Materials Science Of Microelectromechanical Systems Mems Devices
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Author | : Shekhar Bhansali |
Publisher | : Elsevier |
Total Pages | : 511 |
Release | : 2012-07-18 |
Genre | : Technology & Engineering |
ISBN | : 0857096273 |
The application of Micro Electro Mechanical Systems (MEMS) in the biomedical field is leading to a new generation of medical devices. MEMS for biomedical applications reviews the wealth of recent research on fabrication technologies and applications of this exciting technology.The book is divided into four parts: Part one introduces the fundamentals of MEMS for biomedical applications, exploring the microfabrication of polymers and reviewing sensor and actuator mechanisms. Part two describes applications of MEMS for biomedical sensing and diagnostic applications. MEMS for in vivo sensing and electrical impedance spectroscopy are investigated, along with ultrasonic transducers, and lab-on-chip devices. MEMS for tissue engineering and clinical applications are the focus of part three, which considers cell culture and tissue scaffolding devices, BioMEMS for drug delivery and minimally invasive medical procedures. Finally, part four reviews emerging biomedical applications of MEMS, from implantable neuroprobes and ocular implants to cellular microinjection and hybrid MEMS.With its distinguished editors and international team of expert contributors, MEMS for biomedical applications provides an authoritative review for scientists and manufacturers involved in the design and development of medical devices as well as clinicians using this important technology. - Reviews the wealth of recent research on fabrication technologies and applications of Micro Electro Mechanical Systems (MEMS) in the biomedical field - Introduces the fundamentals of MEMS for biomedical applications, exploring the microfabrication of polymers and reviewing sensor and actuator mechanisms - Considers MEMS for biomedical sensing and diagnostic applications, along with MEMS for in vivo sensing and electrical impedance spectroscopy
Author | : Rebecca Cheung |
Publisher | : Imperial College Press |
Total Pages | : 193 |
Release | : 2006 |
Genre | : Technology & Engineering |
ISBN | : 1860949096 |
This unique book describes the science and technology of silicon carbide (SiC) microelectromechanical systems (MEMS), from the creation of SiC material to the formation of final system, through various expert contributions by several leading key figures in the field. The book contains high-quality up-to-date scientific information concerning SiC MEMS for harsh environments summarized concisely for students, academics, engineers and researchers in the field of SiC MEMS. This is the only book that addresses in a comprehensive manner the main advantages of SiC as a MEMS material for applications in high temperature and harsh environments, as well as approaches to the relevant technologies, with a view progressing towards the final product. Sample Chapter(s). Chapter 1: Introduction to Silicon Carbide (SIC) Microelectromechanical Systems (MEMS) (800 KB). Contents: Introduction to Silicon Carbide (SiC) Microelectromechanical Systems (MEMS) (R Cheung); Deposition Techniques for SiC MEMS (C A Zorman et al.); Review of Issues Pertaining to the Development of Contacts to Silicon Carbide: 1996OCo2002 (L M Porter & F A Mohammad); Dry Etching of SiC (S J Pearton); Design, Performance and Applications of SiC MEMS (S Zappe). Readership: Academic researchers in MEMS and industrial engineers engaged in SiC MEMS research."
Author | : Masayoshi Esashi |
Publisher | : John Wiley & Sons |
Total Pages | : 528 |
Release | : 2021-03-16 |
Genre | : Technology & Engineering |
ISBN | : 3527823255 |
Explore heterogeneous circuit integration and the packaging needed for practical applications of microsystems MEMS and system integration are important building blocks for the “More-Than-Moore” paradigm described in the International Technology Roadmap for Semiconductors. And, in 3D and Circuit Integration of MEMS, distinguished editor Dr. Masayoshi Esashi delivers a comprehensive and systematic exploration of the technologies for microsystem packaging and heterogeneous integration. The book focuses on the silicon MEMS that have been used extensively and the technologies surrounding system integration. You’ll learn about topics as varied as bulk micromachining, surface micromachining, CMOS-MEMS, wafer interconnection, wafer bonding, and sealing. Highly relevant for researchers involved in microsystem technologies, the book is also ideal for anyone working in the microsystems industry. It demonstrates the key technologies that will assist researchers and professionals deal with current and future application bottlenecks. Readers will also benefit from the inclusion of: A thorough introduction to enhanced bulk micromachining on MIS process, including pressure sensor fabrication and the extension of MIS process for various advanced MEMS devices An exploration of epitaxial poly Si surface micromachining, including process condition of epi-poly Si, and MEMS devices using epi-poly Si Practical discussions of Poly SiGe surface micromachining, including SiGe deposition and LP CVD polycrystalline SiGe A concise treatment of heterogeneously integrated aluminum nitride MEMS resonators and filters Perfect for materials scientists, electronics engineers, and electrical and mechanical engineers, 3D and Circuit Integration of MEMS will also earn a place in the libraries of semiconductor physicists seeking a one-stop reference for circuit integration and the practical application of microsystems.
