Ion Implantation and Plasma Assisted Processes
Author | : Robert Francis Hochman |
Publisher | : |
Total Pages | : 252 |
Release | : 1988 |
Genre | : Science |
ISBN | : |
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Author | : Robert Francis Hochman |
Publisher | : |
Total Pages | : 252 |
Release | : 1988 |
Genre | : Science |
ISBN | : |
Author | : Michael A. Lieberman |
Publisher | : John Wiley & Sons |
Total Pages | : 837 |
Release | : 2024-08-28 |
Genre | : Technology & Engineering |
ISBN | : 1394245394 |
A new edition of this industry classic on the principles of plasma processing Plasma-based technology and materials processes have been central to the revolution of the last half-century in micro- and nano-electronics. From anisotropic plasma etching on microprocessors, memory, and analog chips, to plasma deposition for creating solar panels and flat-panel displays, plasma-based materials processes have reached huge areas of technology. As key technologies scale down in size from the nano- to the atomic level, further developments in plasma materials processing will only become more essential. Principles of Plasma Discharges and Materials Processing is the foundational introduction to the subject. It offers detailed information and procedures for designing plasma-based equipment and analyzing plasma-based processes, with an emphasis on the abiding fundamentals. Now fully updated to reflect the latest research and data, it promises to continue as an indispensable resource for graduate students and industry professionals in a myriad of technological fields. Readers of the third edition of Principles of Plasma Discharges and Materials Processing will also find: Extensive figures and tables to facilitate understanding A new chapter covering the recent development of processes involving high-pressure capacitive discharges New subsections on discharge and processing chemistry, physics, and diagnostics Principles of Plasma Discharges and Materials Processing is ideal for professionals and process engineers in the field of plasma-assisted materials processing with experience in the field of science or engineering. It is the premiere world-wide basic text for graduate courses in the field.
Author | : E.F. Krimmel |
Publisher | : Elsevier |
Total Pages | : 744 |
Release | : 1989-02-01 |
Genre | : Technology & Engineering |
ISBN | : 0444596364 |
This symposium attracted 82 papers which were presented orally or as posters. Fourteen invited speakers presented state of the art reviews and aspects of future key topics in this increasingly important area of materials science. The high level of scientific presentation during the conference enhanced the aim of the symposium, which was to stimulate discussion amongst materials scientists, chemists, engineers and physicists with a common interest in this field and to disseminate knowledge of progress.
Author | : Ramnarayan Chattopadhyay |
Publisher | : Springer Science & Business Media |
Total Pages | : 377 |
Release | : 2007-05-08 |
Genre | : Technology & Engineering |
ISBN | : 1402077645 |
Surfaces are the bounding faces of solids. The interaction of component surface with the working environment results in wear and corrosion. Estimated loss due to wear and corrosion in the USA is around $500 billion. Engineered surfaces are the key to the reduction of losses due to wear and corrosion. There are surface engineering books on specific processes such as thermal spraying and vapor phase deposition or about specific heat sources such as plasma or laser. However, there are few, if any, covering the whole range of advanced surface engineering processes. Advanced Thermally Assisted Surface Engineering Processes has been structured to provide assistance and guidance to the engineers, researchers and students in choosing the right process from the galaxy of newer surface engineering techniques using advanced heat sources.
Author | : S. Coffa |
Publisher | : Springer Science & Business Media |
Total Pages | : 523 |
Release | : 2012-12-06 |
Genre | : Technology & Engineering |
ISBN | : 940112714X |
Semiconductors lie at the heart of some of the most important industries and technologies of the twentieth century. The complexity of silicon integrated circuits is increasing considerably because of the continuous dimensional shrinkage to improve efficiency and functionality. This evolution in design rules poses real challenges for the materials scientists and processing engineers. Materials, defects and processing now have to be understood in their totality. World experts discuss, in this volume, the crucial issues facing lithography, ion implication and plasma processing, metallization and insulating layer quality, and crystal growth. Particular emphasis is placed upon silicon, but compound semiconductors and photonic materials are also highlighted. The fundamental concepts of phase stability, interfaces and defects play a key role in understanding these crucial issues. These concepts are reviewed in a crucial fashion.
Author | : S. Coffa |
Publisher | : Newnes |
Total Pages | : 1031 |
Release | : 1995-05-16 |
Genre | : Science |
ISBN | : 044459972X |
The aim of these proceedings is to present and stimulate discussion on the many subjects related to ion implantation among a broad mix of specialists from areas as diverse as materials science, device production and advanced ion implanters.The contents open with a paper on the future developments of the microelectronics industry in Europe within the framework of the global competition. The subsequent invited and oral presentations cover in detail the following areas: trends in processing and devices, ion-solid interaction, materials science issues, advanced implanter systms, process control and yield, future trends and applications.
