Physical Design For 3d Integrated Circuits
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| Author | : Aida Todri-Sanial |
| Publisher | : CRC Press |
| Total Pages | : 397 |
| Release | : 2017-12-19 |
| Genre | : Technology & Engineering |
| ISBN | : 1498710379 |
Physical Design for 3D Integrated Circuits reveals how to effectively and optimally design 3D integrated circuits (ICs). It also analyzes the design tools for 3D circuits while exploiting the benefits of 3D technology. The book begins by offering an overview of physical design challenges with respect to conventional 2D circuits, and then each chapter delivers an in-depth look at a specific physical design topic. This comprehensive reference: Contains extensive coverage of the physical design of 2.5D/3D ICs and monolithic 3D ICs Supplies state-of-the-art solutions for challenges unique to 3D circuit design Features contributions from renowned experts in their respective fields Physical Design for 3D Integrated Circuits provides a single, convenient source of cutting-edge information for those pursuing 2.5D/3D technology.
| Author | : Vasilis F. Pavlidis |
| Publisher | : Newnes |
| Total Pages | : 770 |
| Release | : 2017-07-04 |
| Genre | : Technology & Engineering |
| ISBN | : 0124104843 |
Three-Dimensional Integrated Circuit Design, Second Eition, expands the original with more than twice as much new content, adding the latest developments in circuit models, temperature considerations, power management, memory issues, and heterogeneous integration. 3-D IC experts Pavlidis, Savidis, and Friedman cover the full product development cycle throughout the book, emphasizing not only physical design, but also algorithms and system-level considerations to increase speed while conserving energy. A handy, comprehensive reference or a practical design guide, this book provides effective solutions to specific challenging problems concerning the design of three-dimensional integrated circuits. Expanded with new chapters and updates throughout based on the latest research in 3-D integration: - Manufacturing techniques for 3-D ICs with TSVs - Electrical modeling and closed-form expressions of through silicon vias - Substrate noise coupling in heterogeneous 3-D ICs - Design of 3-D ICs with inductive links - Synchronization in 3-D ICs - Variation effects on 3-D ICs - Correlation of WID variations for intra-tier buffers and wires - Offers practical guidance on designing 3-D heterogeneous systems - Provides power delivery of 3-D ICs - Demonstrates the use of 3-D ICs within heterogeneous systems that include a variety of materials, devices, processors, GPU-CPU integration, and more - Provides experimental case studies in power delivery, synchronization, and thermal characterization
| Author | : Paul D. Franzon |
| Publisher | : John Wiley & Sons |
| Total Pages | : 655 |
| Release | : 2019-01-25 |
| Genre | : Technology & Engineering |
| ISBN | : 3527697063 |
This fourth volume of the landmark handbook focuses on the design, testing, and thermal management of 3D-integrated circuits, both from a technological and materials science perspective. Edited and authored by key contributors from top research institutions and high-tech companies, the first part of the book provides an overview of the latest developments in 3D chip design, including challenges and opportunities. The second part focuses on the test methods used to assess the quality and reliability of the 3D-integrated circuits, while the third and final part deals with thermal management and advanced cooling technologies and their integration.
| Author | : Rohit Sharma |
| Publisher | : CRC Press |
| Total Pages | : 328 |
| Release | : 2018-09-03 |
| Genre | : Technology & Engineering |
| ISBN | : 1351831593 |
Three-dimensional (3D) integration of microsystems and subsystems has become essential to the future of semiconductor technology development. 3D integration requires a greater understanding of several interconnected systems stacked over each other. While this vertical growth profoundly increases the system functionality, it also exponentially increases the design complexity. Design of 3D Integrated Circuits and Systems tackles all aspects of 3D integration, including 3D circuit and system design, new processes and simulation techniques, alternative communication schemes for 3D circuits and systems, application of novel materials for 3D systems, and the thermal challenges to restrict power dissipation and improve performance of 3D systems. Containing contributions from experts in industry as well as academia, this authoritative text: Illustrates different 3D integration approaches, such as die-to-die, die-to-wafer, and wafer-to-wafer Discusses the use of interposer technology and the role of Through-Silicon Vias (TSVs) Presents the latest improvements in three major fields of thermal management for multiprocessor systems-on-chip (MPSoCs) Explores ThruChip Interface (TCI), NAND flash memory stacking, and emerging applications Describes large-scale integration testing and state-of-the-art low-power testing solutions Complete with experimental results of chip-level 3D integration schemes tested at IBM and case studies on advanced complementary metal–oxide–semiconductor (CMOS) integration for 3D integrated circuits (ICs), Design of 3D Integrated Circuits and Systems is a practical reference that not only covers a wealth of design issues encountered in 3D integration but also demonstrates their impact on the efficiency of 3D systems.
| Author | : Solanki, Arun |
| Publisher | : IGI Global |
| Total Pages | : 674 |
| Release | : 2019-12-13 |
| Genre | : Computers |
| ISBN | : 1522596453 |
As today’s world continues to advance, Artificial Intelligence (AI) is a field that has become a staple of technological development and led to the advancement of numerous professional industries. An application within AI that has gained attention is machine learning. Machine learning uses statistical techniques and algorithms to give computer systems the ability to understand and its popularity has circulated through many trades. Understanding this technology and its countless implementations is pivotal for scientists and researchers across the world. The Handbook of Research on Emerging Trends and Applications of Machine Learning provides a high-level understanding of various machine learning algorithms along with modern tools and techniques using Artificial Intelligence. In addition, this book explores the critical role that machine learning plays in a variety of professional fields including healthcare, business, and computer science. While highlighting topics including image processing, predictive analytics, and smart grid management, this book is ideally designed for developers, data scientists, business analysts, information architects, finance agents, healthcare professionals, researchers, retail traders, professors, and graduate students seeking current research on the benefits, implementations, and trends of machine learning.