Author | : Minhang Bao |
Publisher | : Elsevier |
Total Pages | : 327 |
Release | : 2005-04-12 |
Genre | : Technology & Engineering |
ISBN | : 008045562X |
Sensors and actuators are now part of our everyday life and appear in many appliances, such as cars, vending machines and washing machines. MEMS (Micro Electro Mechanical Systems) are micro systems consisting of micro mechanical sensors, actuators and micro electronic circuits. A variety of MEMS devices have been developed and many mass produced, but the information on these is widely dispersed in the literature. This book presents the analysis and design principles of MEMS devices. The information is comprehensive, focusing on microdynamics, such as the mechanics of beam and diaphragm structures, air damping and its effect on the motion of mechanical structures. Using practical examples, the author examines problems associated with analysis and design, and solutions are included at the back of the book. The ideal advanced level textbook for graduates, Analysis and Design Principles of MEMS Devices is a suitable source of reference for researchers and engineers in the field.* Presents the analysis and design principles of MEMS devices more systematically than ever before.* Includes the theories essential for the analysis and design of MEMS includes the dynamics of micro mechanical structures* A problem section is included at the end of each chapter with answers provided at the end of the book.
Author | : Ahmad Safari |
Publisher | : Springer Science & Business Media |
Total Pages | : 483 |
Release | : 2008-09-11 |
Genre | : Technology & Engineering |
ISBN | : 0387765409 |
The book discusses the underlying physical principles of piezoelectric materials, important properties of ferroelectric/piezoelectric materials used in today’s transducer technology, and the principles used in transducer design. It provides examples of a wide range of applications of such materials along with the appertaining rationales. With contributions from distinguished researchers, this is a comprehensive reference on all the pertinent aspects of piezoelectric materials.
Author | : S Nihtianov |
Publisher | : Woodhead Publishing |
Total Pages | : 606 |
Release | : 2018-02-27 |
Genre | : Technology & Engineering |
ISBN | : 0081020562 |
Smart Sensors and MEMS: Intelligent Devices and Microsystems for Industrial Applications, Second Edition highlights new, important developments in the field, including the latest on magnetic sensors, temperature sensors and microreaction chambers. The book outlines the industrial applications for smart sensors, covering direct interface circuits for sensors, capacitive sensors for displacement measurement in the sub-nanometer range, integrated inductive displacement sensors for harsh industrial environments, advanced silicon radiation detectors in the vacuum ultraviolet (VUV) and extreme ultraviolet (EUV) spectral range, among other topics. New sections include discussions on magnetic and temperature sensors and the industrial applications of smart micro-electro-mechanical systems (MEMS). The book is an invaluable reference for academics, materials scientists and electrical engineers working in the microelectronics, sensors and micromechanics industry. In addition, engineers looking for industrial sensing, monitoring and automation solutions will find this a comprehensive source of information. - Contains new chapters that address key applications, such as magnetic sensors, microreaction chambers and temperature sensors - Provides an in-depth information on a wide array of industrial applications for smart sensors and smart MEMS - Presents the only book to discuss both smart sensors and MEMS for industrial applications
Author | : Nadim Maluf |
Publisher | : Artech House |
Total Pages | : 312 |
Release | : 2004 |
Genre | : Technology & Engineering |
ISBN | : 9781580535915 |
Bringing you up-to-date with the latest developments in MEMS technology, this major revision of the best-selling An Introduction to Microelectromechanical Systems Engineering offers you a current understanding of this cutting-edge technology. You gain practical knowledge of MEMS materials, design, and manufacturing, and learn how it is being applied in industrial, optical, medical and electronic markets. The second edition features brand new sections on RF MEMS, photo MEMS, micromachining on materials other than silicon, reliability analysis, plus an expanded reference list. With an emphasis on commercialized products, this unique resource helps you determine whether your application can benefit from a MEMS solution, understand how other applications and companies have benefited from MEMS, and select and define a manufacturable MEMS process for your application. You discover how to use MEMS technology to enable new functionality, improve performance, and reduce size and cost. The book teaches you the capabilities and limitations of MEMS devices and processes, and helps you communicate the relative merits of MEMS to your company's management. From critical discussions on design operation and process fabrication of devices and systems, to a thorough explanation of MEMS packaging, this easy-to-understand book clearly explains the basics of MEMS engineering, making it an invaluable reference for your work in the field.
