Integrated Circuit Test Engineering

Integrated Circuit Test Engineering
Author: Ian A. Grout
Publisher: Springer Science & Business Media
Total Pages: 396
Release: 2005-08-22
Genre: Technology & Engineering
ISBN: 9781846280238

Using the book and the software provided with it, the reader can build his/her own tester arrangement to investigate key aspects of analog-, digital- and mixed system circuits Plan of attack based on traditional testing, circuit design and circuit manufacture allows the reader to appreciate a testing regime from the point of view of all the participating interests Worked examples based on theoretical bookwork, practical experimentation and simulation exercises teach the reader how to test circuits thoroughly and effectively

Test and Design-for-Testability in Mixed-Signal Integrated Circuits

Test and Design-for-Testability in Mixed-Signal Integrated Circuits
Author: Jose Luis Huertas Díaz
Publisher: Springer Science & Business Media
Total Pages: 310
Release: 2010-02-23
Genre: Technology & Engineering
ISBN: 0387235213

Test and Design-for-Testability in Mixed-Signal Integrated Circuits deals with test and design for test of analog and mixed-signal integrated circuits. Especially in System-on-Chip (SoC), where different technologies are intertwined (analog, digital, sensors, RF); test is becoming a true bottleneck of present and future IC projects. Linking design and test in these heterogeneous systems will have a tremendous impact in terms of test time, cost and proficiency. Although it is recognized as a key issue for developing complex ICs, there is still a lack of structured references presenting the major topics in this area. The aim of this book is to present basic concepts and new ideas in a manner understandable for both professionals and students. Since this is an active research field, a comprehensive state-of-the-art overview is very valuable, introducing the main problems as well as the ways of solution that seem promising, emphasizing their basis, strengths and weaknesses. In essence, several topics are presented in detail. First of all, techniques for the efficient use of DSP-based test and CAD test tools. Standardization is another topic considered in the book, with focus on the IEEE 1149.4. Also addressed in depth is the connecting design and test by means of using high-level (behavioural) description techniques, specific examples are given. Another issue is related to test techniques for well-defined classes of integrated blocks, like data converters and phase-locked-loops. Besides these specification-driven testing techniques, fault-driven approaches are described as they offer potential solutions which are more similar to digital test methods. Finally, in Design-for-Testability and Built-In-Self-Test, two other concepts that were taken from digital design, are introduced in an analog context and illustrated for the case of integrated filters. In summary, the purpose of this book is to provide a glimpse on recent research results in the area of testing mixed-signal integrated circuits, specifically in the topics mentioned above. Much of the work reported herein has been performed within cooperative European Research Projects, in which the authors of the different chapters have actively collaborated. It is a representative snapshot of the current state-of-the-art in this emergent field.

Design-for-Test and Test Optimization Techniques for TSV-based 3D Stacked ICs

Design-for-Test and Test Optimization Techniques for TSV-based 3D Stacked ICs
Author: Brandon Noia
Publisher: Springer Science & Business Media
Total Pages: 260
Release: 2013-11-19
Genre: Technology & Engineering
ISBN: 3319023780

This book describes innovative techniques to address the testing needs of 3D stacked integrated circuits (ICs) that utilize through-silicon-vias (TSVs) as vertical interconnects. The authors identify the key challenges facing 3D IC testing and present results that have emerged from cutting-edge research in this domain. Coverage includes topics ranging from die-level wrappers, self-test circuits, and TSV probing to test-architecture design, test scheduling, and optimization. Readers will benefit from an in-depth look at test-technology solutions that are needed to make 3D ICs a reality and commercially viable.

Digital Circuit Testing

Digital Circuit Testing
Author: Francis C. Wong
Publisher: Elsevier
Total Pages: 248
Release: 2012-12-02
Genre: Technology & Engineering
ISBN: 0080504345

Recent technological advances have created a testing crisis in the electronics industry--smaller, more highly integrated electronic circuits and new packaging techniques make it increasingly difficult to physically access test nodes. New testing methods are needed for the next generation of electronic equipment and a great deal of emphasis is being placed on the development of these methods. Some of the techniques now becoming popular include design for testability (DFT), built-in self-test (BIST), and automatic test vector generation (ATVG). This book will provide a practical introduction to these and other testing techniques. For each technique introduced, the author provides real-world examples so the reader can achieve a working knowledge of how to choose and apply these increasingly important testing methods.

