Mems Nems
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| Author | : Goutam Koley |
| Publisher | : MDPI |
| Total Pages | : 242 |
| Release | : 2019-11-20 |
| Genre | : Technology & Engineering |
| ISBN | : 3039216341 |
Due to the ever-expanding applications of micro/nano-electromechanical systems (NEMS/MEMS) as sensors and actuators, interest in their development has rapidly expanded over the past decade. Encompassing various excitation and readout schemes, the MEMS/NEMS devices transduce physical parameter changes, such as temperature, mass or stress, caused by changes in desired measurands, to electrical signals that can be further processed. Some common examples of NEMS/MEMS sensors include pressure sensors, accelerometers, magnetic field sensors, microphones, radiation sensors, and particulate matter sensors.
| Author | : Zhuoqing Yang |
| Publisher | : Springer Nature |
| Total Pages | : 312 |
| Release | : 2021-10-12 |
| Genre | : Technology & Engineering |
| ISBN | : 303079749X |
This book begins by introducing new and unique fabrication, micromachining, and integration manufacturing methods for MEMS (Micro-Electro-Mechanical Systems) and NEMS (Nano-Electro-Mechanical Systems) devices, as well as novel nanomaterials for sensor fabrications. The second section focuses on novel sensors based on these emerging MEMS/NEMS fabrication methods, and their related applications in industrial, biomedical, and environmental monitoring fields, which makes up the sensing layer (or perception layer) in IoT architecture. This authoritative guide offers graduate students, postgraduates, researchers, and practicing engineers with state-of-the-art processes and cutting-edge technologies on MEMS /NEMS, micro- and nanomachining, and microsensors, addressing progress in the field and prospects for future development. Presents latest international research on MEMS/NEMS fabrication technologies and novel micro/nano sensors; Covers a broad spectrum of sensor applications; Written by leading experts in the field.
| Author | : Cornelius T. Leondes |
| Publisher | : Springer Science & Business Media |
| Total Pages | : 2142 |
| Release | : 2007-10-08 |
| Genre | : Technology & Engineering |
| ISBN | : 0387257861 |
This significant and uniquely comprehensive five-volume reference is a valuable source for research workers, practitioners, computer scientists, students, and technologists. It covers all of the major topics within the subject and offers a comprehensive treatment of MEMS design, fabrication techniques, and manufacturing methods. It also includes current medical applications of MEMS technology and provides applications of MEMS to opto-electronic devices. It is clearly written, self-contained, and accessible, with helpful standard features including an introduction, summary, extensive figures and design examples with comprehensive reference lists.
| Author | : Sergey Edward Lyshevski |
| Publisher | : CRC Press |
| Total Pages | : 461 |
| Release | : 2018-10-03 |
| Genre | : Technology & Engineering |
| ISBN | : 1420040510 |
The development of micro- and nano-mechanical systems (MEMS and NEMS) foreshadows momentous changes not only in the technological world, but in virtually every aspect of human life. The future of the field is bright with opportunities, but also riddled with challenges, ranging from further theoretical development through advances in fabrication technologies, to developing high-performance nano- and microscale systems, devices, and structures, including transducers, switches, logic gates, actuators and sensors. MEMS and NEMS: Systems, Devices, and Structures is designed to help you meet those challenges and solve fundamental, experimental, and applied problems. Written from a multi-disciplinary perspective, this book forms the basis for the synthesis, modeling, analysis, simulation, control, prototyping, and fabrication of MEMS and NEMS. The author brings together the various paradigms, methods, and technologies associated with MEMS and NEMS to show how to synthesize, analyze, design, and fabricate them. Focusing on the basics, he illustrates the development of NEMS and MEMS architectures, physical representations, structural synthesis, and optimization. The applications of MEMS and NEMS in areas such as biotechnology, medicine, avionics, transportation, and defense are virtually limitless. This book helps prepare you to take advantage of their inherent opportunities and effectively solve problems related to their configurations, systems integration, and control.
| Author | : John A. Pelesko |
| Publisher | : CRC Press |
| Total Pages | : 382 |
| Release | : 2002-11-25 |
| Genre | : Mathematics |
| ISBN | : 1420035290 |
Designing small structures necessitates an a priori understanding of various device behaviors. The way to gain such understanding is to construct, analyze, and interpret the proper mathematical model. Through such models, Modeling MEMS and NEMS illuminates microscale and nanoscale phenomena, thereby facilitating the design and optimization o
| Author | : Peter J. Hesketh |
| Publisher | : The Electrochemical Society |
| Total Pages | : 517 |
| Release | : 2006 |
| Genre | : Chemical detectors |
| ISBN | : 1566775108 |
The latest developments in chemical and biological sensor research and development. Topics include: 1. new selective species recognition surfaces and materials; 2. molecular recognition materials and approaches to minimize non-specific binding; 3. semi-selective species recognition materials; 4. novel methods for signal processing, signal amplification, and detection; 5. detection systems for multiple analytes in complex samples; 6. sensor arrays; and 7. analytical systems and approaches.