| Author | : Yuan Xie |
| Publisher | : Springer Science & Business Media |
| Total Pages | : 292 |
| Release | : 2009-12-02 |
| Genre | : Technology & Engineering |
| ISBN | : 144190784X |
We live in a time of great change. In the electronics world, the last several decades have seen unprecedented growth and advancement, described by Moore’s law. This observation stated that transistor density in integrated circuits doubles every 1. 5–2 years. This came with the simultaneous improvement of individual device perf- mance as well as the reduction of device power such that the total power of the resulting ICs remained under control. No trend remains constant forever, and this is unfortunately the case with Moore’s law. The trouble began a number of years ago when CMOS devices were no longer able to proceed along the classical scaling trends. Key device parameters such as gate oxide thickness were simply no longer able to scale. As a result, device o- state currents began to creep up at an alarming rate. These continuing problems with classical scaling have led to a leveling off of IC clock speeds to the range of several GHz. Of course, chips can be clocked higher but the thermal issues become unmanageable. This has led to the recent trend toward microprocessors with mul- ple cores, each running at a few GHz at the most. The goal is to continue improving performance via parallelism by adding more and more cores instead of increasing speed. The challenge here is to ensure that general purpose codes can be ef?ciently parallelized. There is another potential solution to the problem of how to improve CMOS technology performance: three-dimensional integrated circuits (3D ICs).
| Author | : Philip Garrou |
| Publisher | : John Wiley & Sons |
| Total Pages | : 798 |
| Release | : 2011-09-22 |
| Genre | : Technology & Engineering |
| ISBN | : 352762306X |
The first encompassing treatise of this new, but very important field puts the known physical limitations for classic 2D electronics into perspective with the requirements for further electronics developments and market necessities. This two-volume handbook presents 3D solutions to the feature density problem, addressing all important issues, such as wafer processing, die bonding, packaging technology, and thermal aspects. It begins with an introductory part, which defines necessary goals, existing issues and relates 3D integration to the semiconductor roadmap of the industry. Before going on to cover processing technology and 3D structure fabrication strategies in detail. This is followed by fields of application and a look at the future of 3D integration. The contributions come from key players in the field, from both academia and industry, including such companies as Lincoln Labs, Fraunhofer, RPI, ASET, IMEC, CEA-LETI, IBM, and Renesas.
| Author | : Chuan Seng Tan |
| Publisher | : CRC Press |
| Total Pages | : 376 |
| Release | : 2016-04-19 |
| Genre | : Science |
| ISBN | : 9814303828 |
Three-dimensional (3D) integration is identified as a possible avenue for continuous performance growth in integrated circuits (IC) as the conventional scaling approach is faced with unprecedented challenges in fundamental and economic limits. Wafer level 3D IC can take several forms, and they usually include a stack of several thinned IC layers th
| Author | : Andrew B. Kahng |
| Publisher | : Springer Science & Business Media |
| Total Pages | : 310 |
| Release | : 2011-01-27 |
| Genre | : Technology & Engineering |
| ISBN | : 9048195918 |
Design and optimization of integrated circuits are essential to the creation of new semiconductor chips, and physical optimizations are becoming more prominent as a result of semiconductor scaling. Modern chip design has become so complex that it is largely performed by specialized software, which is frequently updated to address advances in semiconductor technologies and increased problem complexities. A user of such software needs a high-level understanding of the underlying mathematical models and algorithms. On the other hand, a developer of such software must have a keen understanding of computer science aspects, including algorithmic performance bottlenecks and how various algorithms operate and interact. "VLSI Physical Design: From Graph Partitioning to Timing Closure" introduces and compares algorithms that are used during the physical design phase of integrated-circuit design, wherein a geometric chip layout is produced starting from an abstract circuit design. The emphasis is on essential and fundamental techniques, ranging from hypergraph partitioning and circuit placement to timing closure.
| Author | : Antonis Papanikolaou |
| Publisher | : Springer Science & Business Media |
| Total Pages | : 251 |
| Release | : 2010-12-07 |
| Genre | : Architecture |
| ISBN | : 1441909621 |
Three-dimensional (3D) integrated circuit (IC) stacking is the next big step in electronic system integration. It enables packing more functionality, as well as integration of heterogeneous materials, devices, and signals, in the same space (volume). This results in consumer electronics (e.g., mobile, handheld devices) which can run more powerful applications, such as full-length movies and 3D games, with longer battery life. This technology is so promising that it is expected to be a mainstream technology a few years from now, less than 10-15 years from its original conception. To achieve this type of end product, changes in the entire manufacturing and design process of electronic systems are taking place. This book provides readers with an accessible tutorial on a broad range of topics essential to the non-expert in 3D System Integration. It is an invaluable resource for anybody in need of an overview of the 3D manufacturing and design chain.
