Logistik Management

Logistik Management
Author: Stefan Voß
Publisher: Springer Science & Business Media
Total Pages: 482
Release: 2009-08-21
Genre: Business & Economics
ISBN: 3790823619

Die Globalisierung und Virtualisierung von Geschäftsbeziehungen vergrößert die Bedeutung und die Komplexität logistischer Herausforderungen. Das Management logistischer Netzwerke wird zu einem wesentlichen Wettbewerbsfaktor für Unternehmen. Das Buch wie die gleichnamige Tagung (September 2009) haben zum Ziel, den internationalen Gedankenaustausch und die Diskussion zwischen Wissenschaft und Praxis gezielt zu fördern, damit Strategien, Methoden und Werkzeuge entwickelt werden können, die es ermöglichen, den wachsenden Anforderungen gerecht zu werden.

Modeling and Application of Flexible Electronics Packaging

Modeling and Application of Flexible Electronics Packaging
Author: YongAn Huang
Publisher: Springer
Total Pages: 297
Release: 2019-04-23
Genre: Technology & Engineering
ISBN: 981133627X

This book systematically discusses the modeling and application of transfer manipulation for flexible electronics packaging, presenting multiple processes according to the geometric sizes of the chips and devices as well as the detailed modeling and computation steps for each process. It also illustrates the experimental design of the equipment to help readers easily learn how to use it. This book is a valuable resource for scholars and graduate students in the research field of microelectronics.

Product Design for the Environment

Product Design for the Environment
Author: Fabio Giudice
Publisher: CRC Press
Total Pages: 517
Release: 2006-01-13
Genre: Science
ISBN: 1420001043

In recent years the increased awareness of environmental issues has led to the development of new approaches to product design, known as Design for Environment and Life Cycle Design. Although still considered emerging and in some cases radical, their principles will become, by necessity, the wave of the future in design. A thorough exploration of t

Electrical Conductive Adhesives with Nanotechnologies

Electrical Conductive Adhesives with Nanotechnologies
Author: Yi (Grace) Li
Publisher: Springer Science & Business Media
Total Pages: 445
Release: 2009-10-08
Genre: Technology & Engineering
ISBN: 0387887830

“Electrical Conductive Adhesives with Nanotechnologies” begins with an overview of electronic packaging and discusses the various adhesives options currently available, including lead-free solder and ECAs (Electrically Conductive Adhesives). The material presented focuses on the three ECA categories specifically, Isotropically Conductive Adhesives (ICAs) Anisotropically Conductive Adhesives/Films (ACA/ACF) and Nonconductive Adhesives/Films (NCA/NCF). Discussing the advantages and limitations of each technique, and how each technique is currently applied. Lastly, a detailed presentation of how nano techniques can be applied to conductive adhesives is discussed, including recent research and development of nano component adhesives/nano component films, their electrical properties, thermal performance, bonding pressure and assembly and reliability.

Fan-Out Wafer-Level Packaging

Fan-Out Wafer-Level Packaging
Author: John H. Lau
Publisher: Springer
Total Pages: 319
Release: 2018-04-05
Genre: Technology & Engineering
ISBN: 9811088845

This comprehensive guide to fan-out wafer-level packaging (FOWLP) technology compares FOWLP with flip chip and fan-in wafer-level packaging. It presents the current knowledge on these key enabling technologies for FOWLP, and discusses several packaging technologies for future trends. The Taiwan Semiconductor Manufacturing Company (TSMC) employed their InFO (integrated fan-out) technology in A10, the application processor for Apple’s iPhone, in 2016, generating great excitement about FOWLP technology throughout the semiconductor packaging community. For many practicing engineers and managers, as well as scientists and researchers, essential details of FOWLP – such as the temporary bonding and de-bonding of the carrier on a reconstituted wafer/panel, epoxy molding compound (EMC) dispensing, compression molding, Cu revealing, RDL fabrication, solder ball mounting, etc. – are not well understood. Intended to help readers learn the basics of problem-solving methods and understand the trade-offs inherent in making system-level decisions quickly, this book serves as a valuable reference guide for all those faced with the challenging problems created by the ever-increasing interest in FOWLP, helps to remove roadblocks, and accelerates the design, materials, process, and manufacturing development of key enabling technologies for FOWLP.

3D Printing of Pharmaceuticals and Drug Delivery Devices

3D Printing of Pharmaceuticals and Drug Delivery Devices
Author: Dimitrios A. Lamprou
Publisher: MDPI
Total Pages: 436
Release: 2020-07-01
Genre: Medical
ISBN: 3039364235

The 3D printing (3DP) process was patented in 1986; however, only in the last decade has it begun to be used for medical applications, as well as in the fields of prosthetics, bio-fabrication, and pharmaceutical printing. 3DP or additive manufacturing (AM) is a family of technologies that implement layer-by-layer processes in order to fabricate physical models based on a computer aided design (CAD) model. 3D printing permits the fabrication of high degrees of complexity with great reproducibility in a fast and cost-effective fashion. 3DP technology offers a new paradigm for the direct manufacture of individual dosage forms and has the potential to allow for variations in size and geometry as well as control dose and release behavior. Furthermore, the low cost and ease of use of 3DP systems means that the possibility of manufacturing medicines and medical devices at the point of dispensing or at the point of use could become a reality. 3DP thus offers the perfect innovative manufacturing route to address the critical capability gap that hinders the widespread exploitation of personalized medicines for molecules that are currently not easy to deliver. This Special Issue will address new developments in the area of 3D printing and bioprinting for drug delivery applications, covering the recent advantages and future directions of additive manufacturing for pharmaceutical products.