Positron Annihilation Spectroscopy With Magnetically Analyzed Beams
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Positron Annihilation Spectroscopy with Magnetically Analyzed Beams
Author | : National Aeronautics and Space Administration (NASA) |
Publisher | : Createspace Independent Publishing Platform |
Total Pages | : 24 |
Release | : 2018-07-20 |
Genre | : |
ISBN | : 9781723417894 |
Lifetime measurements with magnetically analyzed positron beams were made in condensed media with uniform and non-uniform properties. As expected, the lifetime values with magnetically analyzed positron beams in uniform targets are similar to those obtained with conventional positron sources. The lifetime values with magnetically analyzed beams in targets which have non-uniform properties vary with positron energy and are different from the conventional positron source derived lifetime values in these targets. Singh, J. J. and Holt, W. H. and Mock, W., Jr. Langley Research Center NASA-TM-84535, NAS 1.15:84535 RTOP 505-33-23-05
Non-Destructive Testing of Fibre-Reinforced Plastics Composites
Author | : J. Summerscales |
Publisher | : Springer Science & Business Media |
Total Pages | : 298 |
Release | : 1987-09-30 |
Genre | : Technology & Engineering |
ISBN | : 9781851660933 |
Nondestructive Materials Characterization
Author | : Norbert G. H. Meyendorf |
Publisher | : Springer Science & Business Media |
Total Pages | : 435 |
Release | : 2013-11-21 |
Genre | : Science |
ISBN | : 3662089882 |
With an emphasis on aircraft materials, this book describes techniques for the material characterization to detect and quantify degradation processes such as corrosion and fatigue. It introduces readers to these techniques based on x-ray, ultrasonic, optical and thermal principles and demonstrates the potential of the techniques for a wide variety of applications concerning aircraft materials, especially aluminum and titanium alloys. The advantages and disadvantages of various techniques are evaluated.
Materials Design and Applications
Author | : Lucas F. M. da Silva |
Publisher | : Springer |
Total Pages | : 416 |
Release | : 2017-03-11 |
Genre | : Technology & Engineering |
ISBN | : 3319507842 |
This volume features fundamental research and applications in the field of the design and application of engineering materials, predominantly within the context of mechanical engineering applications. This includes a wide range of materials engineering and technology, including metals, e.g., polymers, composites, and ceramics. Advanced applications would include manufacturing in the new or newer materials, testing methods, multi-scale experimental and computational aspects. This book features fundamental research and applications in the design of engineering materials, predominantly within the context of mechanical engineering applications such as automobile, railway, marine, aerospace, biomedical, pressure vessel technology, and turbine technology. It covers a wide range of materials, including metals, polymers, composites, and ceramics. Advanced applications include the manufacturing of new materials, testing methods, multi-scale experimental and computational aspects. p>
Dielectric Films for Advanced Microelectronics
Author | : Mikhail Baklanov |
Publisher | : John Wiley & Sons |
Total Pages | : 508 |
Release | : 2007-04-04 |
Genre | : Technology & Engineering |
ISBN | : 0470065419 |
The topic of thin films is an area of increasing importance in materials science, electrical engineering and applied solid state physics; with both research and industrial applications in microelectronics, computer manufacturing, and physical devices. Advanced, high-performance computers, high-definition TV, broadband imaging systems, flat-panel displays, robotic systems, and medical electronics and diagnostics are a few examples of the miniaturized device technologies that depend on the utilization of thin film materials. This book presents an in-depth overview of the novel developments made by the scientific leaders in the area of modern dielectric films for advanced microelectronic applications. It contains clear, concise explanations of material science of dielectric films and their problem for device operation, including high-k, low-k, medium-k dielectric films and also specific features and requirements for dielectric films used in the packaging technology. A broad range of related topics are covered, from physical principles to design, fabrication, characterization, and applications of novel dielectric films.