Author | : R. Kossowsky |
Publisher | : Springer Science & Business Media |
Total Pages | : 766 |
Release | : 2012-12-06 |
Genre | : Technology & Engineering |
ISBN | : 9400962169 |
Over the last few years there has been increasing need for systematic and straregically designed experiments of surface morphology evolution resulting form ion bombardment induced sputtering. Although there is an impressive number of investi gations {1} concerned with semiconductor materials as a result of immediate applications, the most systematic investigations have been conducted with fcc metals with particular interest on single crystal Cu {2,3}. Evidence now exists that within certain para meters (i. e ion species (Ar+), ion energy (20-44 KeV), substrate 2 temperature (80-550° K), dose rate (100-500 gA cm- ) , residual x 5 9 pressure (5 10- to 5x10- mm Hg) and polar and azimuthal angle of ion incidence {4} reproducible surface morphology (etch pits and pyramids) is achieved on the (11 3 1) specific crystallographic orientation. The temporal development of individual surface features was alsoobserved in this laterstudy {4}, by employing an in situ ion source in the scanning electron microscope at Salford, a technique also empolyed in studies of the influence of polar angle of ion incidence {5} and surface contaminants {6} on the topographyof Ar+ bombarded Si. Studies have also been made on the variation of incident ion species with the (11 3 1) Cu surface and it was fully recognized {7} that residual surface contaminants when present could playa major role in dictating the morhological evolution.
Author | : George E. Totten |
Publisher | : CRC Press |
Total Pages | : 922 |
Release | : 2004-04-30 |
Genre | : Technology & Engineering |
ISBN | : 0824752686 |
Leading readers through an extensive compilation of surface modification reactions and processes for specific tribological results, this reference compiles detailed studies on various residual stresses, reaction processes and mechanisms, heat treatment methods, plasma-based techniques, and more, for a solid understanding of surface structural changes that occur during various engineering procedures. This unique book explores topics previously ignored in other texts on surface engineering and tribology, offers guidelines for the consideration and design of wear life and frictional performance, and sections on laser impingement and nanometer scale surface modification.
Author | : P.L.F. Hemment |
Publisher | : Newnes |
Total Pages | : 630 |
Release | : 2012-12-02 |
Genre | : Technology & Engineering |
ISBN | : 0444596313 |
Containing the proceedings of three symposia in the E-MRS series this book is divided into two parts. Part one is concerned with ion beam processing, a particularly powerful and versatile technology which can be used both to synthesise and modify materials, including metals, semiconductors, ceramics and dielectrics, with great precision and excellent control. Furthermore it also deals with the correlated effects in atomic and cluster ion bombardment and implantation.Part two deals with the deposition techniques, characterization and applications of advanced ceramic, metallic and polymeric coatings or thin films for surface protection against corrosion, erosion, abrasion, diffusion and for lubrication of contracting surfaces in relative motion.
Author | : Munir H. Nayfeh |
Publisher | : Elsevier |
Total Pages | : 604 |
Release | : 2018-06-29 |
Genre | : Science |
ISBN | : 0323480586 |
Fundamentals and Applications of Nano Silicon in Plasmonics and Fullerines: Current and Future Trends addresses current and future trends in the application and commercialization of nanosilicon. The book presents current, innovative and prospective applications and products based on nanosilicon and their binary system in the fields of energy harvesting and storage, lighting (solar cells and nano-capacitor and fuel cell devices and nanoLEDs), electronics (nanotransistors and nanomemory, quantum computing, photodetectors for space applications; biomedicine (substance detection, plasmonic treatment of disease, skin and hair care, implantable glucose sensor, capsules for drug delivery and underground water and oil exploration), and art (glass and pottery). Moreover, the book includes material on the use of advanced laser and proximal probes for imaging and manipulation of nanoparticles and atoms. In addition, coverage is given to carbon and how it contrasts and integrates with silicon with additional related applications. This is a valuable resource to all those seeking to learn more about the commercialization of nanosilicon, and to researchers wanting to learn more about emerging nanosilicon applications. - Features a variety of designs and operation of nano-devices, helping engineers to make the best use of nanosilicon - Contains underlying principles of how nanomaterials work and the variety of applications they provide, giving those new to nanosilicon a fundamental understanding - Assesses the viability of various nanoslicon devices for mass production and commercialization, thereby providing an important source of information for engineers