Sputtered Thin Films
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Author | : Jaydeep Sarkar |
Publisher | : William Andrew |
Total Pages | : 614 |
Release | : 2010-12-13 |
Genre | : Technology & Engineering |
ISBN | : 0815519877 |
An important resource for students, engineers and researchers working in the area of thin film deposition using physical vapor deposition (e.g. sputtering) for semiconductor, liquid crystal displays, high density recording media and photovoltaic device (e.g. thin film solar cell) manufacturing. This book also reviews microelectronics industry topics such as history of inventions and technology trends, recent developments in sputtering technologies, manufacturing steps that require sputtering of thin films, the properties of thin films and the role of sputtering target performance on overall productivity of various processes. Two unique chapters of this book deal with productivity and troubleshooting issues. The content of the book has been divided into two sections: (a) the first section (Chapter 1 to Chapter 3) has been prepared for the readers from a range of disciplines (e.g. electrical, chemical, chemistry, physics) trying to get an insight into use of sputtered films in various devices (e.g. semiconductor, display, photovoltaic, data storage), basic of sputtering and performance of sputtering target in relation to productivity, and (b) the second section (Chapter 4 to Chapter 8) has been prepared for readers who already have background knowledge of sputter deposition of thin films, materials science principles and interested in the details of sputtering target manufacturing methods, sputtering behavior and thin film properties specific to semiconductor, liquid crystal display, photovoltaic and magnetic data storage applications. In Chapters 5 to 8, a general structure has been used, i.e. a description of the applications of sputtered thin films, sputtering target manufacturing methods (including flow charts), sputtering behavior of targets (e.g. current - voltage relationship, deposition rate) and thin film properties (e.g. microstructure, stresses, electrical properties, in-film particles). While discussing these topics, attempts have been made to include examples from the actual commercial processes to highlight the increased complexity of the commercial processes with the growth of advanced technologies. In addition to personnel working in industry setting, university researchers with advanced knowledge of sputtering would also find discussion of such topics (e.g. attributes of target design, chamber design, target microstructure, sputter surface characteristics, various troubleshooting issues) useful. . - Unique coverage of sputtering target manufacturing methods in the light of semiconductor, displays, data storage and photovoltaic industry requirements - Practical information on technology trends, role of sputtering and major OEMs - Discussion on properties of a wide variety of thin films which include silicides, conductors, diffusion barriers, transparent conducting oxides, magnetic films etc. - Practical case-studies on target performance and troubleshooting - Essential technological information for students, engineers and scientists working in the semiconductor, display, data storage and photovoltaic industry
Author | : Y. Pauleau |
Publisher | : Springer Science & Business Media |
Total Pages | : 372 |
Release | : 2012-12-06 |
Genre | : Technology & Engineering |
ISBN | : 940100353X |
An up-to-date collection of tutorial papers on the latest advances in the deposition and growth of thin films for micro and nano technologies. The emphasis is on fundamental aspects, principles and applications of deposition techniques used for the fabrication of micro and nano devices. The deposition of thin films is described, emphasising the gas phase and surface chemistry and its effects on the growth rates and properties of films. Gas-phase phenomena, surface chemistry, growth mechanisms and the modelling of deposition processes are thoroughly described and discussed to provide a clear understanding of the growth of thin films and microstructures via thermally activated, laser induced, photon assisted, ion beam assisted, and plasma enhanced vapour deposition processes. A handbook for engineers and scientists and an introduction for students of microelectronics.
Author | : Diederik Depla |
Publisher | : Springer Science & Business Media |
Total Pages | : 584 |
Release | : 2008-06-24 |
Genre | : Technology & Engineering |
ISBN | : 3540766642 |
In this valuable work, all aspects of the reactive magnetron sputtering process, from the discharge up to the resulting thin film growth, are described in detail, allowing the reader to understand the complete process. Hence, this book gives necessary information for those who want to start with reactive magnetron sputtering, understand and investigate the technique, control their sputtering process and tune their existing process, obtaining the desired thin films.
