Modeling and Analysis of Electrical Properties of Polycrystalline Silicon Films
Author | : Yunsheng Wang |
Publisher | : |
Total Pages | : 128 |
Release | : 1990 |
Genre | : Polycrystalline semiconductors |
ISBN | : |
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Author | : Yunsheng Wang |
Publisher | : |
Total Pages | : 128 |
Release | : 1990 |
Genre | : Polycrystalline semiconductors |
ISBN | : |
Author | : |
Publisher | : |
Total Pages | : |
Release | : 1981 |
Genre | : |
ISBN | : |
Research in 1980/81 was carried out in three areas: (i) electron diffraction experiments on diffusion bonded (welded) boundaries; (ii) combined EBIC and high voltage transmission electron microscopy in order to investigate the correlation between structure and electrical properties and (iii) passivation of the electrical activity of crystal defects with hydrogen. The diffraction experiments did not furnish new information on the structure of grain boundaries in silicon, but were valuable as a check on the previous findings. In addition, they offered the possibility to separate double diffraction effects from boundary scattering. The combined EBIC and HVTEM experiments established (for the first time) unambiguously that coherent twin boundaries per se are not electrically active. The localized electrical activity observed in coherent twin boundaries is due to the presence of intrinsic dislocations, which are partial dislocations of the Schottky type. However, not all partial dislocations studied were electrically active, for reasons which are not completely understood. The combined EBIC and HVTEM investigations showed further (again for the first time) that many of the linear boundaries which were previously assumed to be coherent twin boundaries are second order twins, and that these twins are strongly electrically active. In passivation experiments, it is necessary to separate influence of the heat treatment from those of hydrogen. Passivation reduces the activity of some, but not of all defects. Passivation is particularly effective in reducing the electrical activity of deformation induced dislocations, which conceivably have a different core structure from grown-in dislocations.
Author | : W. H. Shafer |
Publisher | : Plenum Publishing Corporation |
Total Pages | : 392 |
Release | : 1992 |
Genre | : Education |
ISBN | : 9780306443480 |
Masters Theses Listed by Discipline: Aerospace Engineering. Agricultural Economics, Sciences and Engineering. Architechtural Engineering and Urban Planning. Astronomy. Astrophysics. Ceramic Engineering. Communications Engineering and Computer Science. Cryogenic Engineering. Electrical Engineering. Engineering Mechanics. Engineering Physics. Engineering Science. Fuels, Combustion, and Air Pollution. General and Environmental Engineering. Geochemistry and Soil Science. Geological Sciences and Geophysical Engineering. Geology and Earth Science. Geophysics. Industrial Engineering. Marine and Ocean Engineering. Materials Science and Engineering. Mechanical Engineering and Bioengineering. Metallurgy. Meteorology and Atmospheric Science. 17 additional disciplines. Index.
Author | : Arokia Nathan |
Publisher | : Springer Science & Business Media |
Total Pages | : 445 |
Release | : 2012-12-06 |
Genre | : Technology & Engineering |
ISBN | : 3709164281 |
Computer-aided-design (CAD) of semiconductor microtransducers is relatively new in contrast to their counterparts in the integrated circuit world. Integrated silicon microtransducers are realized using microfabrication techniques similar to those for standard integrated circuits (ICs). Unlike IC devices, however, microtransducers must interact with their environment, so their numerical simulation is considerably more complex. While the design of ICs aims at suppressing "parasitic” effects, microtransducers thrive on optimizing the one or the other such effect. The challenging quest for physical models and simulation tools enabling microtransducer CAD is the topic of this book. The book is intended as a text for graduate students in Electrical Engineering and Physics and as a reference for CAD engineers in the microsystems industry.