Moisture Sensitivity
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Author | : X.J. Fan |
Publisher | : Springer Science & Business Media |
Total Pages | : 573 |
Release | : 2010-07-23 |
Genre | : Technology & Engineering |
ISBN | : 1441957197 |
Moisture Sensitivity of Plastic Packages of IC Devices provides information on the state-of-the-art techniques and methodologies related to moisture issues in plastic packages. The most updated, in-depth and systematic technical and theoretical approaches are addressed in the book. Numerous industrial applications are provided, along with the results of the most recent research and development efforts, including, but not limited to: thorough exploration of moisture's effects based on lectures and tutorials by the authors, consistent focus on solution-based approaches and methodologies for improved reliability in plastic packaging, emerging theories and cutting-edge industiral applications presented by the leading professionals in the field. Moisture plays a key role in the reliability of plastic packages of IC devices, and moisture-induced failures have become an increasing concern with the development of advanced IC devices. This second volume in the Micro- and Opto-Electronic Materials, Structures, and Systems series is a must-read for researchers and engineers alike.
Author | : Shashidhara S. R. Marikunte |
Publisher | : |
Total Pages | : 334 |
Release | : 1992 |
Genre | : Cement composites |
ISBN | : |
Author | : |
Publisher | : ASM International |
Total Pages | : 813 |
Release | : 2004-01-01 |
Genre | : Technology & Engineering |
ISBN | : 0871708043 |
For newcomers cast into the waters to sink or swim as well as seasoned professionals who want authoritative guidance desk-side, this hefty volume updates the previous (1999) edition. It contains the work of expert contributors who rallied to the job in response to a committee's call for help (the committee was assigned to the update by the Electron
Author | : Mansour Solaimanian |
Publisher | : Transportation Research Board |
Total Pages | : 79 |
Release | : 2007 |
Genre | : Bituminous materials |
ISBN | : 0309099064 |
Explores whether combining the environmental conditioning system with the simple performance test would provide a superior procedure for determining the moisture susceptibility of hot-mix asphalt (HMA).
Author | : Amy Epps Martin |
Publisher | : Transportation Research Board |
Total Pages | : 109 |
Release | : 2014 |
Genre | : Technology & Engineering |
ISBN | : 030928368X |
"TRB's National Cooperative Highway Research Program (NCHRP) Report 763: Evaluation of the Moisture Susceptibility of WMA Technologies presents proposed guidelines for identifying potential moisture susceptibility in warm mix asphalt (WMA). The report also suggests potential revisions to the Appendix to AASHTO R 35, "Special Mixture Design Considerations and Methods for WMA" as a means to implement the guidelines."--publisher's description
Author | : Sanka Ganesan |
Publisher | : John Wiley & Sons |
Total Pages | : 796 |
Release | : 2006-03-31 |
Genre | : Technology & Engineering |
ISBN | : 0470007796 |
Lead-free Electronics provides guidance on the design and use of lead-free electronics as well as technical and legislative perspectives. All the complex challenges confronting the elec-tronics industry are skillfully addressed: * Complying with state legislation * Implementing the transition to lead-free electronics, including anticipating associated costs and potential supply chain issues * Understanding intellectual property issues in lead-free alloys and their applications, including licensing and infringement * Implementing cost effective manufacturing and testing * Reducing risks due to tin whiskers * Finding lead-free solutions in harsh environments such as in the automotive and telecommunications industries * Understanding the capabilities and limitations of conductive adhesives in lead-free interconnects * Devising solutions for lead-free, flip-chip interconnects in high-performance integrated circuit products Each chapter is written by leading experts in the field and carefully edited to ensure a consistent approach. Readers will find all the latest information, including the most recent data on cyclic thermomechanical deformation properties of lead-free SnAgCu alloys and a comparison of the properties of standard Sn-Pb versus lead-free alloys, using the energy partitioning approach. With legislative and market pressure to eliminate the use of lead in electronics manufacturing, this timely publication is essential reading for all engineers and professionals in the electronics industry.
