Modeling And Analysis Of Thermally Aware Substrate Noise Coupling In Nanometer Scale Mixed Signal Ics
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Author | : Edoardo Charbon |
Publisher | : Springer Science & Business Media |
Total Pages | : 178 |
Release | : 2007-05-08 |
Genre | : Technology & Engineering |
ISBN | : 0306481715 |
In the past decade, substrate noise has had a constant and significant impact on the design of analog and mixed-signal integrated circuits. Only recently, with advances in chip miniaturization and innovative circuit design, has substrate noise begun to plague fully digital circuits as well. To combat the effects of substrate noise, heavily over-designed structures are generally adopted, thus seriously limiting the advantages of innovative technologies. Substrate Noise: Analysis and Optimization for IC Design addresses the main problems posed by substrate noise from both an IC and a CAD designer perspective. The effects of substrate noise on performance in digital, analog, and mixed-signal circuits are presented, along with the mechanisms underlying noise generation, injection, and transport. Popular solutions to the substrate noise problem and the trade-offs often debated by designers are extensively discussed. Non-traditional approaches as well as semi-automated techniques to combat substrate noise are also addressed. Substrate Noise: Analysis and Optimization for IC Design will be of interest to researchers and professionals interested in signal integrity, as well as to mixed signal and RF designers.
Author | : Yong Zhan |
Publisher | : Now Publishers Inc |
Total Pages | : 131 |
Release | : 2008 |
Genre | : Integrated circuits |
ISBN | : 1601981708 |
Provides an overview of analysis and optimization techniques for thermally-aware chip design.
Author | : Aida Todri-Sanial |
Publisher | : CRC Press |
Total Pages | : 409 |
Release | : 2017-12-19 |
Genre | : Technology & Engineering |
ISBN | : 1351830198 |
Physical Design for 3D Integrated Circuits reveals how to effectively and optimally design 3D integrated circuits (ICs). It also analyzes the design tools for 3D circuits while exploiting the benefits of 3D technology. The book begins by offering an overview of physical design challenges with respect to conventional 2D circuits, and then each chapter delivers an in-depth look at a specific physical design topic. This comprehensive reference: Contains extensive coverage of the physical design of 2.5D/3D ICs and monolithic 3D ICs Supplies state-of-the-art solutions for challenges unique to 3D circuit design Features contributions from renowned experts in their respective fields Physical Design for 3D Integrated Circuits provides a single, convenient source of cutting-edge information for those pursuing 2.5D/3D technology.
Author | : |
Publisher | : |
Total Pages | : 776 |
Release | : 1995 |
Genre | : Dissertations, Academic |
ISBN | : |
Author | : Saraju Mohanty |
Publisher | : McGraw Hill Professional |
Total Pages | : 829 |
Release | : 2015-02-20 |
Genre | : Technology & Engineering |
ISBN | : 0071823034 |
Covering both the classical and emerging nanoelectronic technologies being used in mixed-signal design, this book addresses digital, analog, and memory components. Winner of the Association of American Publishers' 2016 PROSE Award in the Textbook/Physical Sciences & Mathematics category. Nanoelectronic Mixed-Signal System Design offers professionals and students a unified perspective on the science, engineering, and technology behind nanoelectronics system design. Written by the director of the NanoSystem Design Laboratory at the University of North Texas, this comprehensive guide provides a large-scale picture of the design and manufacturing aspects of nanoelectronic-based systems. It features dual coverage of mixed-signal circuit and system design, rather than just digital or analog-only. Key topics such as process variations, power dissipation, and security aspects of electronic system design are discussed. Top-down analysis of all stages--from design to manufacturing Coverage of current and developing nanoelectronic technologies--not just nano-CMOS Describes the basics of nanoelectronic technology and the structure of popular electronic systems Reveals the techniques required for design excellence and manufacturability
Author | : Soumya Pandit |
Publisher | : CRC Press |
Total Pages | : 397 |
Release | : 2018-09-03 |
Genre | : Technology & Engineering |
ISBN | : 1466564288 |
Reliability concerns and the limitations of process technology can sometimes restrict the innovation process involved in designing nano-scale analog circuits. The success of nano-scale analog circuit design requires repeat experimentation, correct analysis of the device physics, process technology, and adequate use of the knowledge database. Starting with the basics, Nano-Scale CMOS Analog Circuits: Models and CAD Techniques for High-Level Design introduces the essential fundamental concepts for designing analog circuits with optimal performances. This book explains the links between the physics and technology of scaled MOS transistors and the design and simulation of nano-scale analog circuits. It also explores the development of structured computer-aided design (CAD) techniques for architecture-level and circuit-level design of analog circuits. The book outlines the general trends of technology scaling with respect to device geometry, process parameters, and supply voltage. It describes models and optimization techniques, as well as the compact modeling of scaled MOS transistors for VLSI circuit simulation. • Includes two learning-based methods: the artificial neural network (ANN) and the least-squares support vector machine (LS-SVM) method • Provides case studies demonstrating the practical use of these two methods • Explores circuit sizing and specification translation tasks • Introduces the particle swarm optimization technique and provides examples of sizing analog circuits • Discusses the advanced effects of scaled MOS transistors like narrow width effects, and vertical and lateral channel engineering Nano-Scale CMOS Analog Circuits: Models and CAD Techniques for High-Level Design describes the models and CAD techniques, explores the physics of MOS transistors, and considers the design challenges involving statistical variations of process technology parameters and reliability constraints related to circuit design.
Author | : R. Jacob Baker |
Publisher | : John Wiley & Sons |
Total Pages | : 1074 |
Release | : 2008 |
Genre | : Technology & Engineering |
ISBN | : 0470229411 |
This edition provides an important contemporary view of a wide range of analog/digital circuit blocks, the BSIM model, data converter architectures, and more. The authors develop design techniques for both long- and short-channel CMOS technologies and then compare the two.
Author | : Cosmin Iorga |
Publisher | : Noisecoupling.com |
Total Pages | : 271 |
Release | : 2008 |
Genre | : Electronic circuits |
ISBN | : 9780615197562 |
Author | : Mikhail Popovich |
Publisher | : Springer Science & Business Media |
Total Pages | : 532 |
Release | : 2007-10-08 |
Genre | : Technology & Engineering |
ISBN | : 0387716017 |
This book provides insight into the behavior and design of power distribution systems for high speed, high complexity integrated circuits. Also presented are criteria for estimating minimum required on-chip decoupling capacitance. Techniques and algorithms for computer-aided design of on-chip power distribution networks are also described; however, the emphasis is on developing circuit intuition and understanding the principles that govern the design and operation of power distribution systems.
Author | : Gennady Gildenblat |
Publisher | : Springer Science & Business Media |
Total Pages | : 531 |
Release | : 2010-06-22 |
Genre | : Technology & Engineering |
ISBN | : 9048186145 |
Most of the recent texts on compact modeling are limited to a particular class of semiconductor devices and do not provide comprehensive coverage of the field. Having a single comprehensive reference for the compact models of most commonly used semiconductor devices (both active and passive) represents a significant advantage for the reader. Indeed, several kinds of semiconductor devices are routinely encountered in a single IC design or in a single modeling support group. Compact Modeling includes mostly the material that after several years of IC design applications has been found both theoretically sound and practically significant. Assigning the individual chapters to the groups responsible for the definitive work on the subject assures the highest possible degree of expertise on each of the covered models.