devices, which is a prerequisite for the large-scale implementation of this emerging technology. Invaluable reading for materials scientists, semiconductor physicists, and those working in the semiconductor industry, as well as IT and electrical engineers.
Handbook of Wafer Bonding
Author | : Peter Ramm |
Publisher | : John Wiley & Sons |
Total Pages | : 435 |
Release | : 2012-02-13 |
Genre | : Technology & Engineering |
ISBN | : 3527326464 |
The focus behind this book on wafer bonding is the fast paced changes in the research and development in three-dimensional (3D) integration, temporary bonding and micro-electro-mechanical systems (MEMS) with new functional layers. Written by authors and edited by a team from microsystems companies and industry-near research organizations, this handbook and reference presents dependable, first-hand information on bonding technologies. Part I sorts the wafer bonding technologies into four categories: Adhesive and Anodic Bonding; Direct Wafer Bonding; Metal Bonding; and Hybrid Metal/Dielectric Bonding. Part II summarizes the key wafer bonding applications developed recently, that is, 3D integration, MEMS, and temporary bonding, to give readers a taste of the significant applications of wafer bonding technologies. This book is aimed at materials scientists, semiconductor physicists, the semiconductor industry, IT engineers, electrical engineers, and libraries.
Light Driven Micromachines
Author | : George K. Knopf |
Publisher | : CRC Press |
Total Pages | : 399 |
Release | : 2018-03-29 |
Genre | : Technology & Engineering |
ISBN | : 1351001264 |
In Light Driven Micromachines, the fundamental principles and unique characteristics of light driven material structures, simple mechanisms and integrated machines are explored. Very small light driven systems provide a number of interesting features and unique design opportunities because streams of photons deliver energy into the system and provide the control signal used to regulate the response of the micron sized device. Through innovative material design and clever component fabrication, these optically powered tiny machines can be created to perform mechanical work when exposed to varying light intensity, wavelength, phase, and/or polarization. The book begins with the scientific background necessary to understand the nature of light and how light can initiate physical movement by inducing material deformation or altering the surrounding environment to impose micro-forces on the actuating mechanisms. The impact of physical size on the performance of light driven mechanisms and machines is discussed, and the nature of light–material interactions is reviewed. These interactions enable very small objects and mechanical components to be trapped and manipulated by a focused light beam, or produce local temperature gradients that force certain materials to undergo shape transformation. Advanced phase transition gels, polymers, carbon-based films and piezoelectric ceramics that exhibit direct light-to-mechanical energy conversion are examined from the perspective of designing optically driven actuators and mechanical systems. The ability of light to create photothermal effects that drive microfluidic processes and initiate the phase transformation of temperature sensitive shape memory materials are also explored in the book. This compendium seeks to inspire the next generation of scientists and engineers by presenting the fundamental principles of this emerging interdisciplinary technology and exploring how the properties of light can be exploited for microfluidic, microrobotic, biomedical and space applications.
Micro-Nanofabrication
Author | : Zheng Cui |
Publisher | : Springer |
Total Pages | : 0 |
Release | : 2010-10-14 |
Genre | : Technology & Engineering |
ISBN | : 9783642066979 |
The book is a collection of the author’s years of experience and research findings, as well as the latest development, in micro-nanofabrication technologies. It gives a detailed introduction on the basics of micro-nanofabrication, including optical lithography, electron beam lithography, focused ion beam technique, X-ray lithography, various etching and replication techniques. For each of the fabrication technology it introduces, the emphasis is on clear explanation of the basic principle, the essential steps in the processes, various process conditions and typical process parameters. The advantages and disadvantages of each technique are also analysed. The applications of micro-nanofabrication technologies focus on manufacturing of very large scale integrated circuits (VLSI), nanoelectronics, optoelectronics, high density magnetic storage, micro-electro-mechanical system or MEMS, biochip or lab-on-chip and nanotechnology. Each of the applications is accompanied by practical examples to demonstrate how particular fabrication techniques are applied. There is an extensive list of references following each chapter for readers to explore further. The book is not only a good supplementary reading material for university undergraduates or postgraduates who are novices in this field, but also a good reference book for experienced engineering professionals who wish to know other fabrication techniques outside their own field.
CMOS - MEMS
Author | : Henry Baltes |
Publisher | : John Wiley & Sons |
Total Pages | : 612 |
Release | : 2008-07-11 |
Genre | : Technology & Engineering |
ISBN | : 3527616934 |
Microstructures, electronics, nanotechnology - these vast fields of research are growing together as the size gap narrows and many different materials are combined. Current research, engineering sucesses and newly commercialized products hint at the immense innovative potentials and future applications that open up once mankind controls shape and function from the atomic level right up to the visible world without any gaps. Sensor systems, microreactors, nanostructures, nanomachines, functional surfaces, integrated optics, displays, communications technology, biochips, human/machine interfaces, prosthetics, miniaturized medical and surgery equipment and many more opportunities are being explored. This new series, Advanced Micro and Nano Systems, provides cutting-edge reviews from top authors on technologies, devices and advanced systems from the micro and nano worlds.
Wafer Level 3-D ICs Process Technology
Author | : Chuan Seng Tan |
Publisher | : Springer Science & Business Media |
Total Pages | : 365 |
Release | : 2009-06-29 |
Genre | : Technology & Engineering |
ISBN | : 0387765344 |
This book focuses on foundry-based process technology that enables the fabrication of 3-D ICs. The core of the book discusses the technology platform for pre-packaging wafer lever 3-D ICs. However, this book does not include a detailed discussion of 3-D ICs design and 3-D packaging. This is an edited book based on chapters contributed by various experts in the field of wafer-level 3-D ICs process technology. They are from academia, research labs and industry.
Introduction to Microfabrication
Author | : Sami Franssila |
Publisher | : John Wiley & Sons |
Total Pages | : 534 |
Release | : 2010-10-29 |
Genre | : Technology & Engineering |
ISBN | : 1119991897 |
This accessible text is now fully revised and updated, providing an overview of fabrication technologies and materials needed to realize modern microdevices. It demonstrates how common microfabrication principles can be applied in different applications, to create devices ranging from nanometer probe tips to meter scale solar cells, and a host of microelectronic, mechanical, optical and fluidic devices in between. Latest developments in wafer engineering, patterning, thin films, surface preparation and bonding are covered. This second edition includes: expanded sections on MEMS and microfluidics related fabrication issues new chapters on polymer and glass microprocessing, as well as serial processing techniques 200 completely new and 200 modified figures more coverage of imprinting techniques, process integration and economics of microfabrication 300 homework exercises including conceptual thinking assignments, order of magnitude estimates, standard calculations, and device design and process analysis problems solutions to homework problems on the complementary website, as well as PDF slides of the figures and tables within the book With clear sections separating basic principles from more advanced material, this is a valuable textbook for senior undergraduate and beginning graduate students wanting to understand the fundamentals of microfabrication. The book also serves as a handy desk reference for practicing electrical engineers, materials scientists, chemists and physicists alike. www.wiley.com/go/Franssila_Micro2e