Microchip Fabrication Sixth Edition
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| Author | : Peter Van Zant |
| Publisher | : McGraw Hill Professional |
| Total Pages | : 658 |
| Release | : 2004-06-09 |
| Genre | : Technology & Engineering |
| ISBN | : 0071501398 |
The #1 book in the industry for more than 15 years! Utilizing a straightforward, math-free pathology, this is a novice-friendly guide to the semiconductor fabrication process from raw materials through shipping the finished, packaged device. Challenging quizzes and review summaries make this the perfect learning guide for technicians in training. * NEW chapter on nanotechnology * NEW sections on 300mm wafer processing * Processes and devices, and Green processing * Every chapter updated to reflect the latest processing techniques
| Author | : Jan Mazurek |
| Publisher | : MIT Press |
| Total Pages | : 266 |
| Release | : 1998-12-07 |
| Genre | : Science |
| ISBN | : 9780262263641 |
An examination of the environmental and economic implications of the computer microchip industry's exodus from California's Silicon Valley to New Mexico, Virginia, Ireland, and Taiwan. In Making Microchips, Jan Mazurek examines the environmental and economic implications of the computer microchip industry's exodus from California's Silicon Valley to New Mexico, Virginia, Ireland, and Taiwan. Globalization, economic restructuring, and changing manufacturing processes in this rapidly growing industry present difficult new questions for environmental policy. Mazurek challenges the assumptions of U.S. policies designed to promote the competitiveness of domestic microchip makers. She argues that, although these initiatives focus on the economic effects of environmental regulation, they fail to acknowledge how economic and organizational changes within the industry collide with and often confound efforts to monitor and manage pollution from chemicals used in microchip manufacturing. Despite its reputation as a clean industry, microchip manufacturing is fraught with hazards. More than sixty dangerous acids, solvents, caustics, and gases are used to make microchips, and some of them are suspected to be carcinogens and/or reproductive toxins. Mazurek describes the environmental by-products of chipmaking, including soil contamination, air and water pollution, and damage to human health. Applying insights from economic geography to questions of how and where companies organize production, she shows how Silicon Valley played a pivotal role in the development of the microchip. Pairing federal environmental data with structural and geographic information on the six firms that continue to build wafer fabrication plants in the United States, she demonstrates how reorganization and relocation of manufacturing facilities divert attention from trends in toxic emissions and how they complicate public and private efforts to improve the industry's environmental performance. In the concluding chapter, Mazurek marshals her findings in a broader analysis of the expansion of global manufacturing and the resultant environmental problems.
| Author | : Gary S. May |
| Publisher | : John Wiley & Sons |
| Total Pages | : 428 |
| Release | : 2006-05-26 |
| Genre | : Technology & Engineering |
| ISBN | : 0471790273 |
A practical guide to semiconductor manufacturing from processcontrol to yield modeling and experimental design Fundamentals of Semiconductor Manufacturing and Process Controlcovers all issues involved in manufacturing microelectronic devicesand circuits, including fabrication sequences, process control,experimental design, process modeling, yield modeling, and CIM/CAMsystems. Readers are introduced to both the theory and practice ofall basic manufacturing concepts. Following an overview of manufacturing and technology, the textexplores process monitoring methods, including those that focus onproduct wafers and those that focus on the equipment used toproduce wafers. Next, the text sets forth some fundamentals ofstatistics and yield modeling, which set the foundation for adetailed discussion of how statistical process control is used toanalyze quality and improve yields. The discussion of statistical experimental design offers readers apowerful approach for systematically varying controllable processconditions and determining their impact on output parameters thatmeasure quality. The authors introduce process modeling concepts,including several advanced process control topics such asrun-by-run, supervisory control, and process and equipmentdiagnosis. Critical coverage includes the following: * Combines process control and semiconductor manufacturing * Unique treatment of system and software technology and managementof overall manufacturing systems * Chapters include case studies, sample problems, and suggestedexercises * Instructor support includes electronic copies of the figures andan instructor's manual Graduate-level students and industrial practitioners will benefitfrom the detailed exami?nation of how electronic materials andsupplies are converted into finished integrated circuits andelectronic products in a high-volume manufacturingenvironment. An Instructor's Manual presenting detailed solutions to all theproblems in the book is available from the Wiley editorialdepartment. An Instructor Support FTP site is also available.
