Proceedings Of Joint Symposium On Corrosion Science And Technology 32
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Author | : Ricardo R. Ambriz |
Publisher | : Springer |
Total Pages | : 361 |
Release | : 2017-11-17 |
Genre | : Technology & Engineering |
ISBN | : 331970365X |
This book presents the proceedings of one of the major conferences in fatigue, fracture and structural integrity (NT2F). The papers are organized and divided in five different themes: fatigue and fracture mechanics of structures and advanced materials; fatigue and fracture in pressure vessels and pipelines: mechanical behavior and structural integrity of welded, bonded and bolted joints; residual stress and environmental effects on the fatigue behavior; and simulation methods, analytical and computation models in fatigue and fracture.
Author | : H. Fujii |
Publisher | : Woodhead Publishing |
Total Pages | : 571 |
Release | : 2014-08-27 |
Genre | : Technology & Engineering |
ISBN | : 1782421645 |
This book contains the papers from the Proceedings of the 1st international joint symposium on joining and welding held at Osaka University, Japan, 6-8 November 2013. The use of frictional heating to process and join materials has been used for many decades. Rotary and linear friction welding are vital techniques for many industrial sectors. More recently the development of friction stir welding (FSW) has significantly extended the application of friction processing. This conference is the first event organized by the three major institutes for joining and welding to focus on the broad range of friction processes. This symposium will provide the latest valuable information from academic and industrial experts from around the world on FSW, FSP, linear and rotary friction welding.
Author | : |
Publisher | : |
Total Pages | : 640 |
Release | : 1975 |
Genre | : Nuclear energy |
ISBN | : |
Author | : Khosrow-Pour, Mehdi |
Publisher | : IGI Global |
Total Pages | : 7972 |
Release | : 2014-07-31 |
Genre | : Computers |
ISBN | : 1466658894 |
"This 10-volume compilation of authoritative, research-based articles contributed by thousands of researchers and experts from all over the world emphasized modern issues and the presentation of potential opportunities, prospective solutions, and future directions in the field of information science and technology"--Provided by publisher.
Author | : British Library. Document Supply Centre |
Publisher | : |
Total Pages | : 792 |
Release | : 1987 |
Genre | : Conference proceedings |
ISBN | : |
Author | : Ian Milne |
Publisher | : Elsevier |
Total Pages | : 4647 |
Release | : 2003-07-25 |
Genre | : Business & Economics |
ISBN | : 0080490735 |
The aim of this major reference work is to provide a first point of entry to the literature for the researchers in any field relating to structural integrity in the form of a definitive research/reference tool which links the various sub-disciplines that comprise the whole of structural integrity. Special emphasis will be given to the interaction between mechanics and materials and structural integrity applications. Because of the interdisciplinary and applied nature of the work, it will be of interest to mechanical engineers and materials scientists from both academic and industrial backgrounds including bioengineering, interface engineering and nanotechnology. The scope of this work encompasses, but is not restricted to: fracture mechanics, fatigue, creep, materials, dynamics, environmental degradation, numerical methods, failure mechanisms and damage mechanics, interfacial fracture and nano-technology, structural analysis, surface behaviour and heart valves. The structures under consideration include: pressure vessels and piping, off-shore structures, gas installations and pipelines, chemical plants, aircraft, railways, bridges, plates and shells, electronic circuits, interfaces, nanotechnology, artificial organs, biomaterial prostheses, cast structures, mining... and more. Case studies will form an integral part of the work.
Author | : Tommaso Sgobba |
Publisher | : Elsevier |
Total Pages | : 1190 |
Release | : 2023-07-25 |
Genre | : Technology & Engineering |
ISBN | : 0323956556 |
The lack of widespread education in space safety engineering and management has profound effects on project team effectiveness in integrating safety during design. On one side, it slows down the professional development of junior safety engineers, while on the other side it creates a sectarian attitude that isolates safety engineers from the rest of the project team. To speed up professional development, bridge the gap within the team, and prevent hampered communication and missed feedback, the entire project team needs to acquire and develop a shared culture of space safety principles and techniques.The second edition of Safety Design for Space Systems continues to address these issues with substantial updates to chapters such as battery safety, life support systems, robotic systems safety, and fire safety. This book also features new chapters on crew survivability design and nuclear space systems safety. Finally, the discussion of human rating concepts, safety-by-design principles, and safety management practices have also been revised and improved. With contributions from leading experts worldwide, this second edition represents an essential educational resource and reference tool for engineers and managers working on space projects. - Provides basic multidisciplinary knowledge on space systems safety design - Addresses how space safety engineering and management can be implemented in practice - Includes new chapters on crew survivability design and nuclear space systems safety - Fully revised and updated to reflect the latest developments in the field
Author | : |
Publisher | : |
Total Pages | : 32 |
Release | : 1979 |
Genre | : Technology |
ISBN | : |
Author | : John H. Lau |
Publisher | : Springer Science & Business Media |
Total Pages | : 649 |
Release | : 2013-11-27 |
Genre | : Technology & Engineering |
ISBN | : 1461539102 |
Solders have given the designer of modern consumer, commercial, and military electronic systems a remarkable flexibility to interconnect electronic components. The properties of solder have facilitated broad assembly choices that have fueled creative applications to advance technology. Solder is the electrical and me chanical "glue" of electronic assemblies. This pervasive dependency on solder has stimulated new interest in applica tions as well as a more concerted effort to better understand materials properties. We need not look far to see solder being used to interconnect ever finer geo metries. Assembly of micropassive discrete devices that are hardly visible to the unaided eye, of silicon chips directly to ceramic and plastic substrates, and of very fine peripheral leaded packages constitute a few of solder's uses. There has been a marked increase in university research related to solder. New electronic packaging centers stimulate applications, and materials engineering and science departments have demonstrated a new vigor to improve both the materials and our understanding of them. Industrial research and development continues to stimulate new application, and refreshing new packaging ideas are emerging. New handbooks have been published to help both the neophyte and seasoned packaging engineer.
Author | : British Library. Lending Division |
Publisher | : |
Total Pages | : 492 |
Release | : 1988 |
Genre | : Congresses and conventions |
ISBN | : |