Piezoresistive Stress Sensors
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| Author | : John Lau |
| Publisher | : Springer Science & Business Media |
| Total Pages | : 904 |
| Release | : 2012-12-06 |
| Genre | : Technology & Engineering |
| ISBN | : 1468477676 |
Microelectronics packaging and interconnection have experienced exciting growth stimulated by the recognition that systems, not just silicon, provide the solution to evolving applications. In order to have a high density/ performance/yield/quality/reliability, low cost, and light weight system, a more precise understanding of the system behavior is required. Mechanical and thermal phenomena are among the least understood and most complex of the many phenomena encountered in microelectronics packaging systems and are found on the critical path of neatly every design and process in the electronics industry. The last decade has witnessed an explosive growth in the research and development efforts devoted to determining the mechanical and thermal behaviors of microelectronics packaging. With the advance of very large scale integration technologies, thousands to tens of thousands of devices can be fabricated on a silicon chip. At the same time, demands to further reduce packaging signal delay and increase packaging density between communicat ing circuits have led to the use of very high power dissipation single-chip modules and multi-chip modules. The result of these developments has been a rapid growth in module level heat flux within the personal, workstation, midrange, mainframe, and super computers. Thus, thermal (temperature, stress, and strain) management is vital for microelectronics packaging designs and analyses. How to determine the temperature distribution in the elec tronics components and systems is outside the scope of this book, which focuses on the determination of stress and strain distributions in the electronics packaging.
| Author | : Peter C. McKeighan |
| Publisher | : ASTM International |
| Total Pages | : 217 |
| Release | : 2001 |
| Genre | : Detectors |
| ISBN | : 0803128827 |
A further 13 papers from a November 1999 symposium in Kansas City, Missouri cover fracture mechanics and structural integrity, damage evolution and measurement, and techniques to measure strain and displacement. The topics include sensing crack nucleation and growth in hard alpha defects embedded in
| Author | : Minhang Bao |
| Publisher | : Elsevier |
| Total Pages | : 327 |
| Release | : 2005-04-12 |
| Genre | : Technology & Engineering |
| ISBN | : 008045562X |
Sensors and actuators are now part of our everyday life and appear in many appliances, such as cars, vending machines and washing machines. MEMS (Micro Electro Mechanical Systems) are micro systems consisting of micro mechanical sensors, actuators and micro electronic circuits. A variety of MEMS devices have been developed and many mass produced, but the information on these is widely dispersed in the literature. This book presents the analysis and design principles of MEMS devices. The information is comprehensive, focusing on microdynamics, such as the mechanics of beam and diaphragm structures, air damping and its effect on the motion of mechanical structures. Using practical examples, the author examines problems associated with analysis and design, and solutions are included at the back of the book. The ideal advanced level textbook for graduates, Analysis and Design Principles of MEMS Devices is a suitable source of reference for researchers and engineers in the field.* Presents the analysis and design principles of MEMS devices more systematically than ever before.* Includes the theories essential for the analysis and design of MEMS includes the dynamics of micro mechanical structures* A problem section is included at the end of each chapter with answers provided at the end of the book.
| Author | : Bharat Bhushan |
| Publisher | : Springer |
| Total Pages | : 2868 |
| Release | : 2013-04-29 |
| Genre | : Technology & Engineering |
| ISBN | : 9789048197521 |
The Encyclopedia of Nanotechnology provides a comprehensive and multi-disciplinary reference to the many fields relevant to the general field of nanotechnology. It aims to be a comprehensive and genuinely international reference work and will be aimed at graduate students, researchers, and practitioners. The Encyclopedia of Nanotechnology introduces a large number of terms, devices and processes which are related to the multi-disciplinary field of Nanotechnology. For each entry in this 4 volume set a 4-10 page description is provided by an expert in the field. Contributions are made by experts from the US, Europe and Asia, making this a comprehensive and truly international Reference Work. The authors are typically from academia, however one quarter of all entries were written by persons from industry. Topics covered in the Reference Work include: - Nano- Microfabrication Processes and Materials for Fabrication - Nanoscale Measurement Techniques - Nanostructures - Nanomaterials - Nanomechanics - Molecular Modeling and Its Role in Advancing Nanotechnology - MEMS/NEMS - Microfluidics and Nanofluidics - Biomedical Engineering and Biodevices - Bio/Nanotechnology and Nanomedicine - Bio/Nanotechnology for cellular engineering - Drug Delivery – Technology and Applications - Assembly - Organic Electronics - Nano-optical Devices - Micro/nano Integration - Materials, Coatings and Surface Treatments for Nanotribology - Micro/NanoReliability – thermal, mechanical etc. - Biomimetics
| Author | : William N. Sharpe, Jr. |
| Publisher | : Springer Science & Business Media |
| Total Pages | : 1100 |
| Release | : 2008-12-04 |
| Genre | : Mathematics |
| ISBN | : 0387268839 |
The Springer Handbook of Experimental Solid Mechanics documents both the traditional techniques as well as the new methods for experimental studies of materials, components, and structures. The emergence of new materials and new disciplines, together with the escalating use of on- and off-line computers for rapid data processing and the combined use of experimental and numerical techniques have greatly expanded the capabilities of experimental mechanics. New exciting topics are included on biological materials, MEMS and NEMS, nanoindentation, digital photomechanics, photoacoustic characterization, and atomic force microscopy in experimental solid mechanics. Presenting complete instructions to various areas of experimental solid mechanics, guidance to detailed expositions in important references, and a description of state-of-the-art applications in important technical areas, this thoroughly revised and updated edition is an excellent reference to a widespread academic, industrial, and professional engineering audience.
