Microelectronics Packaging Handbook

Microelectronics Packaging Handbook
Author: R.R. Tummala
Publisher: Springer Science & Business Media
Total Pages: 1060
Release: 2013-11-27
Genre: Computers
ISBN: 1461560373

Electronics has become the largest industry, surpassing agriculture, auto, and heavy metal industries. It has become the industry of choice for a country to prosper, already having given rise to the phenomenal prosperity of Japan, Korea, Singapore, Hong Kong, and Ireland among others. At the current growth rate, total worldwide semiconductor sales will reach $300B by the year 2000. The key electronic technologies responsible for the growth of the industry include semiconductors, the packaging of semiconductors for systems use in auto, telecom, computer, consumer, aerospace, and medical industries, displays, magnetic, and optical storage as well as software and system technologies. There has been a paradigm shift, however, in these technologies, from mainframe and supercomputer applications at any cost, to consumer applications at approximately one-tenth the cost and size. Personal computers are a good example, going from $500IMIP when products were first introduced in 1981, to a projected $IIMIP within 10 years. Thin, light portable, user friendly and very low-cost are, therefore, the attributes of tomorrow's computing and communications systems. Electronic packaging is defined as interconnection, powering, cool ing, and protecting semiconductor chips for reliable systems. It is a key enabling technology achieving the requirements for reducing the size and cost at the system and product level.

Moisture Sensitivity of Plastic Packages of IC Devices

Moisture Sensitivity of Plastic Packages of IC Devices
Author: X.J. Fan
Publisher: Springer Science & Business Media
Total Pages: 573
Release: 2010-07-23
Genre: Technology & Engineering
ISBN: 1441957197

Moisture Sensitivity of Plastic Packages of IC Devices provides information on the state-of-the-art techniques and methodologies related to moisture issues in plastic packages. The most updated, in-depth and systematic technical and theoretical approaches are addressed in the book. Numerous industrial applications are provided, along with the results of the most recent research and development efforts, including, but not limited to: thorough exploration of moisture's effects based on lectures and tutorials by the authors, consistent focus on solution-based approaches and methodologies for improved reliability in plastic packaging, emerging theories and cutting-edge industiral applications presented by the leading professionals in the field. Moisture plays a key role in the reliability of plastic packages of IC devices, and moisture-induced failures have become an increasing concern with the development of advanced IC devices. This second volume in the Micro- and Opto-Electronic Materials, Structures, and Systems series is a must-read for researchers and engineers alike.

Microelectronics Packaging Handbook

Microelectronics Packaging Handbook
Author: R.R. Tummala
Publisher: Springer Science & Business Media
Total Pages: 742
Release: 2012-12-06
Genre: Technology & Engineering
ISBN: 1461540860

Electronics has become the largest industry, surpassing agriCUlture, auto. and heavy metal industries. It has become the industry of choice for a country to prosper, already having given rise to the phenomenal prosperity of Japan. Korea. Singapore. Hong Kong. and Ireland among others. At the current growth rate, total worldwide semiconductor sales will reach $300B by the year 2000. The key electronic technologies responsible for the growth of the industry include semiconductors. the packaging of semiconductors for systems use in auto, telecom, computer, consumer, aerospace, and medical industries. displays. magnetic, and optical storage as well as software and system technologies. There has been a paradigm shift, however, in these technologies. from mainframe and supercomputer applications at any cost. to consumer applications at approximately one-tenth the cost and size. Personal computers are a good example. going from $500IMIP when products were first introduced in 1981, to a projected $lIMIP within 10 years. Thin. light portable. user friendly and very low-cost are. therefore. the attributes of tomorrow's computing and communications systems. Electronic packaging is defined as interconnection. powering, cool ing, and protecting semiconductor chips for reliable systems. It is a key enabling technology achieving the requirements for reducing the size and cost at the system and product level.

Plastic-Encapsulated Microelectronics

Plastic-Encapsulated Microelectronics
Author: Michael Pecht
Publisher: Wiley-Interscience
Total Pages: 520
Release: 1995-02-20
Genre: Business & Economics
ISBN:

Until now, professionals in search of detailed information about the latest developments in PEM design and production have had to waste valuable time browsing through countless professional journals, monographs, and databases.

