Process Variations And Probabilistic Integrated Circuit Design
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| Author | : Manfred Dietrich |
| Publisher | : Springer Science & Business Media |
| Total Pages | : 261 |
| Release | : 2011-11-20 |
| Genre | : Technology & Engineering |
| ISBN | : 1441966218 |
Uncertainty in key parameters within a chip and between different chips in the deep sub micron area plays a more and more important role. As a result, manufacturing process spreads need to be considered during the design process. Quantitative methodology is needed to ensure faultless functionality, despite existing process variations within given bounds, during product development. This book presents the technological, physical, and mathematical fundamentals for a design paradigm shift, from a deterministic process to a probability-orientated design process for microelectronic circuits. Readers will learn to evaluate the different sources of variations in the design flow in order to establish different design variants, while applying appropriate methods and tools to evaluate and optimize their design.
| Author | : Vasilis F. Pavlidis |
| Publisher | : Newnes |
| Total Pages | : 770 |
| Release | : 2017-07-04 |
| Genre | : Technology & Engineering |
| ISBN | : 0124104843 |
Three-Dimensional Integrated Circuit Design, Second Eition, expands the original with more than twice as much new content, adding the latest developments in circuit models, temperature considerations, power management, memory issues, and heterogeneous integration. 3-D IC experts Pavlidis, Savidis, and Friedman cover the full product development cycle throughout the book, emphasizing not only physical design, but also algorithms and system-level considerations to increase speed while conserving energy. A handy, comprehensive reference or a practical design guide, this book provides effective solutions to specific challenging problems concerning the design of three-dimensional integrated circuits. Expanded with new chapters and updates throughout based on the latest research in 3-D integration: - Manufacturing techniques for 3-D ICs with TSVs - Electrical modeling and closed-form expressions of through silicon vias - Substrate noise coupling in heterogeneous 3-D ICs - Design of 3-D ICs with inductive links - Synchronization in 3-D ICs - Variation effects on 3-D ICs - Correlation of WID variations for intra-tier buffers and wires - Offers practical guidance on designing 3-D heterogeneous systems - Provides power delivery of 3-D ICs - Demonstrates the use of 3-D ICs within heterogeneous systems that include a variety of materials, devices, processors, GPU-CPU integration, and more - Provides experimental case studies in power delivery, synchronization, and thermal characterization
| Author | : Victor Champac |
| Publisher | : Springer |
| Total Pages | : 195 |
| Release | : 2018-04-18 |
| Genre | : Technology & Engineering |
| ISBN | : 3319754653 |
This book discusses the digital design of integrated circuits under process variations, with a focus on design-time solutions. The authors describe a step-by-step methodology, going from logic gates to logic paths to the circuit level. Topics are presented in comprehensively, without overwhelming use of analytical formulations. Emphasis is placed on providing digital designers with understanding of the sources of process variations, their impact on circuit performance and tools for improving their designs to comply with product specifications. Various circuit-level “design hints” are highlighted, so that readers can use then to improve their designs. A special treatment is devoted to unique design issues and the impact of process variations on the performance of FinFET based circuits. This book enables readers to make optimal decisions at design time, toward more efficient circuits, with better yield and higher reliability.
| Author | : Amith Singhee |
| Publisher | : Springer Science & Business Media |
| Total Pages | : 254 |
| Release | : 2010-09-09 |
| Genre | : Technology & Engineering |
| ISBN | : 1441966064 |
Knowledge exists: you only have to ?nd it VLSI design has come to an important in?ection point with the appearance of large manufacturing variations as semiconductor technology has moved to 45 nm feature sizes and below. If we ignore the random variations in the manufacturing process, simulation-based design essentially becomes useless, since its predictions will be far from the reality of manufactured ICs. On the other hand, using design margins based on some traditional notion of worst-case scenarios can force us to sacri?ce too much in terms of power consumption or manufacturing cost, to the extent of making the design goals even infeasible. We absolutely need to explicitly account for the statistics of this random variability, to have design margins that are accurate so that we can ?nd the optimum balance between yield loss and design cost. This discontinuity in design processes has led many researchers to develop effective methods of statistical design, where the designer can simulate not just the behavior of the nominal design, but the expected statistics of the behavior in manufactured ICs. Memory circuits tend to be the hardest hit by the problem of these random variations because of their high replication count on any single chip, which demands a very high statistical quality from the product. Requirements of 5–6s (0.