| Author | : Peter Van Zant |
| Publisher | : McGraw Hill Professional |
| Total Pages | : 577 |
| Release | : 2013-10-22 |
| Genre | : Technology & Engineering |
| ISBN | : 0071821023 |
The most complete, current guide to semiconductor processing Fully revised to cover the latest advances in the field, Microchip Fabrication, Sixth Edition explains every stage of semiconductor processing, from raw material preparation to testing to packaging and shipping the finished device. This practical resource provides easy-to-understand information on the physics, chemistry, and electronic fundamentals underlying the sophisticated manufacturing materials and processes of modern semiconductors. State-of-the-art processes and cutting-edge technologies used in the patterning, doping, and layering steps are discussed in this new edition. Filled with detailed illustrations and real-world examples, this is a comprehensive, up-to-date introduction to the technological backbone of the high-tech industry. COVERAGE INCLUDES: The semiconductor industry Properties of semiconductor materials and chemicals Crystal growth and silicon wafer preparation Wafer fabrication and packaging Contamination control Productivity and process yields Oxidation The ten-step patterning process--surface preparation to exposure; developing to final inspection Next generation lithography Doping Layer deposition Metallization Process and device evaluation The business of wafer fabrication Devices and integrated circuit formation Integrated circuits Packaging
| Author | : Stephen A. Campbell |
| Publisher | : OUP USA |
| Total Pages | : 0 |
| Release | : 2008-01-10 |
| Genre | : Technology & Engineering |
| ISBN | : 9780195320176 |
Designed for advanced undergraduate or first-year graduate courses in semiconductor or microelectronic fabrication, the third edition of Fabrication Engineering at the Micro and Nanoscale provides a thorough and accessible introduction to all fields of micro and nano fabrication.
| Author | : Peter Van Zant |
| Publisher | : McGraw-Hill Education |
| Total Pages | : 576 |
| Release | : 2014-01-07 |
| Genre | : Technology & Engineering |
| ISBN | : 9780071821018 |
Publisher's Note: Products purchased from Third Party sellers are not guaranteed by the publisher for quality, authenticity, or access to any online entitlements included with the product. The most complete, current guide to semiconductor processing Fully revised to cover the latest advances in the field, Microchip Fabrication, Sixth Edition explains every stage of semiconductor processing, from raw material preparation to testing to packaging and shipping the finished device. This practical resource provides easy-to-understand information on the physics, chemistry, and electronic fundamentals underlying the sophisticated manufacturing materials and processes of modern semiconductors. State-of-the-art processes and cutting-edge technologies used in the patterning, doping, and layering steps are discussed in this new edition. Filled with detailed illustrations and real-world examples, this is a comprehensive, up-to-date introduction to the technological backbone of the high-tech industry. COVERAGE INCLUDES: The semiconductor industry Properties of semiconductor materials and chemicals Crystal growth and silicon wafer preparation Wafer fabrication and packaging Contamination control Productivity and process yields Oxidation The ten-step patterning process--surface preparation to exposure; developing to final inspection Next generation lithography Doping Layer deposition Metallization Process and device evaluation The business of wafer fabrication Devices and integrated circuit formation Integrated circuits Packaging
| Author | : John D. Joannopoulos |
| Publisher | : Princeton University Press |
| Total Pages | : 305 |
| Release | : 2011-10-30 |
| Genre | : Science |
| ISBN | : 1400828244 |
Since it was first published in 1995, Photonic Crystals has remained the definitive text for both undergraduates and researchers on photonic band-gap materials and their use in controlling the propagation of light. This newly expanded and revised edition covers the latest developments in the field, providing the most up-to-date, concise, and comprehensive book available on these novel materials and their applications. Starting from Maxwell's equations and Fourier analysis, the authors develop the theoretical tools of photonics using principles of linear algebra and symmetry, emphasizing analogies with traditional solid-state physics and quantum theory. They then investigate the unique phenomena that take place within photonic crystals at defect sites and surfaces, from one to three dimensions. This new edition includes entirely new chapters describing important hybrid structures that use band gaps or periodicity only in some directions: periodic waveguides, photonic-crystal slabs, and photonic-crystal fibers. The authors demonstrate how the capabilities of photonic crystals to localize light can be put to work in devices such as filters and splitters. A new appendix provides an overview of computational methods for electromagnetism. Existing chapters have been considerably updated and expanded to include many new three-dimensional photonic crystals, an extensive tutorial on device design using temporal coupled-mode theory, discussions of diffraction and refraction at crystal interfaces, and more. Richly illustrated and accessibly written, Photonic Crystals is an indispensable resource for students and researchers. Extensively revised and expanded Features improved graphics throughout Includes new chapters on photonic-crystal fibers and combined index-and band-gap-guiding Provides an introduction to coupled-mode theory as a powerful tool for device design Covers many new topics, including omnidirectional reflection, anomalous refraction and diffraction, computational photonics, and much more.
