Proceedings Of The International Conference On Emerging Smart Cities Icesc2022
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Author | : Bashar S. Mohammed |
Publisher | : Springer |
Total Pages | : 0 |
Release | : 2023-07-12 |
Genre | : Architecture |
ISBN | : 9789819911103 |
This book contains papers presented at the International Conference on Emerging Smart Cities (ICESC2022), previously known as the International Conference on Civil, Offshore and Environmental Engineering (ICCOEE). ICESC is held under the banner of World Engineering, Science and Technology Congress (ESTCON2022) from 1 to2 December 2022 at Borneo Convention Centre, Kuching, Sarawak, Malaysia. This proceeding contains papers presented by academics and industrial practitioners showcasing the latest advancements and findings in civil engineering areas with an emphasis on emerging smart cities for the ultimate shape of urban living in the near future. The papers are categorized under the following tracks: (1) Climate Adaptive materials; (2) Environmental sustainability; (3) Infrastructure efficiency.
Author | : Bashar S. Mohammed |
Publisher | : Springer Nature |
Total Pages | : 774 |
Release | : 2024-01-17 |
Genre | : Architecture |
ISBN | : 9819911117 |
This book contains papers presented at the International Conference on Emerging Smart Cities (ICESC2022), previously known as the International Conference on Civil, Offshore and Environmental Engineering (ICCOEE). ICESC is held under the banner of World Engineering, Science and Technology Congress (ESTCON2022) from 1 to2 December 2022 at Borneo Convention Centre, Kuching, Sarawak, Malaysia. This proceeding contains papers presented by academics and industrial practitioners showcasing the latest advancements and findings in civil engineering areas with an emphasis on emerging smart cities for the ultimate shape of urban living in the near future. The papers are categorized under the following tracks: (1) Climate Adaptive materials; (2) Environmental sustainability; (3) Infrastructure efficiency.
Author | : Shrikaant Kulkarni |
Publisher | : CRC Press |
Total Pages | : 347 |
Release | : 2024-02-26 |
Genre | : Computers |
ISBN | : 1003825125 |
Edge computational intelligence is an interface between edge computing and artificial intelligence (AI) technologies. This interfacing represents a paradigm shift in the world of work by enabling a broad application areas and customer-friendly solutions. Edge computational intelligence technologies are just in their infancy. Edge Computational Intelligence for AI-Enabled IoT Systems looks at the trends and advances in edge computing and edge AI, the services rendered by them, related security and privacy issues, training algorithms, architectures, and sustainable AI-enabled IoT systems. Together, these technologies benefit from ultra-low latency, faster response times, lower bandwidth costs and resilience from network failure, and the book explains the advantages of systems and applications using intelligent IoT devices that are at the edge of a network and close to users. It explains how to make most of edge and cloud computing as complementary technologies or used in isolation for extensive and widespread applications. The advancement in IoT devices, networking facilities, parallel computation and 5G, and robust infrastructure for generalized machine learning have made it possible to employ edge computational intelligence in diverse areas and in diverse ways. The book begins with chapters that cover Edge AI services on offer as compared to conventional systems. These are followed by chapters that discuss security and privacy issues encountered during the implementation and execution of edge AI and computing services The book concludes with chapters looking at applications spread across different areas of edge AI and edge computing and also at the role of computational intelligence in AI-driven IoT systems.
Author | : N. R. Shetty |
Publisher | : Springer Nature |
Total Pages | : 646 |
Release | : 2023-12-15 |
Genre | : Technology & Engineering |
ISBN | : 9819976227 |
This book presents the proceedings of the International Conference on Emerging Research in Computing, Information, Communication and Applications (ERCICA) 2023. The conference provides an interdisciplinary forum for researchers, professional engineers and scientists, educators and technologists to discuss, debate and promote research and technology in the upcoming areas of computing, information, communication and their applications. Some of the topics include the Internet of Things (IoT), wireless communications, image and video processing, parallel and distributed computing, and smart grid applications, among others. The book discusses these emerging research areas, providing a valuable resource for researchers and practicing engineers alike.
Author | : Wahidul Biswas |
Publisher | : MDPI |
Total Pages | : 168 |
Release | : 2020-02-05 |
Genre | : Technology & Engineering |
ISBN | : 3039282433 |
This Special Issue covers a wide range of areas—including building orientation, service life, use of photocatalytically active structures and PV facades, implications of transportation system, building types (i.e., high rise, multilevel, commercial, residential), life cycle assessment, and structural engineering—that need to be considered in the environmental impact assessment of buildings, and the chapters include case studies across the globe. Consideration of these strategies would help reduce energy and material consumption, environmental emissions, and waste generation associated with all phases of a building’s life cycle. Chapter 1 demonstrates that green star concrete exhibits the same structural properties as conventional concrete in Australia. Chapter 2 showed that the use of TiO2 as a photocatalyst on the surface of construction materials with a suitable stable binding agent, such as aggregates, would enable building walls to absorb NOx from air. This study found that TiO2 has the potential to reduce ambient concentrations of NOx from areas where this pollutant becomes concentrated under solar irradiation. Chapter 3 presents the life cycle assessment of architecturally integrated glass–glass photovoltaics in building facades to find the appropriate material composition for a multicolored PV façade offering improved environmental performance. Chapter 4 shows that urban office buildings lacking appropriate orientation experienced indoor overheating. Chapter 5 details four modeling approaches that were implemented to estimate buildings’ response towards load shedding. Chapter 6 covers the life cycle GHG emissions of high-rise residential housing block to discover opportunities for environmental improvement. Chapter 7 discusses an LCA framework that took into account variation in the service life of buildings associated with the use of different types of materials. Chapter 8 presents a useful data mining algorithm to conduct life cycle asset management in residential developments built on transport systems.
