Introduction To Microsystem Technology
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| Author | : Wolfgang Menz |
| Publisher | : John Wiley & Sons |
| Total Pages | : 512 |
| Release | : 2008-07-11 |
| Genre | : Technology & Engineering |
| ISBN | : 3527613013 |
This completely revised edition of a bestselling concise introduction to microsystems technology includes the latest trends in this emerging scientific discipline. The chapters on silicium and LIGA technology are greatly expanded, whilst new topics include application aspects in medicine and health technology, lithography and electroplating.
| Author | : Gerald Gerlach |
| Publisher | : John Wiley & Sons |
| Total Pages | : 376 |
| Release | : 2008-04-30 |
| Genre | : Technology & Engineering |
| ISBN | : 0470770929 |
Over half a century after the discovery of the piezoresistive effect, microsystem technology has experienced considerable developments. Expanding the opportunities of microelectronics to non-electronic systems, its number of application fields continues to increase. Microsensors are one of the most important fields, used in medical applications and micromechanics. Microfluidic systems are also a significant area, most commonly used in ink-jet printer heads. This textbook focuses on the essentials of microsystems technology, providing a knowledgeable grounding and a clear path through this well-established scientific dicipline. With a methodical, student-orientated approach, Introduction to Microsystem Technology covers the following: microsystem materials (including silicon, polymers and thin films), and the scaling effects of going micro; fabrication techniques based on different material properties, descriptions of their limitations and functional and shape elements produced by these techniques; sensors and actuators based on elements such as mechanical, fluidic, and thermal (yaw rate sensor components are described); the influence of technology parameters on microsystem properties, asking, for example, when is the function of a microsystem device robust and safe? The book presents problems at the end of each chapter so that you may test your understanding of the key concepts (full solutions for these are given on an accompanying website). Practical examples are included also, as well as case studies that enable a better understanding of the technology as a whole. With its extensive treatment on the fundamentals of microsystem technology, this book also serves as a compendium for engineers and technicians working with microsystem technology.
| Author | : Yufeng Jin |
| Publisher | : CRC Press |
| Total Pages | : 232 |
| Release | : 2017-12-19 |
| Genre | : Technology & Engineering |
| ISBN | : 1439865973 |
The multi-billion-dollar microsystem packaging business continues to play an increasingly important technical role in today’s information industry. The packaging process—including design and manufacturing technologies—is the technical foundation upon which function chips are updated for use in application systems, and it is an important guarantee of the continued growth of technical content and value of information systems. Introduction to Microsystem Packaging Technology details the latest advances in this vital area, which involves microelectronics, optoelectronics, RF and wireless, MEMS, and related packaging and assembling technologies. It is purposefully written so that each chapter is relatively independent and the book systematically presents the widest possible overview of packaging knowledge. Elucidates the evolving world of packaging technologies for manufacturing The authors begin by introducing the fundamentals, history, and technical challenges of microsystems. Addressing an array of design techniques for packaging and integration, they cover substrate and interconnection technologies, examples of device- and system-level packaging, and various MEMS packaging techniques. The book also discusses module assembly and optoelectronic packaging, reliability methodologies and analysis, and prospects for the evolution and future applications of microsystems packaging and associated environmental protection. With its research examples and targeted reference questions and answers to reinforce understanding, this text is ideal for researchers, engineers, and students involved in microelectronics and MEMS. It is also useful to those who are not directly engaged in packaging but require a solid understanding of the field and its associated technologies.
| Author | : Sergej Fatikow |
| Publisher | : Springer Science & Business Media |
| Total Pages | : 420 |
| Release | : 2013-04-17 |
| Genre | : Computers |
| ISBN | : 3662034506 |
Microsystem technology (MST) integrates very small (up to a few nanometers) mechanical, electronic, optical, and other components on a substrate to construct functional devices. These devices are used as intelligent sensors, actuators, and controllers for medical, automotive, household and many other purposes. This book is a basic introduction to MST for students, engineers, and scientists. It is the first of its kind to cover MST in its entirety. It gives a comprehensive treatment of all important parts of MST such as microfabrication technologies, microactuators, microsensors, development and testing of microsystems, and information processing in microsystems. It surveys products built to date and experimental products and gives a comprehensive view of all developments leading to MST devices and robots.
| Author | : Stephen D. Senturia |
| Publisher | : Springer Science & Business Media |
| Total Pages | : 699 |
| Release | : 2005-12-20 |
| Genre | : Technology & Engineering |
| ISBN | : 0306476010 |
It is a real pleasure to write the Foreword for this book, both because I have known and respected its author for many years and because I expect this book’s publication will mark an important milestone in the continuing worldwide development of microsystems. By bringing together all aspects of microsystem design, it can be expected to facilitate the training of not only a new generation of engineers, but perhaps a whole new type of engineer – one capable of addressing the complex range of problems involved in reducing entire systems to the micro- and nano-domains. This book breaks down disciplinary barriers to set the stage for systems we do not even dream of today. Microsystems have a long history, dating back to the earliest days of mic- electronics. While integrated circuits developed in the early 1960s, a number of laboratories worked to use the same technology base to form integrated sensors. The idea was to reduce cost and perhaps put the sensors and circuits together on the same chip. By the late-60s, integrated MOS-photodiode arrays had been developed for visible imaging, and silicon etching was being used to create thin diaphragms that could convert pressure into an electrical signal. By 1970, selective anisotropic etching was being used for diaphragm formation, retaining a thick silicon rim to absorb package-induced stresses. Impurity- and electrochemically-based etch-stops soon emerged, and "bulk micromachining" came into its own.