Conductive Polymers and Plastics

Conductive Polymers and Plastics
Author: Larry Rupprecht
Publisher: William Andrew
Total Pages: 295
Release: 1999-12-31
Genre: Technology & Engineering
ISBN: 0815516568

This book is a collection of papers by individuals in industry and academia on research and application development of conductive polymers and plastics. Conductive plastics are positioned to play an increasingly important role in affairs of mankind, specifically in the area of electrical and electronic conductivity. While general knowledge about conductive polymers and plastics has been available for many years, a true understanding of their application has only taken place in the last 3 to 4 years. This is attributed to advances in materials and processing techniques. Engineers have only begun to explore the design freedom and economic benefits of specifying conductive polymers and plastics in industrial and business applications.This book is a key reference and guide to the use of conductive polymers and plastics. It is a summary of existing technologies, but also a look at future possibilities.

Plastics for Electronics

Plastics for Electronics
Author: M. Goosey
Publisher: Springer Science & Business Media
Total Pages: 409
Release: 2013-04-17
Genre: Technology & Engineering
ISBN: 9401727007

Polymeric materials are widely used during nearly all stages of the manufacturing process of electronics products and this book is intended to give an introductory overview of the chemistry, properties and uses of some of the more important classes of materials likely to be encountered in these applications. It is intended to serve primarily as an introduction to the use of polymers and plastics in the processing and manufacture of electronic and electrical components and assemblies. With no in-depth knowledge of polymers assumed, the book is ideal for engineers and researchers working in areas where electronics and polymer technology overlap. There are also numerous references for those wishing to delve deeper. The first edition of this book was published in 1985 and since then there has been an unbelievable change and growth in the electronics industry. Much of this has been made possible by the continued development of new and improved polymeric materials. In some areas the polymers used have changed markedly whereas in others there have been continued improvements to the same basic materials. Consequently, this second edition includes new chapters detailing the materials which have emerged more recently. Chapters covering the same topics as the original version have been extensively rewritten and updated, often with the assistance of current international experts. In the last few years much work has been carried out on the development and use of special polymers that have important properties in addition to those normally associated with conventional polymers. This edition therefore includes a chapter that introduces one particular group of materials exhibiting these special properties, the ferroelectric polymers. The book also includes new chapters on high temperature thermoplastics, or engineering plastics as they are sometimes known, and their use in so-called moulded interconnect devices, where the polymer is used to provide a much wider range of functions than has been possible using a more conventional approach. This new edition also has a wider international coverage with chapters by experts based in Belgium, Holland, Switzerland, Germany, England and the United States of America.

Polymers in Electronics

Polymers in Electronics
Author: Zulkifli Ahmad
Publisher: Elsevier
Total Pages: 450
Release: 2023-07-28
Genre: Technology & Engineering
ISBN: 0323983901

Polymers in Electronics: Optoelectronic Properties, Design, Fabrication, and Applications brings together the fundamentals and latest advances in polymeric materials for electronic device applications, supporting researchers, scientists and advanced students, and approaching the topic from a range of disciplines. The book begins by introducing polymeric materials, their dielectric, optical, and thermal properties, and the essential principles and techniques for polymers as applied to electronics. This is followed by detailed coverage of the key steps in the preparation of polymeric materials for opto-electronic devices, including fabrication methods, materials design, rheology, encapsulation, and conductive polymer mechanisms. The final part of the book focuses on the latest developments in advanced devices, covering the areas of photovoltaics, transistors, light-emitting diodes, and stretchable electronics. In addition, it explains mechanisms, design, fabrication techniques, and end applications. This is a highly valuable resource for researchers, advanced students, engineers and R&D professionals from a range of disciplines. Offers introductory coverage of polymeric materials for electronics, including principles, design, properties, fabrication and applications Focuses on key issues such as materials selection, structure-property relationships and challenges in application Explores advanced applications of polymers in photovoltaics, transistors, sensors, light-emitting diodes and stretchable electronics

Benefiting from Thermal and Mechanical Simulation in Micro-Electronics

Benefiting from Thermal and Mechanical Simulation in Micro-Electronics
Author: G.Q. Zhang
Publisher: Springer Science & Business Media
Total Pages: 195
Release: 2013-06-29
Genre: Technology & Engineering
ISBN: 1475731590

Benefiting from Thermal and Mechanical Simulation in Micro-Electronics presents papers from the first international conference on this topic, EuroSimE2000. For the first time, people from the electronics industry, research institutes, software companies and universities joined together to discuss present and possible future thermal and mechanical related problems and challenges in micro-electronics; the state-of-the-art methodologies for thermal & mechanical simulation and optimization of micro-electronics; and the perspectives of future simulation and optimization methodology development. Main areas covered are:- LIST type="5" The impact of simulation on industry profitability Approaches to simulation The state-of-the-art methodologies of simulation Design optimization by simulation £/LIST£ Benefiting from Thermal and Mechanical Simulation in Micro-Electronics is suitable for students at graduate level and beyond, and for researchers, designers and specialists in the fields of microelectronics and mechanics.