Proceedings of the Symposium on Polymeric Materials for Electronic Packaging and High Technology Applications
Author | : John R. Susko |
Publisher | : |
Total Pages | : 228 |
Release | : 1988 |
Genre | : Electrochemistry |
ISBN | : |
Download Proceedings Of The Symposium On Polymeric Materials For Electronic Packaging And High Technology Applications full books in PDF, epub, and Kindle. Read online free Proceedings Of The Symposium On Polymeric Materials For Electronic Packaging And High Technology Applications ebook anywhere anytime directly on your device. Fast Download speed and no annoying ads. We cannot guarantee that every ebooks is available!
Author | : John R. Susko |
Publisher | : |
Total Pages | : 228 |
Release | : 1988 |
Genre | : Electrochemistry |
ISBN | : |
Author | : Sulaiman Khalifeh |
Publisher | : Elsevier |
Total Pages | : 617 |
Release | : 2020-04-01 |
Genre | : Technology & Engineering |
ISBN | : 192788568X |
Polymers in Organic Electronics: Polymer Selection for Electronic, Mechatronic, and Optoelectronic Systems provides readers with vital data, guidelines, and techniques for optimally designing organic electronic systems using novel polymers. The book classifies polymer families, types, complexes, composites, nanocomposites, compounds, and small molecules while also providing an introduction to the fundamental principles of polymers and electronics. Features information on concepts and optimized types of electronics and a classification system of electronic polymers, including piezoelectric and pyroelectric, optoelectronic, mechatronic, organic electronic complexes, and more. The book is designed to help readers select the optimized material for structuring their organic electronic system.Chapters discuss the most common properties of electronic polymers, methods of optimization, and polymeric-structured printed circuit boards. The polymeric structures of optoelectronics and photonics are covered and the book concludes with a chapter emphasizing the importance of polymeric structures for packaging of electronic devices. - Provides key identifying details on a range of polymers, micro-polymers, nano-polymers, resins, hydrocarbons, and oligomers - Covers the most common electrical, electronic, and optical properties of electronic polymers - Describes the underlying theories on the mechanics of polymer conductivity - Discusses polymeric structured printed circuit boards, including their rapid prototyping and optimizing their polymeric structures - Shows optimization methods for both polymeric structures of organic active electronic components and organic passive electronic components
Author | : John H. Lupinski |
Publisher | : |
Total Pages | : 520 |
Release | : 1989 |
Genre | : Science |
ISBN | : |
From a symposium of the ACS 196th meeting, Los Angeles, CA, Sept. 1988. Thirty-nine chapters cover a broad spectrum of topics in four general areas: physical chemistry of materials, properties and applications of encapsulants and gels, and printed circuit board substrates and materials. Also includes a review of the marketing trends which drive packaging technology. Annotation copyrighted by Book News, Inc., Portland, OR
Author | : James E. Morris |
Publisher | : Springer Science & Business Media |
Total Pages | : 553 |
Release | : 2008-12-30 |
Genre | : Technology & Engineering |
ISBN | : 0387473262 |
This book presents a comprehensive overview of nanoscale electronics and systems packaging, and covers nanoscale structures, nanoelectronics packaging, nanowire applications in packaging, and offers a roadmap for future trends. Composite materials are studied for high-k dielectrics, resistors and inductors, electrically conductive adhesives, conductive "inks," underfill fillers, and solder enhancement. The book is intended for industrial and academic researchers, industrial electronics packaging engineers who need to keep abreast of progress in their field, and others with interests in nanotechnology. It surveys the application of nanotechnologies to electronics packaging, as represented by current research across the field.
Author | : Frank Suli |
Publisher | : Woodhead Publishing |
Total Pages | : 490 |
Release | : 2018-11-01 |
Genre | : Technology & Engineering |
ISBN | : 008102391X |
Electronic Enclosures, Housings and Packages considers the problem of heat management for electronics from an encasement perspective. It addresses enclosures and their applications for industrial electronics, as well as LED lighting solutions for stationary and mobile markets. The book introduces fundamental concepts and defines dimensions of success in electrical enclosures. Other chapters discuss environmental considerations, shielding, standardization, materials selection, thermal management, product design principles, manufacturing techniques and sustainability. Final chapters focus on business fundamentals by outlining successful technical propositions and potential future directions.
Author | : C. P. Wong |
Publisher | : Elsevier |
Total Pages | : 676 |
Release | : 2013-10-22 |
Genre | : Technology & Engineering |
ISBN | : 1483289397 |
The most recent advances in the use of polymeric materials by the electronic industry can be found in Polymers for Electronic and Photonic Applications. This bookprovides in-depth coverage of photoresis for micro-lithography, microelectronic encapsulants and packaging, insulators, dielectrics for multichip packaging,electronic and photonic applications of polymeric materials, among many other topics. Intended for engineers and scientists who design, process, and manufacturemicroelectronic components, this book will also prove useful for hybrid and systems packaging managers who want to be informed of the very latest developments inthis field.* Presents most recent advances in the use of polymeric materials by the electronic industry* Contributions by foremost experts in the field
Author | : Philippe Cognard |
Publisher | : Elsevier |
Total Pages | : 511 |
Release | : 2005-07-14 |
Genre | : Technology & Engineering |
ISBN | : 0080534090 |
Handbook of Adhesives and Sealants is the most comprehensive Adhesives and Sealants Handbook ever published, with the cooperation of around 35 authors from all over the world – each one a specialist in their field. It will include 80 chapters dealing with general information, theory of bonding and sealing, design of bonding parts, technical characteristics, chemistry, types of adhesives, application, equipment, controls, standards etc. Industrial applications such as automotive, aeronautics, building and civil engineering, electronics, packaging, wood, furniture, metals, plastics and composites, textiles, footwear etc. - Over 1,000 real-life examples illustrate the do's and don'ts of using adhesives - Every scientific and technical issue concerning every chemical type in every industry - Designed to help solve problems quickly, the content is structured to allow readers to navigate this comprehensive resource in 4 different ways
Author | : Daniel Lu |
Publisher | : Springer |
Total Pages | : 974 |
Release | : 2016-11-18 |
Genre | : Technology & Engineering |
ISBN | : 3319450980 |
Significant progress has been made in advanced packaging in recent years. Several new packaging techniques have been developed and new packaging materials have been introduced. This book provides a comprehensive overview of the recent developments in this industry, particularly in the areas of microelectronics, optoelectronics, digital health, and bio-medical applications. The book discusses established techniques, as well as emerging technologies, in order to provide readers with the most up-to-date developments in advanced packaging.
Author | : Karl J. Puttlitz |
Publisher | : CRC Press |
Total Pages | : 1044 |
Release | : 2004-02-27 |
Genre | : Technology & Engineering |
ISBN | : 0203021487 |
This reference provides a complete discussion of the conversion from standard lead-tin to lead-free solder microelectronic assemblies for low-end and high-end applications. Written by more than 45 world-class researchers and practitioners, the book discusses general reliability issues concerning microelectronic assemblies, as well as factors specif