| Author | : Ruijing Shen |
| Publisher | : Springer Science & Business Media |
| Total Pages | : 326 |
| Release | : 2014-07-08 |
| Genre | : Technology & Engineering |
| ISBN | : 1461407885 |
Since process variation and chip performance uncertainties have become more pronounced as technologies scale down into the nanometer regime, accurate and efficient modeling or characterization of variations from the device to the architecture level have become imperative for the successful design of VLSI chips. This book provides readers with tools for variation-aware design methodologies and computer-aided design (CAD) of VLSI systems, in the presence of process variations at the nanometer scale. It presents the latest developments for modeling and analysis, with a focus on statistical interconnect modeling, statistical parasitic extractions, statistical full-chip leakage and dynamic power analysis considering spatial correlations, statistical analysis and modeling for large global interconnects and analog/mixed-signal circuits. Provides readers with timely, systematic and comprehensive treatments of statistical modeling and analysis of VLSI systems with a focus on interconnects, on-chip power grids and clock networks, and analog/mixed-signal circuits; Helps chip designers understand the potential and limitations of their design tools, improving their design productivity; Presents analysis of each algorithm with practical applications in the context of real circuit design; Includes numerical examples for the quantitative analysis and evaluation of algorithms presented. Provides readers with timely, systematic and comprehensive treatments of statistical modeling and analysis of VLSI systems with a focus on interconnects, on-chip power grids and clock networks, and analog/mixed-signal circuits; Helps chip designers understand the potential and limitations of their design tools, improving their design productivity; Presents analysis of each algorithm with practical applications in the context of real circuit design; Includes numerical examples for the quantitative analysis and evaluation of algorithms presented.
| Author | : Enrico Macii |
| Publisher | : Springer Science & Business Media |
| Total Pages | : 926 |
| Release | : 2004-09-07 |
| Genre | : Computers |
| ISBN | : 3540230955 |
This book constitutes the refereed proceedings of the 14th International Workshop on Power and Timing Optimization and Simulation, PATMOS 2004, held in Santorini, Greece in September 2004. The 85 revised papers presented together with abstracts of 6 invited presentations were carefully reviewed and selected from 152 papers submitted. The papers are organized in topical sections on buses and communication, circuits and devices, low power issues, architectures, asynchronous circuits, systems design, interconnect and physical design, security and safety, low-power processing, digital design, and modeling and simulation.
| Author | : José Monteiro |
| Publisher | : Springer Science & Business Media |
| Total Pages | : 380 |
| Release | : 2010-02-18 |
| Genre | : Computers |
| ISBN | : 3642118011 |
This book constitutes the thoroughly refereed post-conference proceedings of 19th International Workshop on Power and Timing Modeling, Optimization and Simulation, PATMOS 2009, featuring Integrated Circuit and System Design, held in Delft, The Netherlands during September 9-11, 2009. The 26 revised full papers and 10 revised poster papers presented were carefully reviewed and selected from numerous submissions. The papers are organized in topical sections on variability & statistical timing, circuit level techniques, power management, low power circuits & technology, system level techniques, power & timing optimization techniques, self-timed circuits, low power circuit analysis & optimization, and low power design studies.
