Ion Implantation Handbook 1988
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Author | : Yoshio Nishi |
Publisher | : CRC Press |
Total Pages | : 1720 |
Release | : 2017-12-19 |
Genre | : Technology & Engineering |
ISBN | : 1420017667 |
Retaining the comprehensive and in-depth approach that cemented the bestselling first edition's place as a standard reference in the field, the Handbook of Semiconductor Manufacturing Technology, Second Edition features new and updated material that keeps it at the vanguard of today's most dynamic and rapidly growing field. Iconic experts Robert Doering and Yoshio Nishi have again assembled a team of the world's leading specialists in every area of semiconductor manufacturing to provide the most reliable, authoritative, and industry-leading information available. Stay Current with the Latest Technologies In addition to updates to nearly every existing chapter, this edition features five entirely new contributions on... Silicon-on-insulator (SOI) materials and devices Supercritical CO2 in semiconductor cleaning Low-κ dielectrics Atomic-layer deposition Damascene copper electroplating Effects of terrestrial radiation on integrated circuits (ICs) Reflecting rapid progress in many areas, several chapters were heavily revised and updated, and in some cases, rewritten to reflect rapid advances in such areas as interconnect technologies, gate dielectrics, photomask fabrication, IC packaging, and 300 mm wafer fabrication. While no book can be up-to-the-minute with the advances in the semiconductor field, the Handbook of Semiconductor Manufacturing Technology keeps the most important data, methods, tools, and techniques close at hand.
Author | : Emanuele Rimini |
Publisher | : Springer Science & Business Media |
Total Pages | : 400 |
Release | : 2013-11-27 |
Genre | : Technology & Engineering |
ISBN | : 1461522595 |
Ion implantation offers one of the best examples of a topic that starting from the basic research level has reached the high technology level within the framework of microelectronics. As the major or the unique procedure to selectively dope semiconductor materials for device fabrication, ion implantation takes advantage of the tremendous development of microelectronics and it evolves in a multidisciplinary frame. Physicists, chemists, materials sci entists, processing, device production, device design and ion beam engineers are all involved in this subject. The present monography deals with several aspects of ion implantation. The first chapter covers basic information on the physics of devices together with a brief description of the main trends in the field. The second chapter is devoted to ion im planters, including also high energy apparatus and a description of wafer charging and contaminants. Yield is a quite relevant is sue in the industrial surrounding and must be also discussed in the academic ambient. The slowing down of ions is treated in the third chapter both analytically and by numerical simulation meth ods. Channeling implants are described in some details in view of their relevance at the zero degree implants and of the available industrial parallel beam systems. Damage and its annealing are the key processes in ion implantation. Chapter four and five are dedicated to this extremely important subject.
Author | : Richard C. Dorf |
Publisher | : CRC Press |
Total Pages | : 2758 |
Release | : 1997-09-26 |
Genre | : Technology & Engineering |
ISBN | : 9781420049763 |
In 1993, the first edition of The Electrical Engineering Handbook set a new standard for breadth and depth of coverage in an engineering reference work. Now, this classic has been substantially revised and updated to include the latest information on all the important topics in electrical engineering today. Every electrical engineer should have an opportunity to expand his expertise with this definitive guide. In a single volume, this handbook provides a complete reference to answer the questions encountered by practicing engineers in industry, government, or academia. This well-organized book is divided into 12 major sections that encompass the entire field of electrical engineering, including circuits, signal processing, electronics, electromagnetics, electrical effects and devices, and energy, and the emerging trends in the fields of communications, digital devices, computer engineering, systems, and biomedical engineering. A compendium of physical, chemical, material, and mathematical data completes this comprehensive resource. Every major topic is thoroughly covered and every important concept is defined, described, and illustrated. Conceptually challenging but carefully explained articles are equally valuable to the practicing engineer, researchers, and students. A distinguished advisory board and contributors including many of the leading authors, professors, and researchers in the field today assist noted author and professor Richard Dorf in offering complete coverage of this rapidly expanding field. No other single volume available today offers this combination of broad coverage and depth of exploration of the topics. The Electrical Engineering Handbook will be an invaluable resource for electrical engineers for years to come.