Author | : Daniel Lundin |
Publisher | : Elsevier |
Total Pages | : 398 |
Release | : 2019-08-30 |
Genre | : Technology & Engineering |
ISBN | : 0128124547 |
High Power Impulse Magnetron Sputtering: Fundamentals, Technologies, Challenges and Applications is an in-depth introduction to HiPIMS that emphasizes how this novel sputtering technique differs from conventional magnetron processes in terms of both discharge physics and the resulting thin film characteristics. Ionization of sputtered atoms is discussed in detail for various target materials. In addition, the role of self-sputtering, secondary electron emission and the importance of controlling the process gas dynamics, both inert and reactive gases, are examined in detail with an aim to generate stable HiPIMS processes. Lastly, the book also looks at how to characterize the HiPIMS discharge, including essential diagnostic equipment. Experimental results and simulations based on industrially relevant material systems are used to illustrate mechanisms controlling nucleation kinetics, column formation and microstructure evolution.
Author | : Kiyotaka Wasa |
Publisher | : William Andrew |
Total Pages | : 657 |
Release | : 2012-12-31 |
Genre | : Technology & Engineering |
ISBN | : 1437734847 |
This thoroughly updated new edition includes an entirely new team of contributing authors with backgrounds specializing in the various new applications of sputtering technology. It forms a bridge between fundamental theory and practical application, giving an insight into innovative new materials, devices and systems. Organized into three parts for ease of use, this Handbook introduces the fundamentals of thin films and sputtering deposition, explores the theory and practices of this field, and also covers new technology such as nano-functional materials and MEMS. Wide varieties of functional thin film materials and processing are described, and experimental data is provided with detailed examples and theoretical descriptions. - A strong applications focus, covering current and emerging technologies, including nano-materials and MEMS (microelectrolmechanical systems) for energy, environments, communications, and/or bio-medical field. New chapters on computer simulation of sputtering and MEMS completes the update and insures that the new edition includes the most current and forward-looking coverage available - All applications discussed are supported by theoretical discussions, offering readers both the "how" and the "why" of each technique - 40% revision: the new edition includes an entirely new team of contributing authors with backgrounds specializing in the various new applications that are covered in the book and providing the most up-to-date coverage available anywhere
Author | : R.D. McConnell |
Publisher | : Springer Science & Business Media |
Total Pages | : 601 |
Release | : 2012-12-06 |
Genre | : Science |
ISBN | : 1468413457 |
This conference is the second on the Science and Technology of Thin Film Superconductors. It proved to be an excellent forum for these specialists in thin film superconductivity. The conference, held April 30-May 4, 1990, in Denver, Colorado, hosted 170 researchers from 17 countries. The response to the conference again emphasized the need for a meeting devoted to the science and technology of thin film superconductors. The breadth of artic1es and advances made in this technology since the first conference in November 1988, reflect on the maturity of the topic. These proceedings contain artic1es on deposition methods by sputtering, e1ectron beam evaporation, resistive evaporation, laser ablation, chemical vapor deposition and electrodeposition, and on other studies related to substrates, thermodynamics of formation, grain boundaries and weak links, characterization, and some practical applications. The program committee was pleased with the quality of the publications and contributed articles. This conference was highlighted by a fuU day dedicated to presentations from the federallaboratories, discussing a wide range of topics on the fabrication, characterization, and theory of high-temperature superconductor thin films. Other highlights at the conference dealt with (1) critical parameters or problems in measuring critical current density and other important parameters, and (2) problems of scale-up, reproducibility, and amenability to device fabrication. It became evident from the presentations that three issues were developing into critical issues for the ultimate practical application of high temperature superconductor thin films.
