Materials Chemistry at High Temperatures

Materials Chemistry at High Temperatures
Author: John W. Hastie
Publisher: Springer Science & Business Media
Total Pages: 452
Release: 2013-12-01
Genre: Science
ISBN: 146120481X

Conference Overview and the Role of Chemistry in High-Temperature Materials Science and Technology LEO BREWER Department of ChemistIy, University of California, and Materials and Chemical Sciences Division, Lawrence Berkeley Laboratory, 1 Cyclotron Road, Berkeley, CA 94720 I don't want to compete with the fascinating historic account that John Drowart gave us, but I would like to go through the history of high don't get the reaction that I get from temperature symposia. I hope I some of my classes when I say, "Remember when such-and-such hap pened during the War?" And I get this blank look, and one of the students will say, "I wasn't born until after the Korean War. " Neverthe less, during World War II, many people in the high-temperature field had their first initiation. But there was one handicap. Owing to security measures, they were not able to interact with one another. Following the War, it was recognized that the high-temperature field was going to expand to meet the demands for materials with unique properties. To meet the demands for new fabrication techniques, it was important to establish better communications among various people. High-tempera ture symposia were established at that time and have continued very frequently, and I'd like to point out why they are especially important for this field. One problem is that it is not easy to work at high temperatures.

Journal of Research of the National Institute of Standards and Technology

Journal of Research of the National Institute of Standards and Technology
Author:
Publisher:
Total Pages: 824
Release: 1990
Genre: Chemistry
ISBN:

Reports NIST research and development in the physical and engineering sciences in which the Institute is active. These include physics, chemistry, engineering, mathematics, and computer sciences. Emphasis on measurement methodology and the basic technology underlying standardization.

The Fingerprint

The Fingerprint
Author: U. S. Department Justice
Publisher: Createspace Independent Publishing Platform
Total Pages: 0
Release: 2014-08-02
Genre:
ISBN: 9781500674151

The idea of The Fingerprint Sourcebook originated during a meeting in April 2002. Individuals representing the fingerprint, academic, and scientific communities met in Chicago, Illinois, for a day and a half to discuss the state of fingerprint identification with a view toward the challenges raised by Daubert issues. The meeting was a joint project between the International Association for Identification (IAI) and West Virginia University (WVU). One recommendation that came out of that meeting was a suggestion to create a sourcebook for friction ridge examiners, that is, a single source of researched information regarding the subject. This sourcebook would provide educational, training, and research information for the international scientific community.

Marine Mammals Ashore

Marine Mammals Ashore
Author: Joseph R. Geraci
Publisher: National Aquarium in Baltimore
Total Pages: 386
Release: 2005
Genre: Marine mammals
ISBN: 0977460908

Comprehensive manual for understanding and carrying out marine mammal rescue activities for stranded seals, manatees, dolphins, whales, or sea otters.

Ceramic Materials for Electronics

Ceramic Materials for Electronics
Author: Relva C. Buchanan
Publisher: CRC Press
Total Pages: 692
Release: 2018-10-08
Genre: Technology & Engineering
ISBN: 1482293048

The Third Edition of Ceramic Materials for Electronics studies a wide range of ceramic materials, including insulators, conductors, piezoelectrics, and ferroelectrics, through detailed discussion of their properties, characterization, fabrication, and applications in electronics. The author summarizes the latest trends and advancements in the field, and explores important topics such as ceramic thin film, functional device technology, and thick film technology. Edited by a leading expert on the subject, this new edition includes more than 150 pages of new information; restructured reference materials, figures, and tables; as well as additional device application-oriented segments.