Author | : Karl J. Puttlitz |
Publisher | : Springer Science & Business Media |
Total Pages | : 1250 |
Release | : 2012-12-06 |
Genre | : Technology & Engineering |
ISBN | : 1461513898 |
Microelectronic packaging has been recognized as an important "enabler" for the solid state revolution in electronics which we have witnessed in the last third of the twentieth century. Packaging has provided the necessary external wiring and interconnection capability for transistors and integrated circuits while they have gone through their own spectacular revolution from discrete device to gigascale integration. At IBM we are proud to have created the initial, simple concept of flip chip with solder bump connections at a time when a better way was needed to boost the reliability and improve the manufacturability of semiconductors. The basic design which was chosen for SLT (Solid Logic Technology) in the 1960s was easily extended to integrated circuits in the '70s and VLSI in the '80s and '90s. Three I/O bumps have grown to 3000 with even more anticipated for the future. The package families have evolved from thick-film (SLT) to thin-film (metallized ceramic) to co-fired multi-layer ceramic. A later family or ceramics with matching expansivity to sili con and copper internal wiring was developed as a predecessor of the chip interconnection revolution in copper, multilevel, submicron wiring. Powerful server packages have been de veloped in which the combined chip and package copper wiring exceeds a kilometer. All of this was achieved with the constant objective of minimizing circuit delays through short, efficient interconnects.
Author | : Prasad S. Thenkabail |
Publisher | : CRC Press |
Total Pages | : 612 |
Release | : 2018-12-07 |
Genre | : Technology & Engineering |
ISBN | : 1351673289 |
Written by leading global experts, including pioneers in the field, the four-volume set on Hyperspectral Remote Sensing of Vegetation, Second Edition, reviews existing state-of-the-art knowledge, highlights advances made in different areas, and provides guidance for the appropriate use of hyperspectral data in the study and management of agricultural crops and natural vegetation. Volume I, Fundamentals, Sensor Systems, Spectral Libraries, and Data Mining for Vegetation introduces the fundamentals of hyperspectral or imaging spectroscopy data, including hyperspectral data processes, sensor systems, spectral libraries, and data mining and analysis, covering both the strengths and limitations of these topics. This book also presents and discusses hyperspectral narrowband data acquired in numerous unique spectral bands in the entire length of the spectrum from various ground-based, airborne, and spaceborne platforms. The concluding chapter provides readers with useful guidance on the highlights and essence of Volume I through the editors’ perspective. Key Features of Volume I: Provides the fundamentals of hyperspectral remote sensing used in agricultural crops and vegetation studies. Discusses the latest advances in hyperspectral remote sensing of ecosystems and croplands. Develops online hyperspectral libraries, proximal sensing and phenotyping for understanding, modeling, mapping, and monitoring crop and vegetation traits. Implements reflectance spectroscopy of soils and vegetation. Enumerates hyperspectral data mining and data processing methods, approaches, and machine learning algorithms. Explores methods and approaches for data mining and overcoming data redundancy; Highlights the advanced methods for hyperspectral data processing steps by developing or implementing appropriate algorithms and coding the same for processing on a cloud computing platform like the Google Earth Engine. Integrates hyperspectral with other data, such as the LiDAR data, in the study of vegetation. Includes best global expertise on hyperspectral remote sensing of agriculture, crop water use, plant species detection, crop productivity and water productivity mapping, and modeling.
Author | : Jerry C. Whitaker |
Publisher | : CRC Press |
Total Pages | : 2626 |
Release | : 1996-12-23 |
Genre | : Technology & Engineering |
ISBN | : 9780849383458 |
The superb organization of The Electronics Handbook means that it is not only a comprehensive and fascinating reference, but also a pleasure to use. Some of these organizational features include:
Author | : |
Publisher | : |
Total Pages | : 678 |
Release | : 1986 |
Genre | : Coal mines and mining |
ISBN | : |