In Line Characterization Yield Reliability And Failure Analysis In Microelectronic Manufacturing Ii
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Author | : Gudrun Kissinger |
Publisher | : Society of Photo Optical |
Total Pages | : 242 |
Release | : 2001 |
Genre | : Technology & Engineering |
ISBN | : 9780819441072 |
Author | : |
Publisher | : |
Total Pages | : 266 |
Release | : 2001 |
Genre | : Integrated circuits |
ISBN | : |
Author | : |
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Total Pages | : |
Release | : 1999 |
Genre | : |
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Author | : European Optical Society |
Publisher | : Society of Photo Optical |
Total Pages | : 344 |
Release | : 1999 |
Genre | : Technology & Engineering |
ISBN | : 9780819432230 |
Author | : |
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Total Pages | : |
Release | : 1999 |
Genre | : |
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Author | : Sergio Ajuria |
Publisher | : SPIE-International Society for Optical Engineering |
Total Pages | : 258 |
Release | : 1998 |
Genre | : Computers |
ISBN | : |
A collection of papers on in-line characterization techniques for performance and yield enhancement in microelectronic manufacturing. They cover: electrical/field emission techniques; optical and em-wave techniques; and surface photovoltage techniques.
Author | : Way Kuo |
Publisher | : Springer Science & Business Media |
Total Pages | : 407 |
Release | : 2013-11-27 |
Genre | : Technology & Engineering |
ISBN | : 1461556716 |
The international market is very competitive for high-tech manufacturers to day. Achieving competitive quality and reliability for products requires leader ship from the top, good management practices, effective and efficient operation and maintenance systems, and use of appropriate up-to-date engineering de sign tools and methods. Furthermore, manufacturing yield and reliability are interrelated. Manufacturing yield depends on the number of defects found dur ing both the manufacturing process and the warranty period, which in turn determines the reliability. the production of microelectronics has evolved into Since the early 1970's, one of the world's largest manufacturing industries. As a result, an important agenda is the study of reliability issues in fabricating microelectronic products and consequently the systems that employ these products, particularly, the new generation of microelectronics. Such an agenda should include: • the economic impact of employing the microelectronics fabricated by in dustry, • a study of the relationship between reliability and yield, • the progression toward miniaturization and higher reliability, and • the correctness and complexity of new system designs, which include a very significant portion of software.
Author | : |
Publisher | : |
Total Pages | : 266 |
Release | : 1998 |
Genre | : Integrated circuits |
ISBN | : |
Author | : D. Harame |
Publisher | : The Electrochemical Society |
Total Pages | : 1042 |
Release | : |
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ISBN | : 1607685434 |
Author | : Marius Bazu |
Publisher | : John Wiley & Sons |
Total Pages | : 372 |
Release | : 2011-03-08 |
Genre | : Technology & Engineering |
ISBN | : 1119990009 |
Failure analysis is the preferred method to investigate product or process reliability and to ensure optimum performance of electrical components and systems. The physics-of-failure approach is the only internationally accepted solution for continuously improving the reliability of materials, devices and processes. The models have been developed from the physical and chemical phenomena that are responsible for degradation or failure of electronic components and materials and now replace popular distribution models for failure mechanisms such as Weibull or lognormal. Reliability engineers need practical orientation around the complex procedures involved in failure analysis. This guide acts as a tool for all advanced techniques, their benefits and vital aspects of their use in a reliability programme. Using twelve complex case studies, the authors explain why failure analysis should be used with electronic components, when implementation is appropriate and methods for its successful use. Inside you will find detailed coverage on: a synergistic approach to failure modes and mechanisms, along with reliability physics and the failure analysis of materials, emphasizing the vital importance of cooperation between a product development team involved the reasons why failure analysis is an important tool for improving yield and reliability by corrective actions the design stage, highlighting the ‘concurrent engineering' approach and DfR (Design for Reliability) failure analysis during fabrication, covering reliability monitoring, process monitors and package reliability reliability resting after fabrication, including reliability assessment at this stage and corrective actions a large variety of methods, such as electrical methods, thermal methods, optical methods, electron microscopy, mechanical methods, X-Ray methods, spectroscopic, acoustical, and laser methods new challenges in reliability testing, such as its use in microsystems and nanostructures This practical yet comprehensive reference is useful for manufacturers and engineers involved in the design, fabrication and testing of electronic components, devices, ICs and electronic systems, as well as for users of components in complex systems wanting to discover the roots of the reliability flaws for their products.