Pcb Trace And Via Currents And Temperatures
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| Author | : Douglas Brooks |
| Publisher | : Artech House |
| Total Pages | : 246 |
| Release | : 2021-02-28 |
| Genre | : Technology & Engineering |
| ISBN | : 1630818615 |
A very important part of printed circuit board (PCB) design involves sizing traces and vias to carry the required current. This exciting new book will explore how hot traces and vias should be and what board, circuit, design, and environmental parameters are the most important. PCB materials (copper and dielectrics) and the role they play in the heating and cooling of traces are covered. The IPC curves found in IPC 2152, the equations that fit those curves and computer simulations that fit those curves and equations are detailed. Sensitivity analyses that show what happens when environments are varied, including adjacent traces and planes, changing trace lengths, and thermal gradients are presented. Via temperatures and what determines them are explored, along with fusing issues and what happens when traces are overloaded. Voltage drops across traces and vias, the thermal effects going around right-angle corners, and frequency effects are covered. Readers learn how to measure the thermal conductivity of dielectrics and how to measure the resistivity of copper traces and why many prior attempts to do so have been doomed to failure. Industrial CT Scanning, and whether or not they might replace microsections for measuring trace parameters are also considered.
| Author | : Douglas Brooks |
| Publisher | : Createspace Independent Publishing Platform |
| Total Pages | : 202 |
| Release | : 2016-03-04 |
| Genre | : |
| ISBN | : 9781530389438 |
Finally! For the first time, here is a complete, thorough analysis of the relationships between PCB trace (and via) currents and trace temperatures. All in one place! Brooks has been looking at these relationships since the mid '90s. And he has assembled 20-plus years of knowledge into these pages. Starting with a historical background, this book covers: (a) PCB materials (copper and dielectrics) and the role they play in the heating and cooling of traces; (b) The IPC curves found in IPC 2152; (c) Equations that fit those curves; (d) Computer simulations that fit those curves and equations; (e) Sensitivity analyses showing what happens when we vary the environment (adjacent traces and planes, changing trace lengths, thermal gradients, etc.); (f) Via temperatures and what determines them; (g) Via current densities; (h) Fusing issues, what happens when traces are overloaded, and (g) a chapter showing how unevenly traces heat, even at low temperatures. There are supplemental chapters or appendices on measuring the thermal conductivity of dielectrics and measuring the resistivity of copper traces (and why many prior attempts have been doomed to failure.) And there is even a chapter on whether Industrial CT Scanning might replace microsections for measuring trace parameters. Never before has such a thorough compendium been available, especially so conveniently.
| Author | : Douglas G Brooks Phd |
| Publisher | : |
| Total Pages | : |
| Release | : 2017-02-09 |
| Genre | : |
| ISBN | : 9781541213524 |
Brooks has been looking at these relationships since the mid '90s. And he has assembled 20-plus years of knowledge into these pages. Starting with a historical background, this book covers: (a) PCB materials (copper and dielectrics) and the role they play in the heating and cooling of traces; (b) The IPC curves found in IPC 2152; (c) Equations that fit those curves; (d) Computer simulations that fit those curves and equations; (e) Sensitivity analyses showing what happens when we vary the environment (adjacent traces and planes, changing trace lengths, thermal gradients, etc.); (f) Via temperatures and what determines them; (g) Via current densities; and (h) Fusing issues, what happens when traces are overloaded. There are supplemental chapters or appendices on measuring the thermal conductivity of dielectrics and measuring the resistivity of copper traces (and why many prior attempts to do so have been doomed to failure.) And there is even a chapter on whether Industrial CT Scanning might replace microsections for measuring trace parameters. This Second Edition adds two new chapters (on AC currents and on thermal gradients around right-angle corners), a greatly expanded Chapter 6 (Thermal Simulations), and other additional information throughout the text.
| Author | : Douglas Brooks |
| Publisher | : Createspace Independent Publishing Platform |
| Total Pages | : 28 |
| Release | : 2018-07-09 |
| Genre | : |
| ISBN | : 9781722839796 |
Brooks has been looking at these relationships since the mid '90s, and entered into a multi-year collaboration with Johannes Adam in 2014. And he has assembled 27-plus years of knowledge into these pages. Detailed PCB trace current/temperature charts cover 7 trace thicknesses and 11 trace widths: 1/4, 1/2, 1.0, 2.0, 3.0, 4.0, and 5.0 Oz trace thicknesses and 15, 25, 50, 80, 100, 150, 200, 250, 300, 400, and 500 mil trace widths. The text summarizes the factors that influence trace heating (i^2R) and trace cooling (thermal conductivity through the dielectric, convection, and radiation.) Internal traces are cooler than external traces because the thermal conductivity through the dielectric is more efficient. The change between internal and external temperatures increases as the external temperature increases, and also as the trace depth increases. Guidelines are provided to help estimate an internal trace temperature based on what the external temperature is/would be and the relative depth of the trace. The charts are based on the work Brooks and Adam did in their recent book, "PCB Trace and Via Temperatures: The Complete Analysis," 2nd Edition, 2017 (available on Amazon.com) and on subsequent modeling using Dr. Adam's simulation software Thermal Risk Management (TRM). Table of Contents 1.0 Introduction and Background 2.0 Description 2.1 Factors Leading to Heating 2.2 Factors Leading to Cooling 2.3 How Hot Is Too Hot? 3.0 Internal Traces 4.0 Accuracy 4.1 How Do We Measure Trace Temperature 4.2 Estimate Accuracy 5.0 Current Temperature Charts Notes and References Appendices
| Author | : Douglas Brooks |
| Publisher | : Pearson Education |
| Total Pages | : 342 |
| Release | : 2013 |
| Genre | : Technology & Engineering |
| ISBN | : 0133415333 |
Building on his widely praised seminars, Brooks explains what current is, how it flows, and how it reacts. He begins by reviewing the nature of current, and then explains current flow in basic circuits, discusses sources that supply and drive current, and addresses the unique problems associated with current on PCBs.