Microelectronics Fialure Analysis Desk Reference, Seventh Edition

Microelectronics Fialure Analysis Desk Reference, Seventh Edition
Author: Tejinder Gandhi
Publisher: ASM International
Total Pages: 719
Release: 2019-11-01
Genre: Technology & Engineering
ISBN: 1627082468

The Electronic Device Failure Analysis Society proudly announces the Seventh Edition of the Microelectronics Failure Analysis Desk Reference, published by ASM International. The new edition will help engineers improve their ability to verify, isolate, uncover, and identify the root cause of failures. Prepared by a team of experts, this updated reference offers the latest information on advanced failure analysis tools and techniques, illustrated with numerous real-life examples. This book is geared to practicing engineers and for studies in the major area of power plant engineering. For non-metallurgists, a chapter has been devoted to the basics of material science, metallurgy of steels, heat treatment, and structure-property correlation. A chapter on materials for boiler tubes covers composition and application of different grades of steels and high temperature alloys currently in use as boiler tubes and future materials to be used in supercritical, ultra-supercritical and advanced ultra-supercritical thermal power plants. A comprehensive discussion on different mechanisms of boiler tube failure is the heart of the book. Additional chapters detailing the role of advanced material characterization techniques in failure investigation and the role of water chemistry in tube failures are key contributions to the book.

Electromagnetic Compatibility of Integrated Circuits

Electromagnetic Compatibility of Integrated Circuits
Author: Sonia Ben Dhia
Publisher: Springer Science & Business Media
Total Pages: 478
Release: 2006-06-04
Genre: Technology & Engineering
ISBN: 0387266011

Electromagnetic Compatibility of Integrated Circuits: Techniques for Low Emission and Susceptibility focuses on the electromagnetic compatibility of integrated circuits. The basic concepts, theory, and an extensive historical review of integrated circuit emission and susceptibility are provided. Standardized measurement methods are detailed through various case studies. EMC models for the core, I/Os, supply network, and packaging are described with applications to conducted switching noise, signal integrity, near-field and radiated noise. Case studies from different companies and research laboratories are presented with in-depth descriptions of the ICs, test set-ups, and comparisons between measurements and simulations. Specific guidelines for achieving low emission and susceptibility derived from the experience of EMC experts are presented.

Fault Diagnosis of Analog Integrated Circuits

Fault Diagnosis of Analog Integrated Circuits
Author: Prithviraj Kabisatpathy
Publisher: Springer Science & Business Media
Total Pages: 183
Release: 2006-01-13
Genre: Technology & Engineering
ISBN: 0387257438

Enables the reader to test an analog circuit that is implemented either in bipolar or MOS technology. Examines the testing and fault diagnosis of analog and analog part of mixed signal circuits. Covers the testing and fault diagnosis of both bipolar and Metal Oxide Semiconductor (MOS) circuits and introduces . Also contains problems that can be used as quiz or homework.

Counterfeit Integrated Circuits

Counterfeit Integrated Circuits
Author: Mark (Mohammad) Tehranipoor
Publisher: Springer
Total Pages: 282
Release: 2015-02-12
Genre: Technology & Engineering
ISBN: 3319118242

This timely and exhaustive study offers a much-needed examination of the scope and consequences of the electronic counterfeit trade. The authors describe a variety of shortcomings and vulnerabilities in the electronic component supply chain, which can result in counterfeit integrated circuits (ICs). Not only does this book provide an assessment of the current counterfeiting problems facing both the public and private sectors, it also offers practical, real-world solutions for combatting this substantial threat. · Helps beginners and practitioners in the field by providing a comprehensive background on the counterfeiting problem; · Presents innovative taxonomies for counterfeit types, test methods, and counterfeit defects, which allows for a detailed analysis of counterfeiting and its mitigation; · Provides step-by-step solutions for detecting different types of counterfeit ICs; · Offers pragmatic and practice-oriented, realistic solutions to counterfeit IC detection and avoidance, for industry and government.

Thermal Testing of Integrated Circuits

Thermal Testing of Integrated Circuits
Author: J. Altet
Publisher: Springer Science & Business Media
Total Pages: 212
Release: 2013-03-09
Genre: Technology & Engineering
ISBN: 1475736355

Temperature has been always considered as an appreciable magnitude to detect failures in electric systems. In this book, the authors present the feasibility of considering temperature as an observable for testing purposes, with full coverage of the state of the art.