Author | : IEEE Staff |
Publisher | : |
Total Pages | : |
Release | : 2021-03-17 |
Genre | : |
ISBN | : 9781728195469 |
INDIACom 2021 is aimed to invite original research papers in the field of, primarily, Computer Science and Information Technology and, generally, all interdisciplinary streams of Engineering Sciences, having central focus on sustainable computing applications, which may be of use in enhancing the quality of human life and contribute effectively to realize the nations vision of sustainable inclusive development using Computing INDIACom 2021 will be an amalgamation of four different Tracks organized parallel to each other, as enumerated hereunder Track 1 Sustainable Computing Track 2 High Performance Computing Track 3 High Speed Networking & Information Security Track 4 Software Engineering & Emerging Technologies
Author | : Victoria M. Petrova |
Publisher | : Nova Science Publishers |
Total Pages | : 0 |
Release | : 2016-12 |
Genre | : |
ISBN | : 9781634859301 |
This book focuses on the latest developments in the field of engineering. The first chapter presents software engineering and ontology development. Chapter Two discusses metal rapid prototyping technologies. Chapter Three presents a complete description of the Scalable High Efficiency Video Coding (SHVC) architecture and its application scenarios; comprehensively analyzes the recent efforts toward an improved SHVC compression efficiency; and introduces two novel SHVC improvement solutions, notably an improved SHVC Merge mode and a novel SHVC Joint Layer mode. Chapter Four examines a refined analytical-experimental modal testing method for polymeric damping materials. Chapter Five focuses on the recent published advances in biometrics to date, considering them not only in terms of their relative contributions but also in referral to relevant government and industry authentication frameworks and guidelines. Chapter Six discusses control of a class of 1D Bose-Einstein Condensate (BEC) condensate via linear-type feedback.
Author | : IEEE Staff |
Publisher | : |
Total Pages | : |
Release | : 2020-07-02 |
Genre | : |
ISBN | : 9781728141091 |
International conference on Electronics and Sustainable Communication Systems (ICESC 2020) is one of the eminent conferences organized by Hindustan Institute of Technology, Coimbatore, India dedicated to drive innovation in nearly every aspect of electronic and communication systems The primary aim of ICESC 2020 is to promote the high quality and sustainable research works in an international platform of scientists, researchers, and industrialists by bringing together the state of the art research work in different facets of electronics and communication systems and discuss, share and exchange the research ideas under one common platform Prospective authors are invited to contribute and address different themes and topics of the conference
Author | : Satyajit Patel |
Publisher | : Springer Nature |
Total Pages | : 715 |
Release | : 2021-04-22 |
Genre | : Science |
ISBN | : 9813364661 |
This book comprises select proceedings of the annual conference of the Indian Geotechnical Society. The conference brings together research and case histories on various aspects of geotechnical and geoenvironmental engineering. The book presents papers on geotechnical applications and case histories, covering topics such as (i) Characterization of Geomaterials and Physical Modelling; (ii) Foundations and Deep Excavations; (iii) Soil Stabilization and Ground Improvement; (iv) Geoenvironmental Engineering and Waste Material Utilization; (v) Soil Dynamics and Earthquake Geotechnical Engineering; (vi) Earth Retaining Structures, Dams and Embankments; (vii) Slope Stability and Landslides; (viii) Transportation Geotechnics; (ix) Geosynthetics Applications; (x) Computational, Analytical and Numerical Modelling; (xi) Rock Engineering, Tunnelling and Underground Constructions; (xii) Forensic Geotechnical Engineering and Case Studies; and (xiii) Others Topics: Behaviour of Unsaturated Soils, Offshore and Marine Geotechnics, Remote Sensing and GIS, Field Investigations, Instrumentation and Monitoring, Retrofitting of Geotechnical Structures, Reliability in Geotechnical Engineering, Geotechnical Education, Codes and Standards, and other relevant topics. The contents of this book are of interest to researchers and practicing engineers alike.
Author | : Neha Sharma |
Publisher | : Springer Nature |
Total Pages | : 530 |
Release | : 2021-09-19 |
Genre | : Technology & Engineering |
ISBN | : 9811629374 |
This book presents the latest findings in the areas of data management and smart computing, machine learning, big data management, artificial intelligence, and data analytics, along with advances in network technologies. The book is a collection of peer-reviewed research papers presented at Fifth International Conference on Data Management, Analytics and Innovation (ICDMAI 2021), held during January 15–17, 2021, in a virtual mode. It addresses state-of-the-art topics and discusses challenges and solutions for future development. Gathering original, unpublished contributions by scientists from around the globe, the book is mainly intended for a professional audience of researchers and practitioners in academia and industry.