Scanning Electron Microscope Examination of Wire Bonds from High-reliability Devices
Author | : Kathryn O. Leedy |
Publisher | : |
Total Pages | : 40 |
Release | : 1973 |
Genre | : Metal bonding |
ISBN | : |
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Author | : Kathryn O. Leedy |
Publisher | : |
Total Pages | : 40 |
Release | : 1973 |
Genre | : Metal bonding |
ISBN | : |
Author | : Kathryn O. Leedy |
Publisher | : |
Total Pages | : 40 |
Release | : 1973 |
Genre | : Metal bonding |
ISBN | : |
Author | : National Institute of Standards and Technology (U.S.) |
Publisher | : |
Total Pages | : 140 |
Release | : 1990 |
Genre | : Semiconductors |
ISBN | : |
Author | : United States. National Bureau of Standards |
Publisher | : |
Total Pages | : 48 |
Release | : 1979 |
Genre | : Integrated circuits |
ISBN | : |
Author | : United States. Superintendent of Documents |
Publisher | : |
Total Pages | : 1252 |
Release | : 1973 |
Genre | : Government publications |
ISBN | : |
February issue includes Appendix entitled Directory of United States Government periodicals and subscription publications; September issue includes List of depository libraries; June and December issues include semiannual index.
Author | : United States. Superintendent of Documents |
Publisher | : |
Total Pages | : 1408 |
Release | : 1976 |
Genre | : United States |
ISBN | : |