Author | : George E. Totten |
Publisher | : CRC Press |
Total Pages | : 992 |
Release | : 2004-05-25 |
Genre | : Technology & Engineering |
ISBN | : 9780203970928 |
Reviewing an extensive array of procedures in hot and cold forming, casting, heat treatment, machining, and surface engineering of steel and aluminum, this comprehensive reference explores a vast range of processes relating to metallurgical component design-enhancing the production and the properties of engineered components while reducing manufacturing costs. It surveys the role of computer simulation in alloy design and its impact on material structure and mechanical properties such as fatigue and wear. It also discusses alloy design for various materials, including steel, iron, aluminum, magnesium, titanium, super alloy compositions and copper.
Author | : Joseph R. Davis |
Publisher | : ASM International |
Total Pages | : 518 |
Release | : 1995-01-01 |
Genre | : Technology & Engineering |
ISBN | : 9780871705457 |
If you are involved with machining or metalworking or you specify materials for industrial components, this book is an absolute must. It gives you detailed and comprehensive information about the selection, processing, and properties of materials for machining and metalworking applications. They include wrought and powder metallurgy tool steels, cobalt base alloys, cemented carbides, cermets, ceramics, and ultra-hard materials. You'll find specific guidelines for optimizing machining productivity through the proper selection of cutting tool materials plus expanded coverage on the use of coatings to extend cutting tool and die life. There is also valuable information on alternative heat treatments for improving the toughness of tool and die steels. All new material on the correlation of heat treatment microstructures and properties of tool steels is supplemented with dozens of photomicrographs. Information on special tooling considerations for demanding applications such as isothermal forging, die casting of metal matrix composites, and molding of corrosive plastics is also included. And you'll learn about alternatives to ferrous materials for metalworking applications such as carbides, cermets, ceramics, and nonferrous metals like aluminum, nickel, and copper base alloys.
Author | : Massimo Rudan |
Publisher | : Springer Nature |
Total Pages | : 1680 |
Release | : 2022-11-10 |
Genre | : Technology & Engineering |
ISBN | : 3030798275 |
This Springer Handbook comprehensively covers the topic of semiconductor devices, embracing all aspects from theoretical background to fabrication, modeling, and applications. Nearly 100 leading scientists from industry and academia were selected to write the handbook's chapters, which were conceived for professionals and practitioners, material scientists, physicists and electrical engineers working at universities, industrial R&D, and manufacturers. Starting from the description of the relevant technological aspects and fabrication steps, the handbook proceeds with a section fully devoted to the main conventional semiconductor devices like, e.g., bipolar transistors and MOS capacitors and transistors, used in the production of the standard integrated circuits, and the corresponding physical models. In the subsequent chapters, the scaling issues of the semiconductor-device technology are addressed, followed by the description of novel concept-based semiconductor devices. The last section illustrates the numerical simulation methods ranging from the fabrication processes to the device performances. Each chapter is self-contained, and refers to related topics treated in other chapters when necessary, so that the reader interested in a specific subject can easily identify a personal reading path through the vast contents of the handbook.
