Proceedings Of The International Symposium On The Physical Failure Analysis Of Integrated Circuits
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| Author | : ASM International |
| Publisher | : ASM International |
| Total Pages | : 540 |
| Release | : 2019-12-01 |
| Genre | : Technology & Engineering |
| ISBN | : 1627082735 |
The theme for the 2019 conference is Novel Computing Architectures. Papers will include discussions on the advent of Artificial Intelligence and the promise of quantum computing that are driving disruptive computing architectures; Neuromorphic chip designs on one hand, and Quantum Bits on the other, still in R&D, will introduce new computing circuitry and memory elements, novel materials, and different test methodologies. These novel computing architectures will require further innovation which is best achieved through a collaborative Failure Analysis community composed of chip manufacturers, tool vendors, and universities.
| Author | : ASM International |
| Publisher | : ASM International |
| Total Pages | : 666 |
| Release | : 2017-12-01 |
| Genre | : Technology & Engineering |
| ISBN | : 1627081518 |
The theme for the November 2017 conference was Striving for 100% Success Rate. Papers focus on the tools and techniques needed for maximizing the success rate in every aspect of the electronic device failure analysis process.
| Author | : |
| Publisher | : |
| Total Pages | : 378 |
| Release | : 2005 |
| Genre | : Integrated circuits |
| ISBN | : |
| Author | : ASM International |
| Publisher | : ASM International |
| Total Pages | : 593 |
| Release | : 2018-12-01 |
| Genre | : Technology & Engineering |
| ISBN | : 1627080996 |
The International Symposium for Testing and Failure Analysis (ISTFA) 2018 is co-located with the International Test Conference (ITC) 2018, October 28 to November 1, in Phoenix, Arizona, USA at the Phoenix Convention Center. The theme for the November 2018 conference is "Failures Worth Analyzing." While technology advances fast and the market demands the latest and the greatest, successful companies strive to stay competitive and remain profitable.
| Author | : Wilson Tan |
| Publisher | : Institute of Electrical & Electronics Engineers(IEEE) |
| Total Pages | : 262 |
| Release | : 2001 |
| Genre | : Technology & Engineering |
| ISBN | : 9780780366756 |
This volume contains the conference proceedings of the 2001 8th International Symposium on the Physical and Failure Analysis of Integrated Circuits.
| Author | : |
| Publisher | : ASM International |
| Total Pages | : 487 |
| Release | : 2010-01-01 |
| Genre | : Technology & Engineering |
| ISBN | : 1615037276 |
| Author | : Lawrence C. Wagner |
| Publisher | : Springer Science & Business Media |
| Total Pages | : 256 |
| Release | : 2012-12-06 |
| Genre | : Technology & Engineering |
| ISBN | : 1461549191 |
This "must have" reference work for semiconductor professionals and researchers provides a basic understanding of how the most commonly used tools and techniques in silicon-based semiconductors are applied to understanding the root cause of electrical failures in integrated circuits.
| Author | : Grace M. Davidson |
| Publisher | : ASM International |
| Total Pages | : 310 |
| Release | : 1997-01-01 |
| Genre | : Technology & Engineering |
| ISBN | : 1615030824 |
| Author | : |
| Publisher | : |
| Total Pages | : |
| Release | : 2002 |
| Genre | : |
| ISBN | : |
| Author | : ASM International |
| Publisher | : ASM International |
| Total Pages | : 643 |
| Release | : 2012 |
| Genre | : Technology & Engineering |
| ISBN | : 1615039953 |