| Author | : Rao Tummala |
| Publisher | : McGraw Hill Professional |
| Total Pages | : 979 |
| Release | : 2001-05-08 |
| Genre | : Technology & Engineering |
| ISBN | : 0071500596 |
LEARN ABOUT MICROSYSTEMS PACKAGING FROM THE GROUND UP Written by Rao Tummala, the field’s leading author, Fundamentals of Microsystems Packaging is the only book to cover the field from wafer to systems, including every major contributing technology. This rigorous and thorough introduction to electronic packaging technologies gives you a solid grounding in microelectronics, photonics, RF, packaging design, assembly, reliability, testing, and manufacturing and its relevance to both semiconductors and systems. You’ll find: *Full coverage of electrical, mechanical, chemical, and materials aspects of each technology *Easy-to-read schematics and block diagrams *Fundamental approaches to all system issues *Examples of all common configurations and technologies—wafer level packaging, single chip, multichip, RF, opto-electronic, microvia boards, thermal and others *Details on chip-to-board connections, sealing and encapsulation, and manufacturing processes *Basics of electrical and reliability testing
| Author | : G. K. Ananthasuresh |
| Publisher | : Wiley Global Education |
| Total Pages | : 498 |
| Release | : 2012-04-13 |
| Genre | : Technology & Engineering |
| ISBN | : 1118213904 |
Microsystems are systems that integrate, on a chip or a package, one or more of many different categories of microdevices. As the past few decades were dominated by the development and rapid miniaturization of circuitry, the current and coming decades are witnessing a similar revolution in the miniaturization of sensors, actuators, and electronics; and communication, control and power devices. Applications ranging from biomedicine to warfare are driving rapid innovation and growth in the field, which is pushing this topic into graduate and undergraduate curricula in electrical, mechanical, and biomedical engineering.
| Author | : Andreas Manz |
| Publisher | : Springer Science & Business Media |
| Total Pages | : 269 |
| Release | : 2003-09-05 |
| Genre | : Science |
| ISBN | : 3540695443 |
"WHAT DOES NOT NEED TO BE BIG, WILL BE SMALL", a word by an engineer at a recent conference on chips technology. This sentence is particularly true for chemistry. Microfabrication technology emerged from microelectronics into areas like mechanics and now chemistry and biology. The engineering of micron and submicron sized features on the surface of silicon, glass and polymers opens a whole new world. Micromotors smaller than human hair have been fabricated and they work fine. It is the declared goal of the authors to bring these different worlds together in this volume. Authors have been carefully chosen to guarantee for the quality of the contents. An engineer, a chemist or a biologist will find new impulses from the various chapters in this book.
| Author | : Jan G. Korvink |
| Publisher | : Wiley-VCH |
| Total Pages | : 348 |
| Release | : 2002-07-19 |
| Genre | : Technology & Engineering |
| ISBN | : |
Semiconductors play a major role in modern microtechnology, especially in microelectronics. Since the dimensions of new microelectronic components, e.g. computer chips, now reach nanometer size, semiconductor research moves from microtechnology to nanotechnology. An understanding of the semiconductor physics involved in this new technology is of great importance for every student in engineering, especially electrical engineering, microsystem technology and physics. This textbook emphasizes a system-oriented view of semiconductor physics for applications in microsystem technology. While existing books only cover electronic device physics and are mainly written for physics students, this text gives a more hands-on approach to semiconductor physics and so avoids overloading engineering students with mathematical formulas not essential for their studies.
| Author | : Yufeng Jin |
| Publisher | : CRC Press |
| Total Pages | : 233 |
| Release | : 2017-12-19 |
| Genre | : Technology & Engineering |
| ISBN | : 1351832972 |
The multi-billion-dollar microsystem packaging business continues to play an increasingly important technical role in today’s information industry. The packaging process—including design and manufacturing technologies—is the technical foundation upon which function chips are updated for use in application systems, and it is an important guarantee of the continued growth of technical content and value of information systems. Introduction to Microsystem Packaging Technology details the latest advances in this vital area, which involves microelectronics, optoelectronics, RF and wireless, MEMS, and related packaging and assembling technologies. It is purposefully written so that each chapter is relatively independent and the book systematically presents the widest possible overview of packaging knowledge. Elucidates the evolving world of packaging technologies for manufacturing The authors begin by introducing the fundamentals, history, and technical challenges of microsystems. Addressing an array of design techniques for packaging and integration, they cover substrate and interconnection technologies, examples of device- and system-level packaging, and various MEMS packaging techniques. The book also discusses module assembly and optoelectronic packaging, reliability methodologies and analysis, and prospects for the evolution and future applications of microsystems packaging and associated environmental protection. With its research examples and targeted reference questions and answers to reinforce understanding, this text is ideal for researchers, engineers, and students involved in microelectronics and MEMS. It is also useful to those who are not directly engaged in packaging but require a solid understanding of the field and its associated technologies.