| Author | : Amir Zjajo |
| Publisher | : Springer Science & Business Media |
| Total Pages | : 311 |
| Release | : 2010-10-29 |
| Genre | : Technology & Engineering |
| ISBN | : 9048197252 |
With the fast advancement of CMOS fabrication technology, more and more signal-processing functions are implemented in the digital domain for a lower cost, lower power consumption, higher yield, and higher re-configurability. This has recently generated a great demand for low-power, low-voltage A/D converters that can be realized in a mainstream deep-submicron CMOS technology. However, the discrepancies between lithography wavelengths and circuit feature sizes are increasing. Lower power supply voltages significantly reduce noise margins and increase variations in process, device and design parameters. Consequently, it is steadily more difficult to control the fabrication process precisely enough to maintain uniformity. The inherent randomness of materials used in fabrication at nanoscopic scales means that performance will be increasingly variable, not only from die-to-die but also within each individual die. Parametric variability will be compounded by degradation in nanoscale integrated circuits resulting in instability of parameters over time, eventually leading to the development of faults. Process variation cannot be solved by improving manufacturing tolerances; variability must be reduced by new device technology or managed by design in order for scaling to continue. Similarly, within-die performance variation also imposes new challenges for test methods. In an attempt to address these issues, Low-Power High-Resolution Analog-to-Digital Converters specifically focus on: i) improving the power efficiency for the high-speed, and low spurious spectral A/D conversion performance by exploring the potential of low-voltage analog design and calibration techniques, respectively, and ii) development of circuit techniques and algorithms to enhance testing and debugging potential to detect errors dynamically, to isolate and confine faults, and to recover errors continuously. The feasibility of the described methods has been verified by measurements from the silicon prototypes fabricated in standard 180nm, 90nm and 65nm CMOS technology.
| Author | : Jian Ping Li |
| Publisher | : World Scientific |
| Total Pages | : 1645 |
| Release | : 2008-04-25 |
| Genre | : Computers |
| ISBN | : 9814471380 |
Wavelet analysis and its applications have become one of the fastest growing research areas in the past several years. Wavelet theory has been employed in many fields and applications, such as signal and image processing, communication systems, biomedical imaging, radar, air acoustics, and endless other areas. Active media technology is concerned with the development of autonomous computational or physical entities capable of perceiving, reasoning, adapting, learning, cooperating, and delegating in a dynamic environment.This book consists of carefully selected and received papers presented at the conference, and is an attempt to capture the essence of the current state-of-the-art in wavelet analysis and active media technology. Invited papers included in this proceedings includes contributions from Prof P Zhang, T D Bui, and C Y Suen from Concordia University, Canada; Prof N A Strelkov and V L Dol'nikov from Yaroslavl State University, Russia; Prof Chin-Chen Chang and Ching-Yun Chang from Taiwan; Prof S S Pandey from R D University, India; and Prof I L Bloshanskii from Moscow State Regional University, Russia.
| Author | : Mehdi Dehbashi |
| Publisher | : Springer |
| Total Pages | : 180 |
| Release | : 2014-09-25 |
| Genre | : Technology & Engineering |
| ISBN | : 3319093096 |
This book describes automated debugging approaches for the bugs and the faults which appear in different abstraction levels of a hardware system. The authors employ a transaction-based debug approach to systems at the transaction-level, asserting the correct relation of transactions. The automated debug approach for design bugs finds the potential fault candidates at RTL and gate-level of a circuit. Debug techniques for logic bugs and synchronization bugs are demonstrated, enabling readers to localize the most difficult bugs. Debug automation for electrical faults (delay faults)finds the potentially failing speedpaths in a circuit at gate-level. The various debug approaches described achieve high diagnosis accuracy and reduce the debugging time, shortening the IC development cycle and increasing the productivity of designers. Describes a unified framework for debug automation used at both pre-silicon and post-silicon stages; Provides approaches for debug automation of a hardware system at different levels of abstraction, i.e., chip, gate-level, RTL and transaction level; Includes techniques for debug automation of design bugs and electrical faults, as well as an infrastructure to debug NoC-based multiprocessor SoCs.