| Author | : Joseph C. Doll |
| Publisher | : Springer Science & Business Media |
| Total Pages | : 252 |
| Release | : 2013-10-30 |
| Genre | : Technology & Engineering |
| ISBN | : 1461485177 |
Piezoresistor Design and Applications provides an overview of these MEMS devices and related physics. The text demonstrates how MEMS allows miniaturization and integration of sensing as well as efficient packaging and signal conditioning. This text for engineers working in MEMS design describes the piezoresistive phenomenon and optimization in several applications. Includes detailed discussion of such topics as; coupled models of mechanics, materials and electronic behavior in a variety of common geometric implementations including strain gages, beam bending, and membrane loading. The text concludes with an up-to-date discussion of the need for integrated MEMS design and opportunities to leverage new materials, processes and MEMS technology. Piezoresistor Design and Applications is an ideal book for design engineers, process engineers and researchers.
| Author | : Fabiano Fruett |
| Publisher | : Springer Science & Business Media |
| Total Pages | : 174 |
| Release | : 2002-05-31 |
| Genre | : Technology & Engineering |
| ISBN | : 1402070535 |
This book describes techniques that can reduce mechanical-stress-induced inaccuracy and long-term instability in chips. The authors also show that the piezojunction effect can be applied for new types of mechanical-sensor structures. Thermo-mechanical stress is induced when packaged chips cool down to the temperature of application.
| Author | : Stephanus Büttgenbach |
| Publisher | : Springer Nature |
| Total Pages | : 302 |
| Release | : 2020-05-15 |
| Genre | : Technology & Engineering |
| ISBN | : 3662613204 |
The book “Case Studies in Micromechatronics – From Systems to Process” offers prominent sample applications of micromechatronic systems and the enabling fabrication technologies. The chosen examples represent five main fields of application: consumer electronics (pressure sensor), mobility and navigation (acceleration sensor), handling technology and automation (micro gripper), laboratory diagnostics (point of care system), and biomedical technology (smart skin). These five sample systems are made from different materials requiring a large variety of modern fabrication methods and design rules, which are explained in detail. As a result, an inverted introduction “from prominent applications to base technologies” is provided. Examples of applications are selected to offer a broad overview of the development environment of micromechatronic systems including established as well as cutting-edge microfabrication technologies.
| Author | : Xing Fan |
| Publisher | : John Wiley & Sons |
| Total Pages | : 388 |
| Release | : 2022-03-14 |
| Genre | : Technology & Engineering |
| ISBN | : 3527345248 |
Textile-Based Energy Harvesting and Storage Devices for Wearable Electronics Discover state-of-the-art developments in textile-based wearable and stretchable electronics from leaders in the field In Textile-Based Energy Harvesting and Storage Devices for Wearable Electronics, renowned researchers Professor Xing Fan and his co-authors deliver an insightful and rigorous exploration of textile-based energy harvesting and storage systems. The book covers the principles of smart fibers and fabrics, as well as their fabrication methods. It introduces, in detail, several fiber- and fabric-based energy harvesting and storage devices, including photovoltaics, piezoelectrics, triboelectrics, supercapacitors, batteries, and sensing and self-powered electric fabrics. The authors also discuss expanded functions of smart fabrics, like stretchability, hydrophobicity, air permeability and color-changeability. The book includes sections on emerging electronic fibers and textiles, including stress-sensing, strain-sensing, and chemical-sensing textiles, as well as emerging self-powered electronic textiles. Textile-Based Energy Harvesting and Storage Devices for Wearable Electronics concludes with an in-depth treatment of upcoming challenges, opportunities, and commercialization requirements for electronic textiles, providing valuable insight into a highly lucrative new commercial sector. The book also offers: A thorough introduction to the evolution from classical functional fibers to intelligent fibers and textiles An exploration of typical film deposition technologies, like dry-process film deposition and wet-process technologies for roll-to-roll device fabrication Practical discussions of the fabrication process of intelligent fibers and textiles, including the synthesis of classical functional fibers and nano/micro assembly on fiber materials In-depth examinations of energy harvesting and energy storage fibers, including photovoltaic, piezoelectric, and supercapacitor fibers Perfect for materials scientists, engineering scientists, and sensor developers, Textile-Based Energy Harvesting and Storage Devices for Wearable Electronics is also an indispensable resource for electrical engineers and professionals in the sensor industry seeking a one-stop reference for fiber- and fabric-based energy harvesting and storage systems for wearable and stretchable power sources.
| Author | : Ruquan Ye |
| Publisher | : |
| Total Pages | : 88 |
| Release | : 2020-11-30 |
| Genre | : Graphene |
| ISBN | : 9789814877275 |
LIG is a revolutionary technique that uses a common CO2 infrared laser scriber, like the one used in any machine shop, for the direct conversion of polymers into porous graphene under ambient conditions. This technique combines the preparation and patterning of 3D graphene in a single step, without the use of wet chemicals. The ease in the structural engineering and excellent mechanical properties of the 3D graphene obtained have made LIG a versatile technique for applications across many fields. This book compiles cutting-edge research on LIG by different research groups all over the world. It discusses the strategies that have been developed to synthesize and engineer graphene, including controlling its properties such as porosity, composition, and surface characteristics. The authors are pioneers in the discovery and development of LIG and the book will appeal to anyone involved in nanotechnology, chemistry, environmental sciences, and device development, especially those with an interest in the synthesis and applications of graphene-based materials.
