Modeling, Analysis and Optimization of Network-on-Chip Communication Architectures

Modeling, Analysis and Optimization of Network-on-Chip Communication Architectures
Author: Umit Y. Ogras
Publisher: Springer Science & Business Media
Total Pages: 182
Release: 2013-03-12
Genre: Technology & Engineering
ISBN: 9400739583

Traditionally, design space exploration for Systems-on-Chip (SoCs) has focused on the computational aspects of the problem at hand. However, as the number of components on a single chip and their performance continue to increase, the communication architecture plays a major role in the area, performance and energy consumption of the overall system. As a result, a shift from computation-based to communication-based design becomes mandatory. Towards this end, network-on-chip (NoC) communication architectures have emerged recently as a promising alternative to classical bus and point-to-point communication architectures. In this dissertation, we study outstanding research problems related to modeling, analysis and optimization of NoC communication architectures. More precisely, we present novel design methodologies, software tools and FPGA prototypes to aid the design of application-specific NoCs.

Masters Theses in the Pure and Applied Sciences

Masters Theses in the Pure and Applied Sciences
Author: Wade H. Shafer
Publisher: Springer Science & Business Media
Total Pages: 430
Release: 2012-12-06
Genre: Science
ISBN: 1461573947

Masters Theses in the Pure and Applied Sciences was first conceived, published, and disseminated by the Center for Information and Numerical Oata Analysis and Synthesis (CINOAS) * at Purdue. University in 1957, starting its coverage of theses with the academic year 1955. Beginning with Volume 13, the printing and dissemination phases of the activity were transferred to University Microfilms/Xerox of Ann Arbor, Michigan, with the thought that such an arrangement would be more beneficial to the academic and general scientific and technical community. After five years of this joint undertaking we had concluded that it was in the interest of all con cerned if the printing and distribution of the volumes were handled by an interna tional publishing house to assure improved service and broader dissemination. Hence, starting with Volume 18, Masters Theses in the Pure and Applied Sciences has been disseminated on a worldwide basis by Plenum Publishing Cor poration of New York, and in the same year the coverage was broadened to include Canadian universities. All back issues can also be ordered from Plenum. We have reported in Volume 33 (thesis year 1988) a total of 13,273 theses titles from 23 Canadian and 1 85 United States universities. We are sure that this broader base for these titles reported will greatly enhance the value of this important annual reference work. While Volume 33 reports theses submitted in 1988, on occasion, certain univer sities do report theses submitted in previous years but not reported at the time.

Interconnection Networks

Interconnection Networks
Author: Jose Duato
Publisher: Morgan Kaufmann
Total Pages: 626
Release: 2003
Genre: Computers
ISBN: 1558608524

Foreword -- Foreword to the First Printing -- Preface -- Chapter 1 -- Introduction -- Chapter 2 -- Message Switching Layer -- Chapter 3 -- Deadlock, Livelock, and Starvation -- Chapter 4 -- Routing Algorithms -- Chapter 5 -- CollectiveCommunicationSupport -- Chapter 6 -- Fault-Tolerant Routing -- Chapter 7 -- Network Architectures -- Chapter 8 -- Messaging Layer Software -- Chapter 9 -- Performance Evaluation -- Appendix A -- Formal Definitions for Deadlock Avoidance -- Appendix B -- Acronyms -- References -- Index.

The Engineering Index Annual

The Engineering Index Annual
Author:
Publisher:
Total Pages: 2264
Release: 1992
Genre: Engineering
ISBN:

Since its creation in 1884, Engineering Index has covered virtually every major engineering innovation from around the world. It serves as the historical record of virtually every major engineering innovation of the 20th century. Recent content is a vital resource for current awareness, new production information, technological forecasting and competitive intelligence. The world?s most comprehensive interdisciplinary engineering database, Engineering Index contains over 10.7 million records. Each year, over 500,000 new abstracts are added from over 5,000 scholarly journals, trade magazines, and conference proceedings. Coverage spans over 175 engineering disciplines from over 80 countries. Updated weekly.

Selected Papers on Optical Interconnects and Packaging

Selected Papers on Optical Interconnects and Packaging
Author: Sing H. Lee
Publisher: SPIE-International Society for Optical Engineering
Total Pages: 744
Release: 1997
Genre: Computers
ISBN:

SPIE Milestones are collections of seminal papers from the world literature covering important discoveries and developments in optics and photonics.