1998 Ieee/Cpmt 23rd Electronics Manufacturing Technology, Iemt
Author | : IEEE |
Publisher | : |
Total Pages | : 500 |
Release | : 1998-11 |
Genre | : Technology & Engineering |
ISBN | : 9780780345249 |
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Author | : IEEE |
Publisher | : |
Total Pages | : 500 |
Release | : 1998-11 |
Genre | : Technology & Engineering |
ISBN | : 9780780345249 |
Author | : |
Publisher | : |
Total Pages | : 479 |
Release | : 1999 |
Genre | : Electronic apparatus and appliances |
ISBN | : 9780780355026 |
Author | : |
Publisher | : |
Total Pages | : 470 |
Release | : 2003 |
Genre | : Electronic apparatus and appliances |
ISBN | : |
Author | : IEEE, Components, Packaging and Manufacturing Technology Society Staff |
Publisher | : Institute of Electrical & Electronics Engineers(IEEE) |
Total Pages | : 494 |
Release | : 1999-10 |
Genre | : Ball grid array technology |
ISBN | : 9780780355026 |
Author | : IEMT |
Publisher | : |
Total Pages | : 388 |
Release | : 2000 |
Genre | : Technology & Engineering |
ISBN | : 9780780366213 |
Author | : Don Millard |
Publisher | : Institute of Electrical & Electronics Engineers(IEEE) |
Total Pages | : 504 |
Release | : 1997 |
Genre | : Ball grid array technology |
ISBN | : |
The IEMT symposium provides a forum for sharing experiences and knowledge based on microelectronic research and development. This volume is the result of the 1997 symposium and topics include: flip chip and TAB, substrate, soldering process, manufacturing, and packaging technology.
Author | : IEEE/CPMT/SEMI International Electronics Manufacturing Technology Symposium |
Publisher | : |
Total Pages | : |
Release | : 2004 |
Genre | : Ball grid array technology |
ISBN | : |
Author | : |
Publisher | : Institute of Electrical & Electronics Engineers(IEEE) |
Total Pages | : 165 |
Release | : 1998 |
Genre | : Technology & Engineering |
ISBN | : 9780780345201 |
This text on electronics manufacturing technology covers such topics as: new materials, including substrates, metallization, encapsulants and fatigue-resistant solder; test and reliability; thermal management; mechantronics; MCMs; sensors; and flip chip in automotive use.
Author | : |
Publisher | : IEEE |
Total Pages | : 223 |
Release | : 2007 |
Genre | : Technology & Engineering |
ISBN | : 9781424413355 |