Design for High Performance, Low Power, and Reliable 3D Integrated Circuits

Design for High Performance, Low Power, and Reliable 3D Integrated Circuits
Author: Sung Kyu Lim
Publisher: Springer Science & Business Media
Total Pages: 573
Release: 2012-11-27
Genre: Technology & Engineering
ISBN: 1441995420

This book provides readers with a variety of algorithms and software tools, dedicated to the physical design of through-silicon-via (TSV) based, three-dimensional integrated circuits. It describes numerous “manufacturing-ready” GDSII-level layouts of TSV-based 3D ICs developed with the tools covered in the book. This book will also feature sign-off level analysis of timing, power, signal integrity, and thermal analysis for 3D IC designs. Full details of the related algorithms will be provided so that the readers will be able not only to grasp the core mechanics of the physical design tools, but also to be able to reproduce and improve upon the results themselves. This book will also offer various design-for-manufacturability (DFM), design-for-reliability (DFR), and design-for-testability (DFT) techniques that are considered critical to the physical design process.

3D Printing for Energy Applications

3D Printing for Energy Applications
Author: Albert Tarancón
Publisher: John Wiley & Sons
Total Pages: 400
Release: 2021-03-03
Genre: Technology & Engineering
ISBN: 1119560764

3D PRINTING FOR ENERGY APPLICATIONS Explore current and future perspectives of 3D printing for the fabrication of high value-added complex devices 3D Printing for Energy Applications delivers an insightful and cutting-edge exploration of the applications of 3D printing to the fabrication of complex devices in the energy sector. The book covers aspects related to additive manufacturing of functional materials with applicability in the energy sector. It reviews both the technology of printable materials and 3D printing strategies itself, and its use in energy devices or systems. Split into three sections, the book covers the 3D printing of functional materials before delving into the 3D printing of energy devices. It closes with printing challenges in the production of complex objects. It also presents an interesting perspective on the future of 3D printing of complex devices. Readers will also benefit from the inclusion of: A thorough introduction to 3D printing of functional materials, including metals, ceramics, and composites An exploration of 3D printing challenges for production of complex objects, including computational design, multimaterials, tailoring AM components, and volumetric additive manufacturing Practical discussions of 3D printing of energy devices, including batteries, supercaps, solar panels, fuel cells, turbomachinery, thermoelectrics, and CCUS Perfect for materials scientists, 3D Printing for Energy Applications will also earn a place in the libraries of graduate students in engineering, chemistry, and material sciences seeking a one-stop reference for current and future perspectives on 3D printing of high value-added complex devices.

Die-stacking Architecture

Die-stacking Architecture
Author: Yuan Xie
Publisher: Morgan & Claypool Publishers
Total Pages: 129
Release: 2015-06-01
Genre: Computers
ISBN: 1627057668

The emerging three-dimensional (3D) chip architectures, with their intrinsic capability of reducing the wire length, promise attractive solutions to reduce the delay of interconnects in future microprocessors. 3D memory stacking enables much higher memory bandwidth for future chip-multiprocessor design, mitigating the "memory wall" problem. In addition, heterogenous integration enabled by 3D technology can also result in innovative designs for future microprocessors. This book first provides a brief introduction to this emerging technology, and then presents a variety of approaches to designing future 3D microprocessor systems, by leveraging the benefits of low latency, high bandwidth, and heterogeneous integration capability which are offered by 3D technology.

3D Imaging Technologies—Multidimensional Signal Processing and Deep Learning

3D Imaging Technologies—Multidimensional Signal Processing and Deep Learning
Author: Lakhmi C. Jain
Publisher: Springer Nature
Total Pages: 332
Release: 2021-08-29
Genre: Technology & Engineering
ISBN: 9811631808

This book presents high-quality research in the field of 3D imaging technology. The second edition of International Conference on 3D Imaging Technology (3DDIT-MSP&DL) continues the good traditions already established by the first 3DIT conference (IC3DIT2019) to provide a wide scientific forum for researchers, academia and practitioners to exchange newest ideas and recent achievements in all aspects of image processing and analysis, together with their contemporary applications. The conference proceedings are published in 2 volumes. The main topics of the papers comprise famous trends as: 3D image representation, 3D image technology, 3D images and graphics, and computing and 3D information technology. In these proceedings, special attention is paid at the 3D tensor image representation, the 3D content generation technologies, big data analysis, and also deep learning, artificial intelligence, the 3D image analysis and video understanding, the 3D virtual and augmented reality, and many related areas. The first volume contains papers in 3D image processing, transforms and technologies. The second volume is about computing and information technologies, computer images and graphics and related applications. The two volumes of the book cover a wide area of the aspects of the contemporary multidimensional imaging and the related future trends from data acquisition to real-world applications based on various techniques and theoretical approaches.