Integrating Iii V Compound Semiconductors With Silicon Using Wafer Bonding
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III-V Compound Semiconductors
Author | : Tingkai Li |
Publisher | : CRC Press |
Total Pages | : 588 |
Release | : 2016-04-19 |
Genre | : Science |
ISBN | : 1439815232 |
Silicon-based microelectronics has steadily improved in various performance-to-cost metrics. But after decades of processor scaling, fundamental limitations and considerable new challenges have emerged. The integration of compound semiconductors is the leading candidate to address many of these issues and to continue the relentless pursuit of more
Semiconductor Wafer Bonding 10: Science, Technology, and Applications
Author | : |
Publisher | : The Electrochemical Society |
Total Pages | : 588 |
Release | : 2008-10 |
Genre | : Microelectromechanical systems |
ISBN | : 1566776546 |
This issue of ECS Transactions on Semiconductor Wafer Bonding will cover the state-of-the-art R&D results of the last 2 years in the field of semiconductor wafer bonding technology. Wafer Bonding is an Enabling Technology that can be used to create novel composite materials systems and devices that would otherwise be unattainable. Wafer Bonding today is rapidly expanding into new applications in such diverse fields as photonics, sensors, MEMS. X-ray optics, non-electronic microstructures, high performance CMOS platforms for high end servers, Si-Ge, strained SOI, Germanium-on-Insulator (GeOI) and Nanotechnologies.
Wafer Bonding
Author | : Marin Alexe |
Publisher | : Springer Science & Business Media |
Total Pages | : 524 |
Release | : 2004-05-14 |
Genre | : Science |
ISBN | : 9783540210498 |
During the past decade direct wafer bonding has developed into a mature materials integration technology. This book presents state-of-the-art reviews of the most important applications of wafer bonding written by experts from industry and academia. The topics include bonding-based fabrication methods of silicon-on-insulator, photonic crystals, VCSELs, SiGe-based FETs, MEMS together with hybrid integration and laser lift-off. The non-specialist will learn about the basics of wafer bonding and its various application areas, while the researcher in the field will find up-to-date information about this fast-moving area, including relevant patent information.
SiGe, Ge, and Related Compounds 6: Materials, Processing, and Devices
Author | : D. Harame |
Publisher | : The Electrochemical Society |
Total Pages | : 1042 |
Release | : |
Genre | : |
ISBN | : 1607685434 |
III–V Compound Semiconductors and Devices
Author | : Keh Yung Cheng |
Publisher | : Springer Nature |
Total Pages | : 537 |
Release | : 2020-11-08 |
Genre | : Technology & Engineering |
ISBN | : 3030519031 |
This textbook gives a complete and fundamental introduction to the properties of III-V compound semiconductor devices, highlighting the theoretical and practical aspects of their device physics. Beginning with an introduction to the basics of semiconductor physics, it presents an overview of the physics and preparation of compound semiconductor materials, as well as a detailed look at the electrical and optical properties of compound semiconductor heterostructures. The book concludes with chapters dedicated to a number of heterostructure electronic and photonic devices, including the high-electron-mobility transistor, the heterojunction bipolar transistor, lasers, unipolar photonic devices, and integrated optoelectronic devices. Featuring chapter-end problems, suggested references for further reading, as well as clear, didactic schematics accompanied by six information-rich appendices, this textbook is ideal for graduate students in the areas of semiconductor physics or electrical engineering. In addition, up-to-date results from published research make this textbook especially well-suited as a self-study and reference guide for engineers and researchers in related industries.
Hybrid photonic assemblies based on 3D-printed coupling structures
Author | : Xu, Yilin |
Publisher | : KIT Scientific Publishing |
Total Pages | : 290 |
Release | : 2023-04-24 |
Genre | : Technology & Engineering |
ISBN | : 3731512734 |
Advances in Optical Fiber Technology
Author | : Moh Yasin |
Publisher | : BoD – Books on Demand |
Total Pages | : 454 |
Release | : 2015-02-25 |
Genre | : Technology & Engineering |
ISBN | : 9535117424 |
This book is a compilation of works presenting recent developments and practical applications in optical fiber technology. It contains 13 chapters from various institutions that represent global research in various topics such as scattering, dispersion, polarization interference, fuse phenomena and optical manipulation, optical fiber laser and sensor applications, passive optical network (PON) and plastic optical fiber (POF) technology. It provides the reader with a broad overview and sampling of the innovative research on optical fiber technologies.
High Brightness Light Emitting Diodes
Author | : |
Publisher | : Academic Press |
Total Pages | : 489 |
Release | : 1998-02-09 |
Genre | : Technology & Engineering |
ISBN | : 0080864457 |
Volume 48in the Semiconductors and Semimetals series discusses the physics and chemistry of electronic materials, a subject of growing practical importance in the semiconductor devices industry. The contributors discuss the current state of knowledge and provide insight into future developments of this important field.
Semiconductor Wafer Bonding : Science, Technology, and Applications V
Author | : Charles E. Hunt |
Publisher | : The Electrochemical Society |
Total Pages | : 496 |
Release | : 2001 |
Genre | : Technology & Engineering |
ISBN | : 9781566772587 |