Interlayer Dielectrics for Semiconductor Technologies

Interlayer Dielectrics for Semiconductor Technologies
Author: Shyam P Muraka
Publisher: Elsevier
Total Pages: 459
Release: 2003-10-13
Genre: Science
ISBN: 0080521959

Semiconductor technologies are moving at such a fast pace that new materials are needed in all types of application. Manipulating the materials and their properties at atomic dimensions has become a must. This book presents the case of interlayer dielectrics materials whilst considering these challenges. Interlayer Dielectrics for Semiconductor Technologies cover the science, properties and applications of dielectrics, their preparation, patterning, reliability and characterisation, followed by the discussion of different materials including those with high dielctric constants and those useful for waveguide applications in optical communications on the chip and the package.* Brings together for the FIRST time the science and technology of interlayer deilectrics materials, in one volume* written by renowned experts in the field* Provides an up-to-date starting point in this young research field.

Acrylates: Advances in Research and Application: 2011 Edition

Acrylates: Advances in Research and Application: 2011 Edition
Author:
Publisher: ScholarlyEditions
Total Pages: 284
Release: 2012-01-09
Genre: Technology & Engineering
ISBN: 1464922888

Acrylates: Advances in Research and Application: 2011 Edition is a ScholarlyEditions™ eBook that delivers timely, authoritative, and comprehensive information about Acrylates. The editors have built Acrylates: Advances in Research and Application: 2011 Edition on the vast information databases of ScholarlyNews.™ You can expect the information about Acrylates in this eBook to be deeper than what you can access anywhere else, as well as consistently reliable, authoritative, informed, and relevant. The content of Acrylates: Advances in Research and Application: 2011 Edition has been produced by the world’s leading scientists, engineers, analysts, research institutions, and companies. All of the content is from peer-reviewed sources, and all of it is written, assembled, and edited by the editors at ScholarlyEditions™ and available exclusively from us. You now have a source you can cite with authority, confidence, and credibility. More information is available at http://www.ScholarlyEditions.com/.

Metallization of Polymers 2

Metallization of Polymers 2
Author: Edward Sacher
Publisher: Springer Science & Business Media
Total Pages: 224
Release: 2002-09-30
Genre: Science
ISBN: 9780306472534

As the demands put on the polymer/metal interface, particularly by the microelectronics industry, become more and more severe, the necessity for understanding this interface, its properties and its limitations, becomes more and more essential. This requires a broad knowledge of, and a familiarity with, the latest findings in this rapidly advancing field. At the very least, such familiarity requires an exchange of infonnation, particularly among those intimately involved in this field. Communications among many of us in this area have made one fact quite obvious: the facilities provided by existing organizations, scientific and otherwise, do not offer the forum necessary to accomplish this exchange of infonnation. It was for this reason that Jean-Jacques Pireaux, Steven Kowalczyk and I organized the first Metallization of Polymers, a symposium sponsored by the American Chemical Society, which took place in Montreal, September 25-28, 1989; the Proceedings from that symposium were published as ACS Symposium Series 440, (1990). It is this same per ceived lack of a proper forum, and the encouragement of my colleagues, that prompted me to organize this meeting, so as to bring to the attention of the participants new instruments, materials, methods, advances, and, particularly, thoughts in the field of polymer metalliza tion. The meeting was designed as a workshop, with time being made available throughout for discussion and for the consideration of new findings.

Low Dielectric Constant Materials for IC Applications

Low Dielectric Constant Materials for IC Applications
Author: Paul S. Ho
Publisher: Springer Science & Business Media
Total Pages: 323
Release: 2012-12-06
Genre: Technology & Engineering
ISBN: 3642559085

Low dielectric constant materials are an important component of microelectronic devices. This comprehensive book covers the latest low-dielectric-constant (low-k) materials technology, thin film materials characterization, integration and reliability for back-end interconnects and packaging applications in microelectronics. Highly informative contributions from leading academic and industrial laboratories provide comprehensive information about materials technologies for

Handbook of Semiconductor Manufacturing Technology

Handbook of Semiconductor Manufacturing Technology
Author: Yoshio Nishi
Publisher: CRC Press
Total Pages: 1186
Release: 2000-08-09
Genre: Technology & Engineering
ISBN: 9780824787837

The Handbook of Semiconductor Manufacturing Technology describes the individual processes and manufacturing control, support, and infrastructure technologies of silicon-based integrated-circuit manufacturing, many of which are also applicable for building devices on other semiconductor substrates. Discussing ion implantation, rapid thermal processing, photomask fabrication, chip testing, and plasma etching, the editors explore current and anticipated equipment, devices, materials, and practices of silicon-based manufacturing. The book includes a foreword by Jack S. Kilby, cowinner of the Nobel Prize in Physics 2000 "for his part in the invention of the integrated circuit."