Author | : Werner Kern |
Publisher | : Elsevier |
Total Pages | : 881 |
Release | : 2012-12-02 |
Genre | : Technology & Engineering |
ISBN | : 0080524214 |
This sequel to the 1978 classic, Thin Film Processes, gives a clear, practical exposition of important thin film deposition and etching processes that have not yet been adequately reviewed. It discusses selected processes in tutorial overviews with implementation guide lines and an introduction to the literature. Though edited to stand alone, when taken together, Thin Film Processes II and its predecessor present a thorough grounding in modern thin film techniques. - Provides an all-new sequel to the 1978 classic, Thin Film Processes - Introduces new topics, and several key topics presented in the original volume are updated - Emphasizes practical applications of major thin film deposition and etching processes - Helps readers find the appropriate technology for a particular application
Author | : D. M. Mattox |
Publisher | : Cambridge University Press |
Total Pages | : 947 |
Release | : 2014-09-19 |
Genre | : Technology & Engineering |
ISBN | : 0080946585 |
This book covers all aspects of physical vapor deposition (PVD) process technology from the characterizing and preparing the substrate material, through deposition processing and film characterization, to post-deposition processing. The emphasis of the book is on the aspects of the process flow that are critical to economical deposition of films that can meet the required performance specifications. The book covers subjects seldom treated in the literature: substrate characterization, adhesion, cleaning and the processing. The book also covers the widely discussed subjects of vacuum technology and the fundamentals of individual deposition processes. However, the author uniquely relates these topics to the practical issues that arise in PVD processing, such as contamination control and film growth effects, which are also rarely discussed in the literature. In bringing these subjects together in one book, the reader can understand the interrelationship between various aspects of the film deposition processing and the resulting film properties. The author draws upon his long experience with developing PVD processes and troubleshooting the processes in the manufacturing environment, to provide useful hints for not only avoiding problems, but also for solving problems when they arise. He uses actual experiences, called ""war stories"", to emphasize certain points. Special formatting of the text allows a reader who is already knowledgeable in the subject to scan through a section and find discussions that are of particular interest. The author has tried to make the subject index as useful as possible so that the reader can rapidly go to sections of particular interest. Extensive references allow the reader to pursue subjects in greater detail if desired. The book is intended to be both an introduction for those who are new to the field and a valuable resource to those already in the field. The discussion of transferring technology between R&D and manufacturing provided in Appendix 1, will be of special interest to the manager or engineer responsible for moving a PVD product and process from R&D into production. Appendix 2 has an extensive listing of periodical publications and professional societies that relate to PVD processing. The extensive Glossary of Terms and Acronyms provided in Appendix 3 will be of particular use to students and to those not fully conversant with the terminology of PVD processing or with the English language.
Author | : L. B. Freund |
Publisher | : Cambridge University Press |
Total Pages | : 772 |
Release | : 2004-01-08 |
Genre | : Technology & Engineering |
ISBN | : 9781139449823 |
Thin film mechanical behavior and stress presents a technological challenge for materials scientists, physicists and engineers. This book provides a comprehensive coverage of the major issues and topics dealing with stress, defect formation, surface evolution and allied effects in thin film materials. Physical phenomena are examined from the continuum down to the sub-microscopic length scales, with the connections between the structure of the material and its behavior described. Theoretical concepts are underpinned by discussions on experimental methodology and observations. Fundamental scientific concepts are embedded through sample calculations, a broad range of case studies with practical applications, thorough referencing, and end of chapter problems. With solutions to problems available on-line, this book will be essential for graduate courses on thin films and the classic reference for researchers in the field.
Author | : Donald M. Mattox |
Publisher | : William Andrew |
Total Pages | : 383 |
Release | : 2018-08-21 |
Genre | : Technology & Engineering |
ISBN | : 0128130857 |
The Foundations of Vacuum Coating Technology, Second Edition, is a revised and expanded version of the first edition, which was published in 2003. The book reviews the histories of the various vacuum coating technologies and expands on the history of the enabling technologies of vacuum technology, plasma technology, power supplies, and low-pressure plasma-enhanced chemical vapor deposition. The melding of these technologies has resulted in new processes and products that have greatly expanded the application of vacuum coatings for use in our everyday lives. The book is unique in that it makes extensive reference to the patent literature (mostly US) and how it relates to the history of vacuum coating. The book includes a Historical Timeline of Vacuum Coating Technology and a Historical Timeline of Vacuum/Plasma Technology, as well as a Glossary of Terms used in the vacuum coating and surface engineering industries. - History and detailed descriptions of Vacuum Deposition Technologies - Review of Enabling Technologies and their importance to current applications - Extensively referenced text - Patents are referenced as part of the history - Historical Timelines for Vacuum Coating Technology and Vacuum/Plasma Technology - Glossary of Terms for vacuum coating