Author | : Henry Baltes |
Publisher | : John Wiley & Sons |
Total Pages | : 612 |
Release | : 2008-07-11 |
Genre | : Technology & Engineering |
ISBN | : 3527616934 |
Microstructures, electronics, nanotechnology - these vast fields of research are growing together as the size gap narrows and many different materials are combined. Current research, engineering sucesses and newly commercialized products hint at the immense innovative potentials and future applications that open up once mankind controls shape and function from the atomic level right up to the visible world without any gaps. Sensor systems, microreactors, nanostructures, nanomachines, functional surfaces, integrated optics, displays, communications technology, biochips, human/machine interfaces, prosthetics, miniaturized medical and surgery equipment and many more opportunities are being explored. This new series, Advanced Micro and Nano Systems, provides cutting-edge reviews from top authors on technologies, devices and advanced systems from the micro and nano worlds.
Author | : Robert A. Dorey |
Publisher | : William Andrew |
Total Pages | : 217 |
Release | : 2011-10-21 |
Genre | : Technology & Engineering |
ISBN | : 1437778178 |
The MEMS (Micro Electro-Mechanical Systems) market returned to growth in 2010. The total MEMS market is worth about $6.5 billion, up more than 11 percent from last year and nearly as high as its historic peak in 2007. MEMS devices are used across sectors as diverse as automotive, aerospace, medical, industrial process control, instrumentation and telecommunications - forming the nerve center of products including airbag crash sensors, pressure sensors, biosensors and ink jet printer heads. Part of the MEMS cluster within the Micro & Nano Technologies Series, this book covers the fabrication techniques and applications of thick film piezoelectric micro electromechanical systems (MEMS). It includes examples of applications where the piezoelectric thick films have been used, illustrating how the fabrication process relates to the properties and performance of the resulting device. Other topics include: top-down and bottom-up fabrication of thick film MEMS, integration of thick films with other materials, effect of microstructure on properties, device performance, etc. Provides detailed guidance on the fabrication techniques and applications of thick film MEMS, for engineers and R&D groups Written by a single author, this book provides a clear, coherently written guide to this important emerging technology Covers materials, fabrication and applications in one book
Author | : Vijay K. Varadan |
Publisher | : John Wiley & Sons |
Total Pages | : 406 |
Release | : 2003-07-25 |
Genre | : Technology & Engineering |
ISBN | : 0470846194 |
Microelectromechanical systems (MEMS) refer to a collection of micro-sensors and actuators, which can react to environmental change under micro- circuit control. The integration of MEMS into traditional Radio Frequency (RF) circuits has resulted in systems with superior performance levels and lower manufacturing costs. The incorporation of MEMS based fabrication technologies into micro and millimeter wave systems offers viable routes to ICs with MEMS actuators, antennas, switches and transmission lines. The resultant systems operate with an increased bandwidth and increased radiation efficiency and have considerable scope for implementation within the expanding area of wireless personal communication devices. This text provides leading edge coverage of this increasingly important area and highlights the overlapping information requirements of the RF and MEMS research and development communities. * Provides an introduction to micromachining techniques and their use in the fabrication of micro switches, capacitors and inductors * Includes coverage of MEMS devices for wireless and Bluetooth enabled systems Essential reading for RF Circuit design practitioners and researchers requiring an introduction to MEMS technologies, as well as practitioners and researchers in MEMS and silicon technology requiring an introduction to RF circuit design.