ISTFA 2009

ISTFA 2009
Author:
Publisher: ASM International
Total Pages: 371
Release: 2009-01-01
Genre: Technology & Engineering
ISBN: 1615030921

This volume features the latest research and practical data from the premier event for the microelectronics failure analysis community. The papers cover a wide range of testing and failure analysis topics of practical value to anyone working to detect, understand, and eliminate electronic device and system failures. Case histories and review papers are included, as well as guides to new and unique tools and methodologies, applications and results.

ISTFA 2012

ISTFA 2012
Author: ASM International
Publisher: ASM International
Total Pages: 643
Release: 2012
Genre: Technology & Engineering
ISBN: 1615039953

ISTFA 2010

ISTFA 2010
Author:
Publisher: ASM International
Total Pages: 487
Release: 2010-01-01
Genre: Technology & Engineering
ISBN: 1615037276

ISTFA 2013

ISTFA 2013
Author: A. S. M. International
Publisher: ASM International
Total Pages: 634
Release: 2013-01-01
Genre: Technology & Engineering
ISBN: 1627080228

This volume features the latest research and practical data from the premier event for the microelectronics failure analysis community. The papers cover a wide range of testing and failure analysis topics of practical value to anyone working to detect, understand, and eliminate electronic device and system failures.

ISTFA 2011

ISTFA 2011
Author:
Publisher: ASM International
Total Pages: 479
Release: 2011
Genre: Technology & Engineering
ISBN: 1615038507

Microelectronics Fialure Analysis Desk Reference, Seventh Edition

Microelectronics Fialure Analysis Desk Reference, Seventh Edition
Author: Tejinder Gandhi
Publisher: ASM International
Total Pages: 719
Release: 2019-11-01
Genre: Technology & Engineering
ISBN: 1627082468

The Electronic Device Failure Analysis Society proudly announces the Seventh Edition of the Microelectronics Failure Analysis Desk Reference, published by ASM International. The new edition will help engineers improve their ability to verify, isolate, uncover, and identify the root cause of failures. Prepared by a team of experts, this updated reference offers the latest information on advanced failure analysis tools and techniques, illustrated with numerous real-life examples. This book is geared to practicing engineers and for studies in the major area of power plant engineering. For non-metallurgists, a chapter has been devoted to the basics of material science, metallurgy of steels, heat treatment, and structure-property correlation. A chapter on materials for boiler tubes covers composition and application of different grades of steels and high temperature alloys currently in use as boiler tubes and future materials to be used in supercritical, ultra-supercritical and advanced ultra-supercritical thermal power plants. A comprehensive discussion on different mechanisms of boiler tube failure is the heart of the book. Additional chapters detailing the role of advanced material characterization techniques in failure investigation and the role of water chemistry in tube failures are key contributions to the book.

ISTFA 2019: Proceedings of the 45th International Symposium for Testing and Failure Analysis

ISTFA 2019: Proceedings of the 45th International Symposium for Testing and Failure Analysis
Author: ASM International
Publisher: ASM International
Total Pages: 540
Release: 2019-12-01
Genre: Technology & Engineering
ISBN: 1627082735

The theme for the 2019 conference is Novel Computing Architectures. Papers will include discussions on the advent of Artificial Intelligence and the promise of quantum computing that are driving disruptive computing architectures; Neuromorphic chip designs on one hand, and Quantum Bits on the other, still in R&D, will introduce new computing circuitry and memory elements, novel materials, and different test methodologies. These novel computing architectures will require further innovation which is best achieved through a collaborative Failure Analysis community composed of chip manufacturers, tool vendors, and universities.

Optimum Cooling of Data Centers

Optimum Cooling of Data Centers
Author: Jun Dai
Publisher: Springer Science & Business Media
Total Pages: 196
Release: 2013-11-20
Genre: Technology & Engineering
ISBN: 1461456029

This book describes the use of free air cooling to improve the efficiency of, and cooling of, equipment for use in telecom infrastructures. Discussed at length is the cooling of communication installation rooms such as data centers or base stations, and this is intended as a valuable tool for the people designing and manufacturing key parts of communication networks. This book provides an introduction to current cooling methods used for energy reduction, and also compares present cooling methods in use in the field. The qualification methods and standard reliability assessments are reviewed, and their inability to assess the risks of free air cooling is discussed. The method of identifying the risks associated with free air cooling on equipment performance and reliability is introduced. A novel method of assessment for free air cooling is also proposed that utilizes prognostics and health management (PHM). This book also: Describes how the implementation of free air cooling can save energy for cooling within the telecommunications infrastructure. Analyzes the potential risks and failures of mechanisms possible in the implementation of free air cooling, which benefits manufacturers and equipment designers. Presents prognostics-based assessments to identify and mitigate the risks of telecommunications equipment under free air cooling conditions, which can provide the early warning of equipment failures at operation stage without disturbing the data centers' service. Optimum Cooling for Data Centers is an ideal book for researchers and engineers interested in designing and manufacturing equipment for use in telecom infrastructures.