Manufacturing Microelectronics Systems And Exploratory Topics Optoelectronic And Photonic Packaging Rf Microwave Telecommunications Education Packaging Technologies Keynote Lecture
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Author | : American Society of Mechanical Engineers Electronic and Photonic Packaging Division |
Publisher | : |
Total Pages | : 518 |
Release | : 2001 |
Genre | : |
ISBN | : |
Author | : |
Publisher | : |
Total Pages | : 556 |
Release | : 2001 |
Genre | : Electronic packaging |
ISBN | : |
Author | : Yung-Cheng Lee |
Publisher | : |
Total Pages | : 2036 |
Release | : 2001 |
Genre | : Electronic packaging |
ISBN | : 9780791835401 |
This three-volume set of the proceedings of the July 2001 conference presents information from both academia and industry on advances in electronic packaging. Volume 1 (75 papers) discusses electrical design, simulation, and test; MEMS; materials and processing; and modeling and characterization. Volume 2 (106 papers) covers thermal management reliability. Volume 3 (88 papers) addresses manufacturing, microelectronics systems and exploratory topics, optoelectronic and photonic packaging, RF microwave, telecommunications, education, and packaging technologies. It also contains a keynote lecture on consortium activity for system integration in Japan. There is no subject index. c. Book News Inc.
Author | : Ken Kuang |
Publisher | : Springer Science & Business Media |
Total Pages | : 295 |
Release | : 2009-12-01 |
Genre | : Technology & Engineering |
ISBN | : 1441909842 |
RF and Microwave Microelectronics Packaging presents the latest developments in packaging for high-frequency electronics. It will appeal to practicing engineers in the electronic packaging and high-frequency electronics fields and to academic researchers interested in understanding leading issues in the commercial sector. It covers the latest developments in thermal management, electrical/RF/thermal-mechanical designs and simulations, packaging and processing methods as well as other RF/MW packaging-related fields.
Author | : |
Publisher | : |
Total Pages | : 68 |
Release | : 1981 |
Genre | : |
ISBN | : |
Author | : R. R. Tummala |
Publisher | : Van Nostrand Reinhold Company |
Total Pages | : 1000 |
Release | : 1996-09-15 |
Genre | : |
ISBN | : 9780442019631 |
Author | : R.R. Tummala |
Publisher | : Springer |
Total Pages | : 0 |
Release | : 1989-01-14 |
Genre | : Technology & Engineering |
ISBN | : 9781461310693 |
RALPH E. GOMORY IBM SENIOR VICE-PRESIDENT, SCIENCE AND TECHNOLOGY Far from being passive containers for microelectronic devices, the so-called "packages" in today's advanced computers pose at least as many engineering challenges as the chips that they interconnect, power, and cool. New pack aging concepts often lead their developers into uncharted areas of science. Ultimately, progress in packaging is likely to set the limits on how far computers can evolve. And yet, this technology has never captured the public imagination in the way that chips have. Worse, it has been largely overlooked by universities as a prime subject for teaching and research. In part, this academic oversight stems from packaging's multidiscipli nary nature. Packaging involves the solution of electrical, mechanical, and thermal problems; it requires understanding at the molecular level not only of silicon but of metals, ceramics, polymers, glass, and composites. In short, iii iv FOREWORD it is poorly matched to the traditional separation of university disciplines. Another roadblock has been the lack of a comprehensive book dealing ade quately with state of the art packaging design and modern industry require ments.
Author | : Herbert Reichl |
Publisher | : Springer |
Total Pages | : 858 |
Release | : 2014-12-04 |
Genre | : Technology & Engineering |
ISBN | : 9783642456800 |
On September 10-13, 1990, the first international meeting on Microsystem Technologies takes place at the Berlin International Congress Center. Most of the traditional congresses deal with themes that become more and more specific, and only a small part of the scientific world is reflected. The Micro System Technologies is attempting to take the opposite direction: During the last two decades the development of microelectronics was characterized by a tremendous increase of complexity of integrated circuits. At the same time the fields of microoptics and micromechanics have been developed to an advanced state of the art by the application of thin film and semiconductor technologies. The trend of the future development is to increase the integration density by combining the microelectronic, microoptic, and micro mechanic aspects to new complex multifunctional systems, which are able to comprise sensors, actuators, analogue and digital circuits on the same chip or on multichip-modules. Microsystems will lead to extensions of the field of microelectronic applications with important technical alterations and can open new considerable markets. For the realization of economical solutions for microsystems a lot of interdisciplinary cooperation and know-how has to be developed. New materials for sensitive layers, substrates, conducting, semiconducting, or isolating thin films are the basis for the development of new technologies. The increasing complexity leads to increasing interaction among electrical and non-electrical quantities.
Author | : Yan Li |
Publisher | : Springer |
Total Pages | : 622 |
Release | : 2020-11-24 |
Genre | : Technology & Engineering |
ISBN | : 9789811570896 |
This book offers a comprehensive reference guide for graduate students and professionals in both academia and industry, covering the fundamentals, architecture, processing details, and applications of 3D microelectronic packaging. It provides readers an in-depth understanding of the latest research and development findings regarding this key industry trend, including TSV, die processing, micro-bumps for LMI and MMI, direct bonding and advanced materials, as well as quality, reliability, fault isolation, and failure analysis for 3D microelectronic packages. Images, tables, and didactic schematics are used to illustrate and elaborate on the concepts discussed. Readers will gain a general grasp of 3D packaging, quality and reliability concerns, and common causes of failure, and will be introduced to developing areas and remaining gaps in 3D packaging that can help inspire future research and development.
Author | : TUMMALA RAO R. |
Publisher | : Springer |
Total Pages | : |
Release | : 1996-12-15 |
Genre | : Science |
ISBN | : 9780442019938 |