Robust Delay Fault Testing Using Effective Signal Integrity Aware Pattern Generation Methodologies
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A Coordinated Approach for Synthesis and Test Pattern Generation for Robust Path Delay Faults for PLAs
| Author | : Andrelina Coromoto Rodriguez Rojas |
| Publisher | : |
| Total Pages | : 132 |
| Release | : 1998 |
| Genre | : |
| ISBN | : |
High Quality Transition and Small Delay Fault ATPG
| Author | : |
| Publisher | : |
| Total Pages | : |
| Release | : 2004 |
| Genre | : |
| ISBN | : |
Path selection and generating tests for small delay faults is an important issue in the delay fault area. A novel technique for generating effective vectors for delay defects is the first issue that we have presented in the thesis. The test set achieves high path delay fault coverage to capture small-distributed delay defects and high transition fault coverage to capture gross delay defects. Furthermore, non-robust paths for ATPG are filtered (selected) carefully so that there is a minimum overlap with the already tested robust paths. A relationship between path delay fault model and transition fault model has been observed which helps us reduce the number of non-robust paths considered for test generation. To generate tests for robust and non-robust paths, a deterministic ATPG engine is developed. To deal with small delay faults, we have proposed a new transition fault model called As late As Possible Transition Fault (ALAPTF) Model. The model aims at detecting smaller delays, which will be missed by both the traditional transition fault model and the path delay model. The model makes sure that each transition is launched as late as possible at the fault site, accumulating the small delay defects along its way. Because some transition faults may require multiple paths to be launched, simple path-delay model will miss such faults.
Nanometer Technology Designs
| Author | : Nisar Ahmed |
| Publisher | : Springer Science & Business Media |
| Total Pages | : 288 |
| Release | : 2010-02-26 |
| Genre | : Technology & Engineering |
| ISBN | : 0387757287 |
Traditional at-speed test methods cannot guarantee high quality test results as they face many new challenges. Supply noise effects on chip performance, high test pattern volume, small delay defect test pattern generation, high cost of test implementation and application, and utilizing low-cost testers are among these challenges. This book discusses these challenges in detail and proposes new techniques and methodologies to improve the overall quality of the transition fault test.
Delay Fault Testing for VLSI Circuits
| Author | : Angela Krstic |
| Publisher | : Springer Science & Business Media |
| Total Pages | : 201 |
| Release | : 2012-12-06 |
| Genre | : Technology & Engineering |
| ISBN | : 1461555973 |
In the early days of digital design, we were concerned with the logical correctness of circuits. We knew that if we slowed down the clock signal sufficiently, the circuit would function correctly. With improvements in the semiconductor process technology, our expectations on speed have soared. A frequently asked question in the last decade has been how fast can the clock run. This puts significant demands on timing analysis and delay testing. Fueled by the above events, a tremendous growth has occurred in the research on delay testing. Recent work includes fault models, algorithms for test generation and fault simulation, and methods for design and synthesis for testability. The authors of this book, Angela Krstic and Tim Cheng, have personally contributed to this research. Now they do an even greater service to the profession by collecting the work of a large number of researchers. In addition to expounding such a great deal of information, they have delivered it with utmost clarity. To further the reader's understanding many key concepts are illustrated by simple examples. The basic ideas of delay testing have reached a level of maturity that makes them suitable for practice. In that sense, this book is the best x DELAY FAULT TESTING FOR VLSI CIRCUITS available guide for an engineer designing or testing VLSI systems. Tech niques for path delay testing and for use of slower test equipment to test high-speed circuits are of particular interest.
Robust Model-Based Fault Diagnosis for Dynamic Systems
| Author | : Jie Chen |
| Publisher | : Springer Science & Business Media |
| Total Pages | : 370 |
| Release | : 2012-12-06 |
| Genre | : Technology & Engineering |
| ISBN | : 1461551498 |
There is an increasing demand for dynamic systems to become more safe and reliable. This requirement extends beyond the normally accepted safety-critical systems of nuclear reactors and aircraft where safety is paramount important, to systems such as autonomous vehicles and fast railways where the system availability is vital. It is clear that fault diagnosis (including fault detection and isolation, FDI) has been becoming an important subject in modern control theory and practice. For example, the number of papers on FDI presented in many control-related conferences has been increasing steadily. The subject of fault detection and isolation continues to mature to an established field of research in control engineering. A large amount of knowledge on model-based fault diagnosis has been ac cumulated through the literature since the beginning of the 1970s. However, publications are scattered over many papers and a few edited books. Up to the end of 1997, there is no any book which presents the subject in an unified framework. The consequence of this is the lack of "common language", dif ferent researchers use different terminology. This problem has obstructed the progress of model-based FDI techniques and has been causing great concern in research community. Many survey papers have been published to tackle this problem. However, a book which presents the materials in a unified format and provides a comprehensive foundation of model-based FDI is urgently needed.
Dependable Embedded Systems
| Author | : Jörg Henkel |
| Publisher | : Springer Nature |
| Total Pages | : 606 |
| Release | : 2020-12-09 |
| Genre | : Technology & Engineering |
| ISBN | : 303052017X |
This Open Access book introduces readers to many new techniques for enhancing and optimizing reliability in embedded systems, which have emerged particularly within the last five years. This book introduces the most prominent reliability concerns from today’s points of view and roughly recapitulates the progress in the community so far. Unlike other books that focus on a single abstraction level such circuit level or system level alone, the focus of this book is to deal with the different reliability challenges across different levels starting from the physical level all the way to the system level (cross-layer approaches). The book aims at demonstrating how new hardware/software co-design solution can be proposed to ef-fectively mitigate reliability degradation such as transistor aging, processor variation, temperature effects, soft errors, etc. Provides readers with latest insights into novel, cross-layer methods and models with respect to dependability of embedded systems; Describes cross-layer approaches that can leverage reliability through techniques that are pro-actively designed with respect to techniques at other layers; Explains run-time adaptation and concepts/means of self-organization, in order to achieve error resiliency in complex, future many core systems.
Microelectronics Fialure Analysis Desk Reference, Seventh Edition
| Author | : Tejinder Gandhi |
| Publisher | : ASM International |
| Total Pages | : 750 |
| Release | : 2019-11-01 |
| Genre | : Technology & Engineering |
| ISBN | : 1627082468 |
The Electronic Device Failure Analysis Society proudly announces the Seventh Edition of the Microelectronics Failure Analysis Desk Reference, published by ASM International. The new edition will help engineers improve their ability to verify, isolate, uncover, and identify the root cause of failures. Prepared by a team of experts, this updated reference offers the latest information on advanced failure analysis tools and techniques, illustrated with numerous real-life examples. This book is geared to practicing engineers and for studies in the major area of power plant engineering. For non-metallurgists, a chapter has been devoted to the basics of material science, metallurgy of steels, heat treatment, and structure-property correlation. A chapter on materials for boiler tubes covers composition and application of different grades of steels and high temperature alloys currently in use as boiler tubes and future materials to be used in supercritical, ultra-supercritical and advanced ultra-supercritical thermal power plants. A comprehensive discussion on different mechanisms of boiler tube failure is the heart of the book. Additional chapters detailing the role of advanced material characterization techniques in failure investigation and the role of water chemistry in tube failures are key contributions to the book.