Dielectric Films for Advanced Microelectronics

Dielectric Films for Advanced Microelectronics
Author: Mikhail Baklanov
Publisher: John Wiley & Sons
Total Pages: 508
Release: 2007-04-04
Genre: Technology & Engineering
ISBN: 0470065419

The topic of thin films is an area of increasing importance in materials science, electrical engineering and applied solid state physics; with both research and industrial applications in microelectronics, computer manufacturing, and physical devices. Advanced, high-performance computers, high-definition TV, broadband imaging systems, flat-panel displays, robotic systems, and medical electronics and diagnostics are a few examples of the miniaturized device technologies that depend on the utilization of thin film materials. This book presents an in-depth overview of the novel developments made by the scientific leaders in the area of modern dielectric films for advanced microelectronic applications. It contains clear, concise explanations of material science of dielectric films and their problem for device operation, including high-k, low-k, medium-k dielectric films and also specific features and requirements for dielectric films used in the packaging technology. A broad range of related topics are covered, from physical principles to design, fabrication, characterization, and applications of novel dielectric films.

Advanced Nanoscale ULSI Interconnects: Fundamentals and Applications

Advanced Nanoscale ULSI Interconnects: Fundamentals and Applications
Author: Yosi Shacham-Diamand
Publisher: Springer Science & Business Media
Total Pages: 545
Release: 2009-09-19
Genre: Science
ISBN: 0387958681

In Advanced ULSI interconnects – fundamentals and applications we bring a comprehensive description of copper-based interconnect technology for ultra-lar- scale integration (ULSI) technology for integrated circuit (IC) application. In- grated circuit technology is the base for all modern electronics systems. You can ?nd electronics systems today everywhere: from toys and home appliances to a- planes and space shuttles. Electronics systems form the hardware that together with software are the bases of the modern information society. The rapid growth and vast exploitation of modern electronics system create a strong demand for new and improved electronic circuits as demonstrated by the amazing progress in the ?eld of ULSI technology. This progress is well described by the famous “Moore’s law” which states, in its most general form, that all the metrics that describe integrated circuit performance (e. g. , speed, number of devices, chip area) improve expon- tially as a function of time. For example, the number of components per chip d- bles every 18 months and the critical dimension on a chip has shrunk by 50% every 2 years on average in the last 30 years. This rapid growth in integrated circuits te- nology results in highly complex integrated circuits with an increasing number of interconnects on chips and between the chip and its package. The complexity of the interconnect network on chips involves an increasing number of metal lines per interconnect level, more interconnect levels, and at the same time a reduction in the interconnect line critical dimensions.

Sol-Gel Science

Sol-Gel Science
Author: C. Jeffrey Brinker
Publisher: Academic Press
Total Pages: 925
Release: 2013-10-22
Genre: Technology & Engineering
ISBN: 0080571034

Sol-Gel Science: The Physics and Chemistry of Sol-Gel Processing presents the physical and chemical principles of the sol-gel process. The book emphasizes the science behind sol-gel processing with a chapter devoted to applications. The first chapter introduces basic terminology, provides a brief historical sketch, and identifies some excellent texts for background reading. Chapters 2 and 3 discuss the mechanisms of hydrolysis and condensation for nonsilicate and silicate systems. Chapter 4 deals with stabilization and gelation of sols. Chapter 5 reviews theories of gelation and examines the predicted and observed changes in the properties of a sol in the vicinity of the gel point. Chapter 6 describes the changes in structure and properties that occur during aging of a gel in its pore liquor (or some other liquid). The discussion of drying is divided into two parts, with the theory concentrated in Chapter 7 and the phenomenology in Chapter 8. The structure of dried gels is explored in Chapter 9. Chapter 10 shows the possibility of using the gel as a substrate for chemical reactions or of modifying the bulk composition of the resulting ceramic by performing a surface reaction (such as nitridation) on the gel. Chapter 11 reviews the theory and practice of sintering, describing the mechanisms that govern densification of amorphous and crystalline materials, and showing the advantages of avoiding crystallization before sintering is complete. The properties of gel-derived and conventional ceramics are discussed in Chapter 12. The preparation of films is such an important aspect of sol-gel technology that the fundamentals of film formation are treated at length in Chapter 13. Films and other applications are briefly reviewed in Chapter 14. Materials scientists and researchers in the field of sol-gel processing will find the book invaluable.