Macro To Micro Scale Heat Transfer
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Author | : D. Y. Tzou |
Publisher | : John Wiley & Sons |
Total Pages | : 576 |
Release | : 2014-09-18 |
Genre | : Technology & Engineering |
ISBN | : 1118818261 |
Physical processes taking place in micro/nanoscale strongly depend on the material types and can be very complicated. Known approaches include kinetic theory and quantum mechanics, non-equilibrium and irreversible thermodynamics, molecular dynamics, and/or fractal theory and fraction model. Due to innately different physical bases employed, different approaches may involve different physical properties in describing micro/nanoscale heat transport. In addition, the parameters involved in different approaches, may not be mutually inclusive. Macro- to Microscale Heat Transfer: The Lagging Behavior, Second Edition continues the well-received concept of thermal lagging through the revolutionary approach that focuses on the finite times required to complete the various physical processes in micro/nanoscale. Different physical processes in heat/mass transport imply different delay times, which are common regardless of the material type. The delay times, termed phase lags, are characteristics of materials. Therefore the dual-phase-lag model developed is able to describe eleven heat transfer models from macro to nanoscale in the same framework of thermal lagging. Recent extensions included are the lagging behavior in mass transport, as well as the nonlocal behavior in space, bearing the same merit of thermal lagging in time, in shrinking the ultrafast response down to the nanoscale. Key features: Takes a unified approach describing heat and mass transport from macro, micro to nanoscale Compares experimental results for model validation Includes easy to follow mathematical formulation Accompanied by a website hosting supporting material Macro- to Microscale Heat Transfer: The Lagging Behavior, Second Edition is a comprehensive reference for researchers and practitioners, and graduate students in mechanical, aerospace, biological and chemical engineering.
Author | : Zhuomin M. Zhang |
Publisher | : Springer Nature |
Total Pages | : 780 |
Release | : 2020-06-23 |
Genre | : Science |
ISBN | : 3030450392 |
This substantially updated and augmented second edition adds over 200 pages of text covering and an array of newer developments in nanoscale thermal transport. In Nano/Microscale Heat Transfer, 2nd edition, Dr. Zhang expands his classroom-proven text to incorporate thermal conductivity spectroscopy, time-domain and frequency-domain thermoreflectance techniques, quantum size effect on specific heat, coherent phonon, minimum thermal conductivity, interface thermal conductance, thermal interface materials, 2D sheet materials and their unique thermal properties, soft materials, first-principles simulation, hyperbolic metamaterials, magnetic polaritons, and new near-field radiation experiments and numerical simulations. Informed by over 12 years use, the author’s research experience, and feedback from teaching faculty, the book has been reorganized in many sections and enriched with more examples and homework problems. Solutions for selected problems are also available to qualified faculty via a password-protected website.• Substantially updates and augments the widely adopted original edition, adding over 200 pages and many new illustrations;• Incorporates student and faculty feedback from a decade of classroom use;• Elucidates concepts explained with many examples and illustrations;• Supports student application of theory with 300 homework problems;• Maximizes reader understanding of micro/nanoscale thermophysical properties and processes and how to apply them to thermal science and engineering;• Features MATLAB codes for working with size and temperature effects on thermal conductivity, specific heat of nanostructures, thin-film optics, RCWA, and near-field radiation.
Author | : John R Thome |
Publisher | : World Scientific |
Total Pages | : 1460 |
Release | : 2018-03-13 |
Genre | : Technology & Engineering |
ISBN | : 9813227427 |
Set III of this encyclopedia is a new addition to the previous Sets I and II. It contains 26 invited chapters from international specialists on the topics of numerical modeling of two-phase flows and evaporation, fundamentals of evaporation and condensation in microchannels and macrochannels, development and testing of micro two-phase cooling systems for electronics, and various special topics (surface wetting effects, microfin tubes, two-phase flow vibration across tube bundles). The chapters are written both by renowned university researchers and by well-known engineers from leading corporate research laboratories. Numerous 'must read' chapters cover the fundamentals of research and engineering practice on boiling, condensation and two-phase flows, two-phase heat transfer equipment, electronics cooling systems, case studies and so forth. Set III constitutes a 'must have' reference together with Sets I and II for thermal engineering researchers and practitioners.
Author | : Albrecht Bertram |
Publisher | : Springer Science & Business Media |
Total Pages | : 301 |
Release | : 2008-10-23 |
Genre | : Science |
ISBN | : 354085715X |
Many materials or media in nature and technology possess a microstructure which determines their macroscopic behaviour. The knowledge of the relevant mechanisms is often more comprehensive on the micro than on the macro scale. On the other hand, not all information on the micro level is relevant for the understanding of this macro behaviour. Therefore, averaging and homogenization methods are needed to select only the specific information from the micro scale, which influences the macro scale. These methods also open the possibility to design or to influence microstructures with the objective to optimize their macro behaviour. This book presents the development of new methods in this interdisciplinary field of macro- micro-interactions of different engineering branches like mechanical and process engineering, applied mathematics, theoretical, and computational physics. In particular, solids with microstructures and particle systems are considered.
