Twenty First IEEE/CPMT International Electronics Manufacturing Technology Symposium, October 13-15, 1997, Austin, TX, USA

Twenty First IEEE/CPMT International Electronics Manufacturing Technology Symposium, October 13-15, 1997, Austin, TX, USA
Author: Don Millard
Publisher: Institute of Electrical & Electronics Engineers(IEEE)
Total Pages: 504
Release: 1997
Genre: Ball grid array technology
ISBN:

The IEMT symposium provides a forum for sharing experiences and knowledge based on microelectronic research and development. This volume is the result of the 1997 symposium and topics include: flip chip and TAB, substrate, soldering process, manufacturing, and packaging technology.

1998 IEEE/CPMT 22nd International Electronics Manufacturing & Technology Symposium

1998 IEEE/CPMT 22nd International Electronics Manufacturing & Technology Symposium
Author:
Publisher: Institute of Electrical & Electronics Engineers(IEEE)
Total Pages: 165
Release: 1998
Genre: Technology & Engineering
ISBN: 9780780345201

This text on electronics manufacturing technology covers such topics as: new materials, including substrates, metallization, encapsulants and fatigue-resistant solder; test and reliability; thermal management; mechantronics; MCMs; sensors; and flip chip in automotive use.