Frontiers of Characterization and Metrology for Nanoelectronics

Frontiers of Characterization and Metrology for Nanoelectronics
Author: David G. Seiler
Publisher: American Inst. of Physics
Total Pages: 0
Release: 2007-09-26
Genre: Science
ISBN: 9780735404410

This book contains peer-reviewed papers presented at the 2007 International Conference on Frontiers of Characterization and Metrology. It emphasizes the frontiers of innovation in the characterization and metrology needed to advance nanoelectronics. It provides an effective portrayal of the industry’s characterization and metrology needs and how they are being addressed. It also offers a foundation for further advances in metrology and new ideas for research and development.

ISTFA 2019: Proceedings of the 45th International Symposium for Testing and Failure Analysis

ISTFA 2019: Proceedings of the 45th International Symposium for Testing and Failure Analysis
Author:
Publisher: ASM International
Total Pages: 540
Release: 2019-12-01
Genre: Technology & Engineering
ISBN: 1627082735

The theme for the 2019 conference is Novel Computing Architectures. Papers will include discussions on the advent of Artificial Intelligence and the promise of quantum computing that are driving disruptive computing architectures; Neuromorphic chip designs on one hand, and Quantum Bits on the other, still in R&D, will introduce new computing circuitry and memory elements, novel materials, and different test methodologies. These novel computing architectures will require further innovation which is best achieved through a collaborative Failure Analysis community composed of chip manufacturers, tool vendors, and universities.

Metrology and Diagnostic Techniques for Nanoelectronics

Metrology and Diagnostic Techniques for Nanoelectronics
Author: Zhiyong Ma
Publisher: CRC Press
Total Pages: 1454
Release: 2017-03-27
Genre: Science
ISBN: 1351733958

Nanoelectronics is changing the way the world communicates, and is transforming our daily lives. Continuing Moore’s law and miniaturization of low-power semiconductor chips with ever-increasing functionality have been relentlessly driving R&D of new devices, materials, and process capabilities to meet performance, power, and cost requirements. This book covers up-to-date advances in research and industry practices in nanometrology, critical for continuing technology scaling and product innovation. It holistically approaches the subject matter and addresses emerging and important topics in semiconductor R&D and manufacturing. It is a complete guide for metrology and diagnostic techniques essential for process technology, electronics packaging, and product development and debugging—a unique approach compared to other books. The authors are from academia, government labs, and industry and have vast experience and expertise in the topics presented. The book is intended for all those involved in IC manufacturing and nanoelectronics and for those studying nanoelectronics process and assembly technologies or working in device testing, characterization, and diagnostic techniques.

Characterization and Metrology for ULSI Technology: 1998 International Conference, 23-27 March 1998

Characterization and Metrology for ULSI Technology: 1998 International Conference, 23-27 March 1998
Author: D.G. Seiler
Publisher: American Institute of Physics
Total Pages: 960
Release: 1998-11-01
Genre: Technology & Engineering
ISBN: 9781563968679

The proceedings of the 1998 International Conference on Characterization and Metrology for ULSI Technology was dedicated to summarizing major issues and giving critical reviews of important semiconductor techniques that are crucial to continue the advances in semiconductor technology. Characterization and metrology are key enablers for developing semiconductor process technology and in improving manufacturing. This is the only book that we know of that emphasizes the science and technology of semiconductor characterization in the factory environment. The increasing importance of monitoring and controlling semiconductor processes make it particularly timely.

3D Microelectronic Packaging

3D Microelectronic Packaging
Author: Yan Li
Publisher: Springer Nature
Total Pages: 629
Release: 2020-11-23
Genre: Technology & Engineering
ISBN: 9811570906

This book offers a comprehensive reference guide for graduate students and professionals in both academia and industry, covering the fundamentals, architecture, processing details, and applications of 3D microelectronic packaging. It provides readers an in-depth understanding of the latest research and development findings regarding this key industry trend, including TSV, die processing, micro-bumps for LMI and MMI, direct bonding and advanced materials, as well as quality, reliability, fault isolation, and failure analysis for 3D microelectronic packages. Images, tables, and didactic schematics are used to illustrate and elaborate on the concepts discussed. Readers will gain a general grasp of 3D packaging, quality and reliability concerns, and common causes of failure, and will be introduced to developing areas and remaining gaps in 3D packaging that can help inspire future research and development.

Characterization and Metrology for ULSI Technology 2000

Characterization and Metrology for ULSI Technology 2000
Author: David G. Seiler
Publisher: American Institute of Physics
Total Pages: 708
Release: 2001-03-01
Genre: Technology & Engineering
ISBN: 9781563969676

The worldwide semiconductor community faces increasingly difficult challenges as it moves into the manufacturing of chips with feature sizes approaching 100 nm. Some of the challenges are materials-related, such as transistors with high-k dielectrics and on-chip interconnects made from copper and low-k dielectrics. The magnitude of these challenges demands special attention from those in the metrology and analytical measurements community. Characterization and metrology are key enablers for developing semiconductor process technology and in improving manufacturing. This book summarizes major issues and gives critical reviews of important measurement techniques that are crucial to continue the advances in semiconductor technology. It covers major aspects of the process technology and most characterization techniques for silicon research, including development, manufacturing, and diagnostics. It provides a concise and effective portrayal of industry characterization needs and some of the problems that must be addressed by industry, academia, and government to continue the dramatic progress in semiconductor technology. It also provides a basis for stimulating practical perspectives and new ideas for research and development.