Plasma Enhanced Atomic Layer Deposition Of Boron Carbide For Interconnect Applications
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Author | : Lauren Mikal Dorsett |
Publisher | : |
Total Pages | : 94 |
Release | : 2018 |
Genre | : Electronic dissertations |
ISBN | : |
As the semiconductor industry endeavors to scale integrated circuit dimensions-- decreasing layer thicknesses while increasing the aspect ratio of fillable features--the need for novel interconnect materials with highly specialized properties continues to rise. Meeting the requirements for the numerous types of materials needed, including low-k dielectrics, etch stops, metal diffusion barriers, hardmasks, spacer layers, and other pattern-assist layers, with traditional silicon-based materials is becoming increasingly challenging. As an alternative to silicon, amorphous hydrogenated boron carbide (a BC:H), grown through plasma-enhanced chemical vapor deposition (PECVD), has been demonstrated to possess excellent dielectric properties, combined with very high Young's modulus, electrical properties rivaling those of SiOC:H variants, very good chemical stability, and unique and useful etch chemistry. However, a problem with PECVD growth that will limit its long-term utility is its inability to scale while maintaining uniform, conformal coatings for very thin films. To combat the issues arising from PECVD grown boron carbide, a plasma enhanced molecular-layer-deposition-based process for the growth of BC films on metal (copper) substrates using solid carborane precursors was proposed. This thesis describes the design and construction of a reactor chamber capable of this hypothesized film growth as well as the characterization of those preliminary depositions. Monolayer carborane growths on copper substrates were demonstrated with characterization including in situ spectroscopic ellipsometry, as well as ex situ contact angle analysis and X-ray photoelectron spectroscopy. The surface of the monolayer was then plasma treated and preliminary multi-layer growths were tested.
Author | : F. Roozeboom |
Publisher | : The Electrochemical Society |
Total Pages | : 83 |
Release | : 2018-09-21 |
Genre | : Science |
ISBN | : 1607688522 |
Author | : Ana Londergan |
Publisher | : The Electrochemical Society |
Total Pages | : 300 |
Release | : 2007 |
Genre | : Atomic layer deposition |
ISBN | : 1566775426 |
This issue gives an overview of the cutting edge research in the various areas where Atomic Layer Deposition (ALD) can be used, enabling the identification of issues, challenges, and areas where further research is needed. Contributions include: Memory applications, Interconnects and contacts, ALD Productivity enhancement and precursor development, ALD for optical and photonic applications, and Applications in other areas, such as MEMs, nanotechnology, fabrication of sensors and catalysts, etc.
Author | : Mirzojamshed Mirzokarimov |
Publisher | : |
Total Pages | : |
Release | : 2019 |
Genre | : |
ISBN | : |
Boron carbide semiconductor devices have a range of applications. As a neutron voltaic, the device could be used to power deep-space exploratory missions. Instead of the passive dosimetry systems used today, an active solid-state neutron detector could immediately alert workers about radiation hazards. The focus of this thesis is the fabrication of an amorphous boron carbide device by plasma enhanced chemical vapor deposition (PECVD). Isomeric carborane precursors are used to synthesize the amorphous p and n-type layers. Improved operation and handling of the PECVD reactor chamber resulted in a stable plasma capable of increased deposition rate. Therefore, quality and purity of the deposited boron carbide films also increased. X-ray photoelectron spectroscopy (XPS), spectroscopic ellipsometry, and I-V curve measurements were used to characterize the material and electronic properties of the films and devices. Furthermore, metallization and the creation of ohmic contacts with both the n-type and p-type layers were investigated
Author | : Eric Christopher Stevens |
Publisher | : |
Total Pages | : 215 |
Release | : 2018 |
Genre | : |
ISBN | : |
Author | : Cheol Seong Hwang |
Publisher | : Springer Science & Business Media |
Total Pages | : 266 |
Release | : 2013-10-18 |
Genre | : Science |
ISBN | : 146148054X |
Offering thorough coverage of atomic layer deposition (ALD), this book moves from basic chemistry of ALD and modeling of processes to examine ALD in memory, logic devices and machines. Reviews history, operating principles and ALD processes for each device.
Author | : Adam James Gildea |
Publisher | : |
Total Pages | : 76 |
Release | : 2013 |
Genre | : Diffusion |
ISBN | : |
Author | : |
Publisher | : |
Total Pages | : 2692 |
Release | : 2002 |
Genre | : Chemistry |
ISBN | : |
Author | : |
Publisher | : |
Total Pages | : 1026 |
Release | : |
Genre | : Aeronautics |
ISBN | : |
Lists citations with abstracts for aerospace related reports obtained from world wide sources and announces documents that have recently been entered into the NASA Scientific and Technical Information Database.
Author | : |
Publisher | : |
Total Pages | : 896 |
Release | : 1995 |
Genre | : Dissertation abstracts |
ISBN | : |