Author | : Abraham Landzberg |
Publisher | : Springer Science & Business Media |
Total Pages | : 663 |
Release | : 2012-12-06 |
Genre | : Technology & Engineering |
ISBN | : 1461520290 |
The world of microelectronics is filled with cusses measurement systems, manufacturing many success stories. From the use of semi control techniques, test, diagnostics, and fail ure analysis. It discusses methods for modeling conductors for powerful desktop computers to their use in maintaining optimum engine per and reducing defects, and for preventing de formance in modem automobiles, they have fects in the first place. The approach described, clearly improved our daily lives. The broad while geared to the microelectronics world, has useability of the technology is enabled, how applicability to any manufacturing process of similar complexity. The authors comprise some ever, only by the progress made in reducing their cost and improving their reliability. De of the best scientific minds in the world, and fect reduction receives a significant focus in our are practitioners of the art. The information modem manufacturing world, and high-quality captured here is world class. I know you will diagnostics is the key step in that process. find the material to be an excellent reference in of product failures enables step func Analysis your application. tion improvements in yield and reliability. which works to reduce cost and open up new Dr. Paul R. Low applications and technologies. IBM Vice President and This book describes the process ofdefect re of Technology Products General Manager duction in the microelectronics world.
Author | : D. M. Mattox |
Publisher | : Cambridge University Press |
Total Pages | : 947 |
Release | : 2014-09-19 |
Genre | : Technology & Engineering |
ISBN | : 0080946585 |
This book covers all aspects of physical vapor deposition (PVD) process technology from the characterizing and preparing the substrate material, through deposition processing and film characterization, to post-deposition processing. The emphasis of the book is on the aspects of the process flow that are critical to economical deposition of films that can meet the required performance specifications. The book covers subjects seldom treated in the literature: substrate characterization, adhesion, cleaning and the processing. The book also covers the widely discussed subjects of vacuum technology and the fundamentals of individual deposition processes. However, the author uniquely relates these topics to the practical issues that arise in PVD processing, such as contamination control and film growth effects, which are also rarely discussed in the literature. In bringing these subjects together in one book, the reader can understand the interrelationship between various aspects of the film deposition processing and the resulting film properties. The author draws upon his long experience with developing PVD processes and troubleshooting the processes in the manufacturing environment, to provide useful hints for not only avoiding problems, but also for solving problems when they arise. He uses actual experiences, called ""war stories"", to emphasize certain points. Special formatting of the text allows a reader who is already knowledgeable in the subject to scan through a section and find discussions that are of particular interest. The author has tried to make the subject index as useful as possible so that the reader can rapidly go to sections of particular interest. Extensive references allow the reader to pursue subjects in greater detail if desired. The book is intended to be both an introduction for those who are new to the field and a valuable resource to those already in the field. The discussion of transferring technology between R&D and manufacturing provided in Appendix 1, will be of special interest to the manager or engineer responsible for moving a PVD product and process from R&D into production. Appendix 2 has an extensive listing of periodical publications and professional societies that relate to PVD processing. The extensive Glossary of Terms and Acronyms provided in Appendix 3 will be of particular use to students and to those not fully conversant with the terminology of PVD processing or with the English language.
Author | : George E. Totten |
Publisher | : CRC Press |
Total Pages | : 776 |
Release | : 2004-04-30 |
Genre | : Science |
ISBN | : 9780203021545 |
Navigating through an extensive compilation of surface modification reactions and processes for specific tribological results, this reference compiles detailed studies, many not found in other texts, on various residual stresses, reaction processes and mechanisms, heat treatment methods, plasma-based techniques, laser impingement, nanometer scale surface modification, and more. Surface Modification and Mechanisms: Friction, Stress, and Reaction Engineering offers guidelines for the consideration and design of wear and frictional performance and provides a unique understanding of surface structural changes that occur during various engineering procedures.
Author | : S. Coffa |
Publisher | : Newnes |
Total Pages | : 1031 |
Release | : 1995-05-16 |
Genre | : Science |
ISBN | : 044459972X |
The aim of these proceedings is to present and stimulate discussion on the many subjects related to ion implantation among a broad mix of specialists from areas as diverse as materials science, device production and advanced ion implanters.The contents open with a paper on the future developments of the microelectronics industry in Europe within the framework of the global competition. The subsequent invited and oral presentations cover in detail the following areas: trends in processing and devices, ion-solid interaction, materials science issues, advanced implanter systms, process control and yield, future trends and applications.