Simulation Of Temperature
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| Author | : Konstantin Naumenko |
| Publisher | : Springer |
| Total Pages | : 381 |
| Release | : 2016-05-11 |
| Genre | : Science |
| ISBN | : 331931629X |
This monograph presents approaches to characterize inelastic behavior of materials and structures at high temperature. Starting from experimental observations, it discusses basic features of inelastic phenomena including creep, plasticity, relaxation, low cycle and thermal fatigue. The authors formulate constitutive equations to describe the inelastic response for the given states of stress and microstructure. They introduce evolution equations to capture hardening, recovery, softening, ageing and damage processes. Principles of continuum mechanics and thermodynamics are presented to provide a framework for the modeling materials behavior with the aim of structural analysis of high-temperature engineering components.
| Author | : Márta Rencz |
| Publisher | : MDPI |
| Total Pages | : 310 |
| Release | : 2021-01-12 |
| Genre | : Technology & Engineering |
| ISBN | : 303943831X |
This book, edited by Prof. Marta Rencz and Prof Andras Poppe, Budapest University of Technology and Economics, and by Prof. Lorenzo Codecasa, Politecnico di Milano, collects fourteen papers carefully selected for the “thermal and electro-thermal system simulation” Special Issue of Energies. These contributions present the latest results in a currently very “hot” topic in electronics: the thermal and electro-thermal simulation of electronic components and systems. Several papers here proposed have turned out to be extended versions of papers presented at THERMINIC 2019, which was one of the 2019 stages of choice for presenting outstanding contributions on thermal and electro-thermal simulation of electronic systems. The papers proposed to the thermal community in this book deal with modeling and simulation of state-of-the-art applications which are highly critical from the thermal point of view, and around which there is great research activity in both industry and academia. In particular, contributions are proposed on the multi-physics simulation of families of electronic packages, multi-physics advanced modeling in power electronics, multiphysics modeling and simulation of LEDs, batteries and other micro and nano-structures.
| Author | : Management Association, Information Resources |
| Publisher | : IGI Global |
| Total Pages | : 3095 |
| Release | : 2016-12-12 |
| Genre | : Computers |
| ISBN | : 152251760X |
Ongoing advancements in modern technology have led to significant developments in artificial intelligence. With the numerous applications available, it becomes imperative to conduct research and make further progress in this field. Artificial Intelligence: Concepts, Methodologies, Tools, and Applications provides a comprehensive overview of the latest breakthroughs and recent progress in artificial intelligence. Highlighting relevant technologies, uses, and techniques across various industries and settings, this publication is a pivotal reference source for researchers, professionals, academics, upper-level students, and practitioners interested in emerging perspectives in the field of artificial intelligence.
| Author | : J. J. Sartoris |
| Publisher | : |
| Total Pages | : 88 |
| Release | : 1978 |
| Genre | : Water temperature |
| ISBN | : |
| Author | : |
| Publisher | : BoD – Books on Demand |
| Total Pages | : 408 |
| Release | : 2019-09-11 |
| Genre | : Science |
| ISBN | : 1789844460 |
Heat and mass transfer is the core science for many industrial processes as well as technical and scientific devices. Automotive, aerospace, power generation (both by conventional and renewable energies), industrial equipment and rotating machinery, materials and chemical processing, and many other industries are requiring heat and mass transfer processes. Since the early studies in the seventeenth and eighteenth centuries, there has been tremendous technical progress and scientific advances in the knowledge of heat and mass transfer, where modeling and simulation developments are increasingly contributing to the current state of the art. Heat and Mass Transfer - Advances in Science and Technology Applications aims at providing researchers and practitioners with a valuable compendium of significant advances in the field.
| Author | : J. Thoma |
| Publisher | : Springer Science & Business Media |
| Total Pages | : 248 |
| Release | : 2000 |
| Genre | : Science |
| ISBN | : 9783540663881 |
The main object of this book is modeling and simulation of energetic processes by bond graphs. But even without knowledge of this powerful method it can be used to a certain extent as an introduction to simulation in thermodynamics. The book addresses advanced students, lecturers and researchers in mechanical engineering and automation as well as experienced engineers in process industries.
| Author | : S. M. Sohel Murshed |
| Publisher | : BoD – Books on Demand |
| Total Pages | : 274 |
| Release | : 2017-04-27 |
| Genre | : Technology & Engineering |
| ISBN | : 9535130935 |
Presenting contributions from renowned experts in the field, this book covers research and development in fundamental areas of heat exchangers, which include: design and theoretical development, experiments, numerical modeling and simulations. This book is intended to be a useful reference source and guide to researchers, postgraduate students, and engineers in the fields of heat exchangers, cooling, and thermal management.
| Author | : Jean-Michel Bergheau |
| Publisher | : Wiley-ISTE |
| Total Pages | : 296 |
| Release | : 2008-09-09 |
| Genre | : Mathematics |
| ISBN | : |
This book introduces the finite element method applied to the resolution of industrial heat transfer problems. Starting from steady conduction, the method is gradually extended to transient regimes, to traditional non-linearities, and to convective phenomena. Coupled problems involving heat transfer are then presented. Three types of couplings are discussed: coupling through boundary conditions (such as radiative heat transfer in cavities), addition of state variables (such as metallurgical phase change), and coupling through partial differential equations (such as electrical phenomena). A review of the various thermal phenomena is drawn up, which an engineer can simulate. The methods presented will enable the reader to achieve optimal use from finite element software and also to develop new applications.
| Author | : |
| Publisher | : |
| Total Pages | : 126 |
| Release | : 1970 |
| Genre | : Water temperature |
| ISBN | : |
| Author | : Heinz R. Trechsel |
| Publisher | : ASTM International |
| Total Pages | : 226 |
| Release | : 2001 |
| Genre | : Dampness in buildings |
| ISBN | : |
Annotation Contributors address typical moisture analysis methods and models and provide the technical background for understanding and applying moisture analysis. Chapters address weather data, hygrothermal properties of building materials, failure criteria, an overview of hygrothermal analysis methods (HAM), advanced numerical models for hygrothermal research, manual analysis tools, a numerical method for design, and a hygrothermal design tool for architects and engineers. Includes a glossary and instructions for using the CD-ROM, which includes two models of computer-based moisture analysis, as well as two programs to convert various properties of air. Annotation c. Book News, Inc., Portland, OR (booknews.com).
