Ieee Ninth Annual Semiconductor Thermal Measurement And Management Symposium 1993
Download Ieee Ninth Annual Semiconductor Thermal Measurement And Management Symposium 1993 full books in PDF, epub, and Kindle. Read online free Ieee Ninth Annual Semiconductor Thermal Measurement And Management Symposium 1993 ebook anywhere anytime directly on your device. Fast Download speed and no annoying ads. We cannot guarantee that every ebooks is available!
Handbook of 3D Integration, Volume 4
| Author | : Paul D. Franzon |
| Publisher | : John Wiley & Sons |
| Total Pages | : 492 |
| Release | : 2019-01-25 |
| Genre | : Technology & Engineering |
| ISBN | : 3527697047 |
This fourth volume of the landmark handbook focuses on the design, testing, and thermal management of 3D-integrated circuits, both from a technological and materials science perspective. Edited and authored by key contributors from top research institutions and high-tech companies, the first part of the book provides an overview of the latest developments in 3D chip design, including challenges and opportunities. The second part focuses on the test methods used to assess the quality and reliability of the 3D-integrated circuits, while the third and final part deals with thermal management and advanced cooling technologies and their integration.
Microscale Heat Transfer - Fundamentals and Applications
| Author | : S. Kakaç |
| Publisher | : Springer Science & Business Media |
| Total Pages | : 517 |
| Release | : 2006-05-20 |
| Genre | : Technology & Engineering |
| ISBN | : 1402033613 |
This volume contains an archival record of the NATO Advanced Institute on Microscale Heat Transfer – Fundamental and Applications in Biological and Microelectromechanical Systems held in Çesme – Izmir, Turkey, July 18–30, 2004. The ASIs are intended to be high-level teaching activity in scientific and technical areas of current concern. In this volume, the reader may find interesting chapters and various Microscale Heat Transfer Fundamental and Applications. The growing use of electronics, in both military and civilian applications has led to the widespread recognition for need of thermal packaging and management. The use of higher densities and frequencies in microelectronic circuits for computers are increasing day by day. They require effective cooling due to heat generated that is to be dissipated from a relatively low surface area. Hence, the development of efficient cooling techniques for integrated circuit chips is one of the important contemporary applications of Microscale Heat Transfer which has received much attention for cooling of high power electronics and applications in biomechanical and aerospace industries. Microelectromechanical systems are subject of increasing active research in a widening field of discipline. These topics and others are the main themeof this Institute.
Theory and Practice of Thermal Transient Testing of Electronic Components
| Author | : Marta Rencz |
| Publisher | : Springer Nature |
| Total Pages | : 389 |
| Release | : 2023-01-23 |
| Genre | : Technology & Engineering |
| ISBN | : 3030861740 |
This book discusses the significant aspects of thermal transient testing, the most important method of thermal characterization of electronics available today. The book presents the theoretical background of creating structure functions from the measured results with mathematical details. It then shows how the method can be used for thermal qualification, structure integrity testing, determining material parameters, and calibrating simulation models. General practical questions about measurements are discussed to help beginners carry out thermal transient testing. The particular problems and tricks of measuring with various electronic components, such as Si diodes, bipolar transistors, MOS transistors, IGBT devices, resistors, capacitors, wide bandgap materials, and LEDs, are covered in detail with the help of various use cases. This hands-on book will enable readers to accomplish thermal transient testing on any new type of electronics and provides the theoretical details needed to understand the opportunities and limitations offered by the methodology. The book will be an invaluable reference for practicing engineers, students, and researchers.
Modeling in Analog Design
| Author | : Jean-Michel Bergé |
| Publisher | : Springer Science & Business Media |
| Total Pages | : 160 |
| Release | : 2012-12-06 |
| Genre | : Technology & Engineering |
| ISBN | : 1461523338 |
Modeling in Analog Design highlights some of the most pressing issues in the use of modeling techniques for design of analogue circuits. Using models for circuit design gives designers the power to express directly the behaviour of parts of a circuit in addition to using other pre-defined components. There are numerous advantages to this new category of analog behavioral language. In the short term, by favouring the top-down design and raising the level of description abstraction, this approach provides greater freedom of implementation and a higher degree of technology independence. In the longer term, analog synthesis and formal optimisation are targeted. Modeling in Analog Design introduces the reader to two main language standards: VHDL-A and MHDL. It goes on to provide in-depth examples of the use of these languages to model analog devices. The final part is devoted to the very important topic of modeling the thermal and electrothermal aspects of devices. This book is essential reading for analog designers using behavioral languages and analog CAD tool development environments who have to provide the tools used by the designers.
Interconnect Noise Optimization in Nanometer Technologies
| Author | : Mohamed Elgamel |
| Publisher | : Springer Science & Business Media |
| Total Pages | : 145 |
| Release | : 2006-03-20 |
| Genre | : Technology & Engineering |
| ISBN | : 0387293663 |
Presents a range of CAD algorithms and techniques for synthesizing and optimizing interconnect Provides insight & intuition into layout analysis and optimization for interconnect in high speed, high complexity integrated circuits
Thermal Measurements in Electronics Cooling
| Author | : Kaveh Azar |
| Publisher | : CRC Press |
| Total Pages | : 498 |
| Release | : 2020-08-26 |
| Genre | : Technology & Engineering |
| ISBN | : 1000141268 |
Filled with careful explanations, step-by-step instructions, and useful examples, this handbook focuses on real-world considerations and applications of thermal measurement methods in electronics cooling. Fifteen experts in thermal engineering combine their expertise to create a complete guide to this complex topic. This practical reference covers all aspects of thermal characterization in electronics cooling and thermal management. The first part of the book introduces the concept of electronics cooling and its associated thermal phenomenon and explains why experimental investigation is required. Subsequent chapters explain methods of measuring different parameters and introduce relevant examples. Sources for locating needed equipment, tables, checklists, and to-do lists are included. Sample calculations and methodologies for error analysis ensure that you can put this valuable information to use in your work.