| Author | : F. Patrick McCluskey |
| Publisher | : CRC Press |
| Total Pages | : 354 |
| Release | : 1996-12-13 |
| Genre | : Technology & Engineering |
| ISBN | : 9780849396236 |
The development of electronics that can operate at high temperatures has been identified as a critical technology for the next century. Increasingly, engineers will be called upon to design avionics, automotive, and geophysical electronic systems requiring components and packaging reliable to 200 °C and beyond. Until now, however, they have had no single resource on high temperature electronics to assist them. Such a resource is critically needed, since the design and manufacture of electronic components have now made it possible to design electronic systems that will operate reliably above the traditional temperature limit of 125 °C. However, successful system development efforts hinge on a firm understanding of the fundamentals of semiconductor physics and device processing, materials selection, package design, and thermal management, together with a knowledge of the intended application environments. High Temperature Electronics brings together this essential information and presents it for the first time in a unified way. Packaging and device engineers and technologists will find this book required reading for its coverage of the techniques and tradeoffs involved in materials selection, design, and thermal management and for its presentation of best design practices using actual fielded systems as examples. In addition, professors and students will find this book suitable for graduate-level courses because of its detailed level of explanation and its coverage of fundamental scientific concepts. Experts from the field of high temperature electronics have contributed to nine chapters covering topics ranging from semiconductor device selection to testing and final assembly.
| Author | : Douglas Brooks |
| Publisher | : Prentice Hall Professional |
| Total Pages | : 418 |
| Release | : 2003 |
| Genre | : Computers |
| ISBN | : 9780131418844 |
Complicated concepts explained succinctly and in laymen's terms to both experienced and novice PCB designers. Numerous examples allow reader to visualize how high-end software simulators see various types of SI problems and then their solutions. Author is a frequent and recognized seminar leader in the industry.
| Author | : Jens Lienig |
| Publisher | : Springer |
| Total Pages | : 171 |
| Release | : 2018-02-23 |
| Genre | : Technology & Engineering |
| ISBN | : 3319735586 |
The book provides a comprehensive overview of electromigration and its effects on the reliability of electronic circuits. It introduces the physical process of electromigration, which gives the reader the requisite understanding and knowledge for adopting appropriate counter measures. A comprehensive set of options is presented for modifying the present IC design methodology to prevent electromigration. Finally, the authors show how specific effects can be exploited in present and future technologies to reduce electromigration’s negative impact on circuit reliability.
| Author | : Ron Mancini |
| Publisher | : Newnes |
| Total Pages | : 470 |
| Release | : 2003 |
| Genre | : Technology & Engineering |
| ISBN | : 0750677015 |
The operational amplifier ("op amp") is the most versatile and widely used type of analog IC, used in audio and voltage amplifiers, signal conditioners, signal converters, oscillators, and analog computing systems. Almost every electronic device uses at least one op amp. This book is Texas Instruments' complete professional-level tutorial and reference to operational amplifier theory and applications. Among the topics covered are basic op amp physics (including reviews of current and voltage division, Thevenin's theorem, and transistor models), idealized op amp operation and configuration, feedback theory and methods, single and dual supply operation, understanding op amp parameters, minimizing noise in op amp circuits, and practical applications such as instrumentation amplifiers, signal conditioning, oscillators, active filters, load and level conversions, and analog computing. There is also extensive coverage of circuit construction techniques, including circuit board design, grounding, input and output isolation, using decoupling capacitors, and frequency characteristics of passive components. The material in this book is applicable to all op amp ICs from all manufacturers, not just TI. Unlike textbook treatments of op amp theory that tend to focus on idealized op amp models and configuration, this title uses idealized models only when necessary to explain op amp theory. The bulk of this book is on real-world op amps and their applications; considerations such as thermal effects, circuit noise, circuit buffering, selection of appropriate op amps for a given application, and unexpected effects in passive components are all discussed in detail. *Published in conjunction with Texas Instruments *A single volume, professional-level guide to op amp theory and applications *Covers circuit board layout techniques for manufacturing op amp circuits.
| Author | : Kraig Mitzner |
| Publisher | : Elsevier |
| Total Pages | : 529 |
| Release | : 2011-04-01 |
| Genre | : Technology & Engineering |
| ISBN | : 0080549209 |
Complete PCB Design Using OrCad Capture and Layout provides instruction on how to use the OrCAD design suite to design and manufacture printed circuit boards. The book is written for both students and practicing engineers who need a quick tutorial on how to use the software and who need in-depth knowledge of the capabilities and limitations of the software package. There are two goals the book aims to reach: The primary goal is to show the reader how to design a PCB using OrCAD Capture and OrCAD Layout. Capture is used to build the schematic diagram of the circuit, and Layout is used to design the circuit board so that it can be manufactured. The secondary goal is to show the reader how to add PSpice simulation capabilities to the design, and how to develop custom schematic parts, footprints and PSpice models. Often times separate designs are produced for documentation, simulation and board fabrication. This book shows how to perform all three functions from the same schematic design. This approach saves time and money and ensures continuity between the design and the manufactured product. Information is presented in the exact order a circuit and PCB are designed Straightforward, realistic examples present the how and why the designs work, providing a comprehensive toolset for understanding the OrCAD software Introduction to the IPC, JEDEC, and IEEE standards relating to PCB design Full-color interior and extensive illustrations allow readers to learn features of the product in the most realistic manner possible
