Metal Ceramic Interfaces
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| Author | : M. Rühle |
| Publisher | : Elsevier |
| Total Pages | : 448 |
| Release | : 2013-10-22 |
| Genre | : Technology & Engineering |
| ISBN | : 1483287467 |
As engineering materials and structures often contain a metal or metallic alloy bonded to a ceramic, the resultant interface must be able to sustain mechanical forces without failure. They also play an important role in oxidation or reduction of materials. The workshop on 'Bonding, Structure and Mechanical Properties of Metal/Ceramic Interfaces' was held in January 1989 within the Acta/Scripta Metallurgica conference series. It drew together an international collection of 70 scientists who discussed a wide range of issues related to metal-ceramic interfaces. The sessions were divided into 7 categories: structure and bonding, chemistry at interfaces, formation of interfaces, structure of interfaces, thermodynamics/atomistics of interface fracture, mechanics of interface cracks, and fracture resistance of bimaterial interfaces. Within these headings attention was paid to grain boundaries, the influence of chemical processes on the behaviour of interfaces, diffusion bonding, characterization of fracture, and crack propagation by fatigue and by stress corrosion. The book presents a useful reference source for materials scientists, physicists, chemists, and mechanical engineers who are concerned with the roles and properties of interfaces.
| Author | : Kheng-Lim Goh |
| Publisher | : Woodhead Publishing |
| Total Pages | : 584 |
| Release | : 2019-11-27 |
| Genre | : Technology & Engineering |
| ISBN | : 0081027311 |
Interfaces in Particle and Fibre-Reinforced Composites: From Macro- to Nanoscale addresses recent research findings on the particle-matrix interface at different length scales. The book's main focus is on the reinforcement of materials by particles that can result in a composite material of high stiffness and strength, but it also focuses on how the particle interacts with the (matrix) material, which may be a polymer, biological-based material, ceramic or conventional metal. The different types of particle reinforced composites are discussed, as is load transfer at the particle-matrix interface. Readers will learn how to select materials and about particle structure. Significant progress has been made in applying these approaches, thus making this book a timely piece on recent research findings on the particle-matrix interface at different length scales. - Features wide coverage, from polymer, to ceramics and metal-based particulate composites - Structured in a logical order to cover fundamental studies, computer simulations, experimental techniques and characterization
| Author | : Robert Edward Monroe |
| Publisher | : |
| Total Pages | : 86 |
| Release | : 1967 |
| Genre | : Adhesives |
| ISBN | : |
This report supplies information on joining processes applicable to titanium and its alloys in sheet metal applications, primarily related directly to airframe construction. Although the material presented here does not cover all titanium joining processes, and omits such processes as plasma-arc, submerged-arc, electroslag, flash, and high-frequency resistance welding, the data presented cover materials up to 2-inches thick in some cases and the report should be useful to anyone seeking titanium joining information. The joining processes covered fall into five categories: welding, brazing, metallurgical bonding (diffusion and deformation bonding), adhesive bonding, and mechanical fastening. The fusion welding processes that are discussed in detail include gas tungsten arc, gas metal arc, arc spot, and electron beam. The resistance processes give extended coverage are spot, roll spot, and seam welding. (Author).
| Author | : W. Patrick Naylor |
| Publisher | : |
| Total Pages | : 242 |
| Release | : 2019 |
| Genre | : |
| ISBN | : 9780867159875 |
| Author | : S.T. Mileiko |
| Publisher | : Elsevier |
| Total Pages | : 705 |
| Release | : 1997-12-12 |
| Genre | : Technology & Engineering |
| ISBN | : 0080536301 |
Modern scientific and technological fields are frequently of an interdisciplinary nature, and the field of fibrous composites is no exception. Unlike fibre-reinforced plastics, the family of metal- and ceramic-based composites is still quite a new group of materials with a large variety of mechanical and physical properties. Up until now it has been difficult to produce these materials as the necessary technical information has not been well documented.The main purpose of this book is to link together fabrication, structure and properties chains, so as to clarify which structure provides the necessary properties, and how one can attain the correct composite structure. To this end, the book not only contains topics of a purely technical nature, but also a description of the failure mechanics of metal- and ceramic-matrix composites, as this is the key to understanding the structure-properties segment of the chain mentioned.The book is divided into three parts. Part I presents a general view of composites with the accent on metal- and ceramic-matrix composites. It also contains a brief description of modern fibres and composites and can be considered, at least for beginners, as a starting point for further study. Part II looks at the composite microstructures considered to be either optimal or reasonable in resisting a particular loading. Finally Part II describes a variety of mechanical, physical, and chemical potential for organizing these microstructures. Experimental data on technologies, material structures, and material properties are used throughout the book to support theoretical conclusions or to obtain important physical parameters.