| Author | : Marc J. Madou |
| Publisher | : CRC Press |
| Total Pages | : 650 |
| Release | : 2011 |
| Genre | : TECHNOLOGY & ENGINEERING |
| ISBN | : 9780429109218 |
From MEMS to Bio-MEMS and Bio-NEMS: Manufacturing Techniques and Applications details manufacturing techniques applicable to bionanotechnology. After reviewing MEMS techniques, materials, and modeling, the author covers nanofabrication, genetically engineered proteins, artificial cells, nanochemistry, and self-assembly. He also discusses scaling laws in MEMS and NEMS, actuators, fluidics, and power and brains in miniature devices. He concludes with coverage of various MEMS and NEMS applications. Fully illustrated in color, the text contains end-of-chapter problems, worked examples, extensive references for further reading, and an extensive glossary of terms.
| Author | : Humberto Campanella |
| Publisher | : Artech House |
| Total Pages | : 364 |
| Release | : 2010 |
| Genre | : Technology & Engineering |
| ISBN | : 1607839784 |
This groundbreaking book provides you with a comprehensive understanding of FBAR (thin-film bulk acoustic wave resonator), MEMS (microelectomechanical system), and NEMS (nanoelectromechanical system) resonators. For the first time anywhere, you find extensive coverage of these devices at both the technology and application levels. This practical reference offers you guidance in design, fabrication, and characterization of FBARs, MEMS and NEBS. It discusses the integration of these devices with standard CMOS (complementary-metal-oxide-semiconductor) technologies, and their application to sensing and RF systems. Moreover, this one-stop resource looks at the main characteristics, differences, and limitations of FBAR, MEMS, and NEMS devices, helping you to choose the right approaches for your projects. Over 280 illustrations and more than 130 equations support key topics throughout the book.
| Author | : Oliver Brand |
| Publisher | : John Wiley & Sons |
| Total Pages | : 512 |
| Release | : 2015-04-22 |
| Genre | : Technology & Engineering |
| ISBN | : 352767635X |
Part of the AMN book series, this book covers the principles, modeling and implementation as well as applications of resonant MEMS from a unified viewpoint. It starts out with the fundamental equations and phenomena that govern the behavior of resonant MEMS and then gives a detailed overview of their implementation in capacitive, piezoelectric, thermal and organic devices, complemented by chapters addressing the packaging of the devices and their stability. The last part of the book is devoted to the cutting-edge applications of resonant MEMS such as inertial, chemical and biosensors, fluid properties sensors, timing devices and energy harvesting systems.
| Author | : Masayoshi Esashi |
| Publisher | : John Wiley & Sons |
| Total Pages | : 528 |
| Release | : 2021-03-16 |
| Genre | : Technology & Engineering |
| ISBN | : 3527823255 |
Explore heterogeneous circuit integration and the packaging needed for practical applications of microsystems MEMS and system integration are important building blocks for the “More-Than-Moore” paradigm described in the International Technology Roadmap for Semiconductors. And, in 3D and Circuit Integration of MEMS, distinguished editor Dr. Masayoshi Esashi delivers a comprehensive and systematic exploration of the technologies for microsystem packaging and heterogeneous integration. The book focuses on the silicon MEMS that have been used extensively and the technologies surrounding system integration. You’ll learn about topics as varied as bulk micromachining, surface micromachining, CMOS-MEMS, wafer interconnection, wafer bonding, and sealing. Highly relevant for researchers involved in microsystem technologies, the book is also ideal for anyone working in the microsystems industry. It demonstrates the key technologies that will assist researchers and professionals deal with current and future application bottlenecks. Readers will also benefit from the inclusion of: A thorough introduction to enhanced bulk micromachining on MIS process, including pressure sensor fabrication and the extension of MIS process for various advanced MEMS devices An exploration of epitaxial poly Si surface micromachining, including process condition of epi-poly Si, and MEMS devices using epi-poly Si Practical discussions of Poly SiGe surface micromachining, including SiGe deposition and LP CVD polycrystalline SiGe A concise treatment of heterogeneously integrated aluminum nitride MEMS resonators and filters Perfect for materials scientists, electronics engineers, and electrical and mechanical engineers, 3D and Circuit Integration of MEMS will also earn a place in the libraries of semiconductor physicists seeking a one-stop reference for circuit integration and the practical application of microsystems.
