Symposium On Solder
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Symposium on Solder, Presented at the Fifty-ninth Annual Meeting American Society for Testing Materials, Atlantic City, N.J., June 19-20, 1956
| Author | : American Society for Testing Materials |
| Publisher | : |
| Total Pages | : 200 |
| Release | : 1957 |
| Genre | : Solder and soldering |
| ISBN | : |
ISTFA 2019: Proceedings of the 45th International Symposium for Testing and Failure Analysis
| Author | : ASM International |
| Publisher | : ASM International |
| Total Pages | : 540 |
| Release | : 2019-12-01 |
| Genre | : Technology & Engineering |
| ISBN | : 1627082735 |
The theme for the 2019 conference is Novel Computing Architectures. Papers will include discussions on the advent of Artificial Intelligence and the promise of quantum computing that are driving disruptive computing architectures; Neuromorphic chip designs on one hand, and Quantum Bits on the other, still in R&D, will introduce new computing circuitry and memory elements, novel materials, and different test methodologies. These novel computing architectures will require further innovation which is best achieved through a collaborative Failure Analysis community composed of chip manufacturers, tool vendors, and universities.
Thirty-fourth International Symposium for Testing and Failure Analysis
| Author | : ASM International |
| Publisher | : ASM International |
| Total Pages | : 551 |
| Release | : 2008-01-01 |
| Genre | : Electronic apparatus and appliances |
| ISBN | : 1615030913 |
Proceedings of the Eighth Asia International Symposium on Mechatronics
| Author | : Baoyan Duan |
| Publisher | : Springer Nature |
| Total Pages | : 2195 |
| Release | : 2022-07-12 |
| Genre | : Technology & Engineering |
| ISBN | : 9811913099 |
The book presents high-quality papers from the Eighth Asia International Symposium on Mechatronics (AISM 2021). It discusses the latest technological trends and advances in electromechanical coupling and environmental adaptability design of electronic equipment, sensing and measurement, mechatronics in manufacturing and automations, energy harvesting & storage, robotics, automation and control systems. It includes papers based on original theoretical, practical and experimental simulations, development, applications, measurements, and testing. The applications and solutions discussed in the book provide excellent reference material for future product development.
Proceedings of the Green Materials and Electronic Packaging Interconnect Technology Symposium
| Author | : Mohd Arif Anuar Mohd Salleh |
| Publisher | : Springer Nature |
| Total Pages | : 873 |
| Release | : 2023-07-02 |
| Genre | : Science |
| ISBN | : 9811992673 |
This book presents peer reviewed articles from the Green Materials and Electronic Packaging Interconnect Technology Symposium, (EPITS 2022), held in Langkawi, Malaysia on 14th and 15th of Sept, 2022. It brings together packaging experts to share and exchange ideas in electronics technology. Topics covered in this volume include, but are not limited to; (1) Green materials and technology, (2) Emerging interconnect materials and technologies,(3) Non-solder interconnect materials at chip and package levels, (4) Fundamental materials behavior for electronic packaging materials, (5) Advanced characterization methods as applied to electronic packaging technology, (6) Developments in high temperature Pb-free solders and associated interconnects for automotive and power electronics, (7) Surface coating materials & (8) Advanced materials.
Lead-Free Electronic Solders
| Author | : KV Subramanian |
| Publisher | : Springer Science & Business Media |
| Total Pages | : 370 |
| Release | : 2007-06-28 |
| Genre | : Technology & Engineering |
| ISBN | : 0387484337 |
Even though the effect of lead contamination on human health has been known for decades, very little attention has been paid to lead-based solders used in electronics until recently. This comprehensive book examines all the important issues associated with lead-free electronic solder. It collects the work of researchers recognized for their significant scientific contributions in the area.
ISTFA 2018: Proceedings from the 44th International Symposium for Testing and Failure Analysis
| Author | : ASM International |
| Publisher | : ASM International |
| Total Pages | : 593 |
| Release | : 2018-12-01 |
| Genre | : Technology & Engineering |
| ISBN | : 1627080996 |
The International Symposium for Testing and Failure Analysis (ISTFA) 2018 is co-located with the International Test Conference (ITC) 2018, October 28 to November 1, in Phoenix, Arizona, USA at the Phoenix Convention Center. The theme for the November 2018 conference is "Failures Worth Analyzing." While technology advances fast and the market demands the latest and the greatest, successful companies strive to stay competitive and remain profitable.
Proceedings of the ... IEEE International Symposium on Electronics and the Environment
| Author | : |
| Publisher | : |
| Total Pages | : 348 |
| Release | : 1996 |
| Genre | : Electronic apparatus and appliances |
| ISBN | : |
Principles of Soldering
| Author | : Giles Humpston |
| Publisher | : ASM International |
| Total Pages | : 284 |
| Release | : 2004 |
| Genre | : Technology & Engineering |
| ISBN | : 1615031707 |
