Multilayered Low Temperature Cofired Ceramics (LTCC) Technology

Multilayered Low Temperature Cofired Ceramics (LTCC) Technology
Author: Yoshihiko Imanaka
Publisher: Springer Science & Business Media
Total Pages: 252
Release: 2006-05-28
Genre: Technology & Engineering
ISBN: 0387233148

The only book to concentrate solely on low temperature cofired ceramics, an attractive technology for electronic components and substrates that are compact, light, and offer high-speed and functionality for portable electronic devices.

Low Temperature Co-fired Ceramic (LTCC) Substrate for High Temperature Microelectronics

Low Temperature Co-fired Ceramic (LTCC) Substrate for High Temperature Microelectronics
Author: Devin Alexander Smarra
Publisher:
Total Pages: 74
Release: 2017
Genre: Electronics
ISBN:

Advances in aerospace technologies demand new ways to package electronics for high temperature and harsh environments. One packaging method of interest in academia and industry is Low Temperature Co-fired Ceramic (LTCC). LTCC is a multi-layer design and packaging system that can embed passive components and thermal management structures within a substrate. This thesis compiles research done to evaluate LTCC as a high-performance electronic packaging technique by determining the performance of embedded passives and thermal management structures at temperatures from -55°C to 225°C. The passive structures and thermal management structures are evaluated using theoretical calculations, simulations, and measurements of fabricated devices.

Microwave Materials and Applications

Microwave Materials and Applications
Author: Mailadil T. Sebastian
Publisher: John Wiley & Sons
Total Pages: 997
Release: 2017-03-02
Genre: Technology & Engineering
ISBN: 1119208564

Die jüngsten Fortschritte im Bereich der drahtlosen Telekommunikation und dem Internet der Dinge sorgen bei drahtlosen Systemen, beim Satellitenfernsehen und bei intelligenten Transportsystemen der 5. Generation für eine höhere Nachfrage nach dielektrischen Materialien und modernen Fertigungstechniken. Diese Materialien bieten ausgezeichnete elektrische, dielektrische und thermische Eigenschaften und verfügen über enormes Potenzial, vor allem bei der drahtlosen Kommunikation, bei flexibler Elektronik und gedruckter Elektronik. Microwave Materials and Applications erläutert die herkömmlichen Methoden zur Messung der dielektrischen Eigenschaften im Mikrowellenbereich, die verschiedenen Ansätze zur Lösung von Problemen der Materialchemie und von Kristallstrukturen, in den Bereichen Doping, Substitution und Aufbau von Verbundwerkstoffen. Besonderer Schwerpunkt liegt auf Verarbeitungstechniken, Einflüssen der Morphologie und der Anwendung von Materialien in der Mikrowellentechnik. Gleichzeitig werden viele der jüngsten Forschungserkenntnisse bei Mikrowellen-Dielektrika und -Anwendungen zusammengefasst. Die verschiedenen Kapitel untersuchen: Oxidkeramiken für dielektrische Resonatoren und Substrate, HTCC-, LTCC- und ULTCC-Bänder für Substrate, Polymer-Keramik-Verbundstoffe für Leiterplatten, Elastomer-Keramik-Verbundstoffe für flexible Elektronik, dielektrische Tinten, Materialien für die EMV-Abschirmung, Mikrowellen-Ferrite. Ein umfassender Anhang präsentiert die grundlegenden Eigenschaften von mehr als 4000 verlustarmen dielektrischen Keramiken, deren Zusammensetzung, kristalline Struktur und dielektrischen Eigenschaften für Mikrowellenanwendungen. Microwave Materials and Applications wirft einen Blick auf sämtliche Aspekte von Mikrowellenmaterialien und -anwendungen, ein nützliches Handbuch für Wissenschaftler, Unternehmen, Ingenieure und Studenten, die sich mit heutigen und neuen Anwendungen in den Bereichen drahtlose Kommunikation und Unterhaltungselektronik beschäftigen.

Advanced Millimeter-wave Technologies

Advanced Millimeter-wave Technologies
Author: Duixian Liu
Publisher: John Wiley & Sons
Total Pages: 866
Release: 2009-04-06
Genre: Technology & Engineering
ISBN: 047099617X

This book explains one of the hottest topics in wireless and electronic devices community, namely the wireless communication at mmWave frequencies, especially at the 60 GHz ISM band. It provides the reader with knowledge and techniques for mmWave antenna design, evaluation, antenna and chip packaging. Addresses practical engineering issues such as RF material evaluation and selection, antenna and packaging requirements, manufacturing tolerances, antenna and system interconnections, and antenna One of the first books to discuss the emerging research and application areas, particularly chip packages with integrated antennas, wafer scale mmWave phased arrays and imaging Contains a good number of case studies to aid understanding Provides the antenna and packaging technologies for the latest and emerging applications with the emphases on antenna integrations for practical applications such as wireless USB, wireless video, phase array, automobile collision avoidance radar, and imaging

RF and Microwave Microelectronics Packaging

RF and Microwave Microelectronics Packaging
Author: Ken Kuang
Publisher: Springer Science & Business Media
Total Pages: 295
Release: 2009-12-01
Genre: Technology & Engineering
ISBN: 1441909842

RF and Microwave Microelectronics Packaging presents the latest developments in packaging for high-frequency electronics. It will appeal to practicing engineers in the electronic packaging and high-frequency electronics fields and to academic researchers interested in understanding leading issues in the commercial sector. It covers the latest developments in thermal management, electrical/RF/thermal-mechanical designs and simulations, packaging and processing methods as well as other RF/MW packaging-related fields.

Printed Films

Printed Films
Author: Maria Prudenziati
Publisher: Elsevier
Total Pages: 609
Release: 2012-08-30
Genre: Technology & Engineering
ISBN: 0857096214

Whilst printed films are currently used in varied devices across a wide range of fields, research into their development and properties is increasingly uncovering even greater potential. Printed films provides comprehensive coverage of the most significant recent developments in printed films and their applications.Materials and properties of printed films are the focus of part one, beginning with a review of the concepts, technologies and materials involved in their production and use. Printed films as electrical components and silicon metallization for solar cells are discussed, as are conduction mechanisms in printed film resistors, and thick films in packaging and microelectronics. Part two goes on to review the varied applications of printed films in devices. Printed resistive sensors are considered, as is the role of printed films in capacitive, piezoelectric and pyroelectric sensors, mechanical micro-systems and gas sensors. The applications of printed films in biosensors, actuators, heater elements, varistors and polymer solar cells are then explored, followed by a review of screen printing for the fabrication of solid oxide fuel cells and laser printed micro- and meso-scale power generating devices.With its distinguished editors and international team of expert contributors, Printed films is a key text for anyone working in such fields as microelectronics, fuel cell and sensor technology in both industry and academia. Provides a comprehensive analysis of the most significant recent developments in printed films and their applications Reviews the concepts, properties, technologies and materials involved in the production and use of printed films Analyses the varied applications of printed films in devices, including printed restrictive sensors for physical quantities and printed thick film mechanical micro-systems (MEMS), among others