Index of Conference Proceedings
Author | : British Library. Document Supply Centre |
Publisher | : |
Total Pages | : 870 |
Release | : 2003 |
Genre | : Conference proceedings |
ISBN | : |
Download Special Issue On 1999 International Conference On Simulation Of Semiconductor Processes And Devices Sispad 99 full books in PDF, epub, and Kindle. Read online free Special Issue On 1999 International Conference On Simulation Of Semiconductor Processes And Devices Sispad 99 ebook anywhere anytime directly on your device. Fast Download speed and no annoying ads. We cannot guarantee that every ebooks is available!
Author | : British Library. Document Supply Centre |
Publisher | : |
Total Pages | : 870 |
Release | : 2003 |
Genre | : Conference proceedings |
ISBN | : |
Author | : Massimo Rudan |
Publisher | : Springer |
Total Pages | : 936 |
Release | : 2017-09-27 |
Genre | : Technology & Engineering |
ISBN | : 3319631543 |
This textbook describes the basic physics of semiconductors, including the hierarchy of transport models, and connects the theory with the functioning of actual semiconductor devices. Details are worked out carefully and derived from the basic physical concepts, while keeping the internal coherence of the analysis and explaining the different levels of approximation. Coverage includes the main steps used in the fabrication process of integrated circuits: diffusion, thermal oxidation, epitaxy, and ion implantation. Examples are based on silicon due to its industrial importance. Several chapters are included that provide the reader with the quantum-mechanical concepts necessary for understanding the transport properties of crystals. The behavior of crystals incorporating a position-dependent impurity distribution is described, and the different hierarchical transport models for semiconductor devices are derived (from the Boltzmann transport equation to the hydrodynamic and drift-diffusion models). The transport models are then applied to a detailed description of the main semiconductor-device architectures (bipolar, MOS, CMOS), including a number of solid-state sensors. The final chapters are devoted to the measuring methods for semiconductor-device parameters, and to a brief illustration of the scaling rules and numerical methods applied to the design of semiconductor devices.
Author | : David Esseni |
Publisher | : Cambridge University Press |
Total Pages | : 489 |
Release | : 2011-01-20 |
Genre | : Technology & Engineering |
ISBN | : 1139494384 |
Written from an engineering standpoint, this book provides the theoretical background and physical insight needed to understand new and future developments in the modeling and design of n- and p-MOS nanoscale transistors. A wealth of applications, illustrations and examples connect the methods described to all the latest issues in nanoscale MOSFET design. Key areas covered include: • Transport in arbitrary crystal orientations and strain conditions, and new channel and gate stack materials • All the relevant transport regimes, ranging from low field mobility to quasi-ballistic transport, described using a single modeling framework • Predictive capabilities of device models, discussed with systematic comparisons to experimental results
Author | : Ed Bowker Staff |
Publisher | : R. R. Bowker |
Total Pages | : 3274 |
Release | : 2004 |
Genre | : Reference |
ISBN | : 9780835246422 |
Author | : Jean-Pierre Colinge |
Publisher | : Cambridge University Press |
Total Pages | : 269 |
Release | : 2016-04-21 |
Genre | : Science |
ISBN | : 1107052408 |
A self-contained and up-to-date account of the current developments in the physics and technology of nanowire semiconductor devices.
Author | : Marin Alexe |
Publisher | : Springer Science & Business Media |
Total Pages | : 524 |
Release | : 2004-05-14 |
Genre | : Science |
ISBN | : 9783540210498 |
During the past decade direct wafer bonding has developed into a mature materials integration technology. This book presents state-of-the-art reviews of the most important applications of wafer bonding written by experts from industry and academia. The topics include bonding-based fabrication methods of silicon-on-insulator, photonic crystals, VCSELs, SiGe-based FETs, MEMS together with hybrid integration and laser lift-off. The non-specialist will learn about the basics of wafer bonding and its various application areas, while the researcher in the field will find up-to-date information about this fast-moving area, including relevant patent information.
Author | : Frank Schwierz |
Publisher | : Wiley-Interscience |
Total Pages | : 510 |
Release | : 2003 |
Genre | : Technology & Engineering |
ISBN | : |
Comprehensive and up-to-date coverage of currently used transistors for commercial and military applications. Authors are recognized experts with previous publications. Updated descriptions of state-of-the-art devices available on Wiley Web site.