Author | : Bekir Sami Yilbas |
Publisher | : Elsevier |
Total Pages | : 437 |
Release | : 2017-08-23 |
Genre | : Technology & Engineering |
ISBN | : 032342998X |
Heat Transport in Micro- and Nanoscale Thin Films presents aspects and applications of the principle methods of heat transport in relation to nanoscale films. Small-scale parts and thin films are widely used in the electronics industry. However, the drastic change in the thermal conductivity with reducing device size and film thickness modifies the energy transport by heat-carrying phonons in the film. Energy transfer in small-sized devices and thin films deviate from the classical diffusion to radiative transport. This book deals with micro/nano scale heat transfer in small scale devices and the thin films, including interface properties of cross-plane transport. The book fills the gap between applications of the physical fundamentals and energy transport at the micro- and nano scale, which will be valuable for academics, researchers and students in the fields of materials science and energy transport. - Offers a specialist focus on nanoscale thin films, allowing the reader to create more efficient heat transfer systems - Includes in-depth coverage of the formulation of transient energy transport for short durations of heating, which is valuable those working in electronics - Focuses on applications and real-life case studies to clearly illustrate how the theories explained in the book can be used in industry
Author | : C.B. Sobhan |
Publisher | : CRC Press |
Total Pages | : 440 |
Release | : 2008-06-12 |
Genre | : Science |
ISBN | : 1420007114 |
Through analyses, experimental results, and worked-out numerical examples, Microscale and Nanoscale Heat Transfer: Fundamentals and Engineering Applications explores the methods and observations of thermophysical phenomena in size-affected domains. Compiling the most relevant findings from the literature, along with results from their own re
Author | : |
Publisher | : Academic Press |
Total Pages | : 594 |
Release | : 2020-11-04 |
Genre | : Technology & Engineering |
ISBN | : 0128207388 |
Advances in Heat Transfer, Volume 52, provides in-depth review articles from a broader scope than in traditional journals or texts, with this comprehensive release covering chapters on Thermal Convection Studies at the University of Minnesota, Convective heat transfer in porous passages that depends on the values of the Sparrow numbers, Automatic Code Differentiation for Thermal-Fluid Problems, Advances in Vapor Chambers and Phase Change Heat Spreaders, Pressure Drop and Heat Transfer in the Entrance Region of Microchannels, Predicting spectral thermal conductivity at the mesoscale with advanced deterministic phonon transport techniques, and Modulated-heating protocols applied to hyperthermia/thermal ablation. Fills the information gap between regularly scheduled journals and university-level textbooks by providing in-depth review articles over a broader scope than in traditional journals or texts Provides essential reading for all mechanical, chemical and industrial engineers working in the field of heat transfer Presents a great resource for use in graduate school level courses
Author | : S. Kakaç |
Publisher | : Springer Science & Business Media |
Total Pages | : 517 |
Release | : 2006-05-20 |
Genre | : Technology & Engineering |
ISBN | : 1402033613 |
This volume contains an archival record of the NATO Advanced Institute on Microscale Heat Transfer – Fundamental and Applications in Biological and Microelectromechanical Systems held in Çesme – Izmir, Turkey, July 18–30, 2004. The ASIs are intended to be high-level teaching activity in scientific and technical areas of current concern. In this volume, the reader may find interesting chapters and various Microscale Heat Transfer Fundamental and Applications. The growing use of electronics, in both military and civilian applications has led to the widespread recognition for need of thermal packaging and management. The use of higher densities and frequencies in microelectronic circuits for computers are increasing day by day. They require effective cooling due to heat generated that is to be dissipated from a relatively low surface area. Hence, the development of efficient cooling techniques for integrated circuit chips is one of the important contemporary applications of Microscale Heat Transfer which has received much attention for cooling of high power electronics and applications in biomechanical and aerospace industries. Microelectromechanical systems are subject of increasing active research in a widening field of discipline. These topics and others are the main themeof this Institute.
Author | : Latif M. Jiji |
Publisher | : Springer Science & Business Media |
Total Pages | : 432 |
Release | : 2009-07-09 |
Genre | : Technology & Engineering |
ISBN | : 3642012671 |
This textbook presents the classical topics of conduction heat transfer and extends the coverage to include chapters on perturbation methods, heat transfer in living tissue, and microscale conduction. This makes the book unique among the many published textbook on conduction heat transfer. Other noteworthy features of the book are: The material is organized to provide students with the tools to model, analyze and solve a wide range of engineering applications involving conduction heat transfer. Mathematical techniques are presented in a clear and simplified fashion to be used as instruments in obtaining solutions. The simplicity of one-dimensional conduction is used to drill students in the role of boundary conditions and to explore a variety of physical conditions that are of practical interest. Examples are carefully selected to illustrate the application of principles and the construction of solutions. Students are trained to follow a systematic problem solving methodology with emphasis on thought process, logic, reasoning and verification. Solutions to all examples and end-of-chapter problems follow an orderly problems solving approach. Extensive training material is available on the web The author provides an extensive solution manual for verifiable course instructors on request. Please send your request to [email protected]
Author | : Qiuwang Wang |
Publisher | : WIT Press |
Total Pages | : 417 |
Release | : 2013-11-06 |
Genre | : Science |
ISBN | : 1845648188 |
Presented in ten edited chapters this book encompasses important emerging topics in heat transfer equipment, particularly heat exchangers. The chapters have all been selected by invitation only. Advances in high temperature equipment and small scale devices continue to be important as the involved heat transfer and related phenomena are often complex in nature and different mechanisms like heat conduction, convection, turbulence, thermal radiation and phase change as well as chemical reactions may occur simultaneously. The book treats various operating problems, like fouling, and highlights applications in heat exchangers and gas turbine cooling. In engineering design and development, reliable and accurate computational methods are required to replace or complement expensive and time consuming experimental trial and error work. Tremendous advancements in knowledge and competence have been achieved during recent years due to improved computational solution methods for non-linear partial differential equations, turbulence modelling advancement and developments of computers and computing algorithms to achieve efficient and rapid simulations. The chapters of the book thoroughly present such advancement in a variety of applications.