| Author | : George G. Harman |
| Publisher | : McGraw Hill Professional |
| Total Pages | : 290 |
| Release | : 1997 |
| Genre | : Technology & Engineering |
| ISBN | : 9780070326194 |
The first edition of this work is considered a classic reference in the field. This new edition updates the entire work and adds 100 pages of information covering new materials and techniques such as fine pitch
| Author | : Andrea Chen |
| Publisher | : CRC Press |
| Total Pages | : 216 |
| Release | : 2016-04-19 |
| Genre | : Technology & Engineering |
| ISBN | : 1439862079 |
In semiconductor manufacturing, understanding how various materials behave and interact is critical to making a reliable and robust semiconductor package. Semiconductor Packaging: Materials Interaction and Reliability provides a fundamental understanding of the underlying physical properties of the materials used in a semiconductor package. By tying together the disparate elements essential to a semiconductor package, the authors show how all the parts fit and work together to provide durable protection for the integrated circuit chip within as well as a means for the chip to communicate with the outside world. The text also covers packaging materials for MEMS, solar technology, and LEDs and explores future trends in semiconductor packages.
| Author | : Hwaiyu Geng |
| Publisher | : McGraw Hill Professional |
| Total Pages | : 915 |
| Release | : 2005-05-18 |
| Genre | : Technology & Engineering |
| ISBN | : 0071445595 |
WORLD-CLASS SEMICONDUCTOR MANUFACTURING EXPERTISE AT YOUR FINGERTIPS This is a comprehensive reference to the semiconductor manufacturing process and ancillary facilities -- from raw material preparation to packaging and testing, applying basics to emerging technologies. Readers charged with optimizing the design and performance of manufacturing processes will find all the information necessary to produce the highest quality chips at the lowest price in the shortest time possible. The Semiconductor Manufacturing Handbook provides leading-edge information on semiconductor wafer processes, MEMS, nanotechnology, and FPD, plus the latest manufacturing and automation technologies, including: Yield Management Automated Material Handling System Fab and Cleanroom Design and Operation Gas Abatement and Waste Treatment Management And much more Written by 60 international experts, and peer reviewed by a seasoned advisory board, this handbook covers the fundamentals of relevant technology and its real-life application and operational considerations for planning, implementing, and controlling manufacturing processes. It includes hundreds of detailed illustrations and a list of relevant books, technical papers, and websites for further research. This inclusive, wide-ranging coverage makes the Semiconductor Manufacturing Handbook the most comprehensive single-volume reference ever published in the field. STATE-OF-THE-ART SEMICONDUCTOR TECHNOLOGIES AND MANUFACTURING PROCESSES: SEMICONDUCTOR FUNDAMENTALS How Chips Are Designed and Made * Substrates * Copper and Low-k Dielectrics * Silicide Formation * Plasma * Vacuum * Photomask WAFER PROCESSING TECHNOLOGIES Microlithography * Ion Implantation * Etch * PVD/ALD * CVD * ECD * Epitaxy * CMP * Wet Cleaning FINAL MANUFACTURING Packaging * Grinding, Stress Relief, Dicing * Inspection, Measurement, and Testing NANOTECHNOLOGY, MEMS, AND FPD GAS AND CHEMICALS Specialty Gas System and DCA * Gas Abatement Systems * Chemical and Slurries Delivery System * Ultra Pure Water FAB YIELD, OPERATIONS, AND FACILITIES Yield Management * Automated Materials Handling System * Metrology * Six Sigma * Advanced Process Control * EHS * Fab Design and Construction * Cleanroom * Vibration and Acoustic Control * ESD * Airborne Molecular Control * Particle Monitoring * Wastewater Neutralization Systems