| Author | : Ian D. Learmouth |
| Publisher | : Springer Science & Business Media |
| Total Pages | : 42 |
| Release | : 2000 |
| Genre | : Medical |
| ISBN | : 9781852332051 |
Total hip arthroplasty is carried out to relieve pain and restore function and the implant should outlast the patient. However, failure at one of the interfaces represents the commonest cause of failure of total hip replacement. The durability of the fixation interfaces and the articular interface are therefore critical in determining the long-term performance of the implant. This book accesses the opinions of a number of experts in their field on the important issues and factors influencing the component cement and bone cement interface that contribute to durability of fixation in these areas. In addition they explore how this fixation can be influenced both by the design of the implant, the material properties and the cement. The various material combinations that are available at the articular interface are also presented and the wear properties of and generation of debris from the interfaces are revealed.
| Author | : Oliver Diwald |
| Publisher | : John Wiley & Sons |
| Total Pages | : 903 |
| Release | : 2021-09-14 |
| Genre | : Technology & Engineering |
| ISBN | : 1119436745 |
Metal Oxide Nanoparticles A complete nanoparticle resource for chemists and industry professionals Metal oxide nanoparticles are integral to a wide range of natural and technological processes—from mineral transformation to electronics. Additionally, the fields of engineering, electronics, energy technology, and electronics all utilize metal oxide nanoparticle powders. Metal Oxide Nanoparticles: Formation, Functional Properties, and Interfaces presents readers with the most relevant synthesis and formulation approaches for using metal oxide nanoparticles as functional materials. It covers common processing routes and the assessment of physical and chemical particle properties through comprehensive and complementary characterization methods. This book will serve as an introduction to nanoparticle formulation, their interface chemistry and functional properties at the nanoscale. It will also act as an in-depth resource, sharing detailed information on advanced approaches to the physical, chemical, surface, and interface characterization of metal oxide nanoparticle powders and dispersions. Addresses the application of metal oxide nanoparticles and its economic impact Examines particle synthesis, including the principles of selected bottom-up strategies Explores nanoparticle formulation—a selection of processing and application routes Discusses the significance of particle surfaces and interfaces on structure formation, stability and functional materials properties Covers metal oxide nanoparticle characterization at different length scales With this valuable resource, academic researchers, industrial chemists, and PhD students can all gain insight into the synthesis, properties, and applications of metal oxide nanoparticles.
| Author | : Manferd Ruhle |
| Publisher | : |
| Total Pages | : 433 |
| Release | : 1990 |
| Genre | : Ceramic to metal bonding |
| ISBN | : |
| Author | : Kim Ill Yoo |
| Publisher | : CRC Press |
| Total Pages | : 468 |
| Release | : 2024-11-01 |
| Genre | : Technology & Engineering |
| ISBN | : 1040290922 |
The science of ceramic interfaces is multidisciplinary, overlapping several existing, well-established disciplines such as solid-state chemistry, high-temperature chemistry, solid-state electrochemistry, surface science, catalysis and metallurgy. This volume contains the processing’s of the 4th international workshop on ceramic Interfaces held at the Korea Advanced Institute of Science and Technology, Taejon, Korea. 27 specialists from 8 countries contributed of the workshop which was divided into 3 sessions: Microstructural development; Transport; Interfacial Phenomena and Kinetics.
| Author | : R.R. Tummala |
| Publisher | : Springer Science & Business Media |
| Total Pages | : 742 |
| Release | : 2012-12-06 |
| Genre | : Technology & Engineering |
| ISBN | : 1461540860 |
Electronics has become the largest industry, surpassing agriCUlture, auto. and heavy metal industries. It has become the industry of choice for a country to prosper, already having given rise to the phenomenal prosperity of Japan. Korea. Singapore. Hong Kong. and Ireland among others. At the current growth rate, total worldwide semiconductor sales will reach $300B by the year 2000. The key electronic technologies responsible for the growth of the industry include semiconductors. the packaging of semiconductors for systems use in auto, telecom, computer, consumer, aerospace, and medical industries. displays. magnetic, and optical storage as well as software and system technologies. There has been a paradigm shift, however, in these technologies. from mainframe and supercomputer applications at any cost. to consumer applications at approximately one-tenth the cost and size. Personal computers are a good example. going from $500IMIP when products were first introduced in 1981, to a projected $lIMIP within 10 years. Thin. light portable. user friendly and very low-cost are. therefore. the attributes of tomorrow's computing and communications systems. Electronic packaging is defined as interconnection. powering, cool ing, and protecting semiconductor chips for reliable systems. It is a key enabling technology achieving the requirements for reducing the size and cost at the system and product level.
