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| Author | : Walt Trybula |
| Publisher | : Institute of Electrical & Electronics Engineers(IEEE) |
| Total Pages | : 536 |
| Release | : 1995 |
| Genre | : Electronic apparatus and appliances |
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| Author | : |
| Publisher | : |
| Total Pages | : 470 |
| Release | : 2003 |
| Genre | : Electronic apparatus and appliances |
| ISBN | : |
| Author | : |
| Publisher | : |
| Total Pages | : 370 |
| Release | : 2004 |
| Genre | : Electronic apparatus and appliances |
| ISBN | : |
| Author | : John J. Stephens |
| Publisher | : ASM International |
| Total Pages | : 430 |
| Release | : 2006-01-01 |
| Genre | : Technology & Engineering |
| ISBN | : 1615031170 |
| Author | : Eugenio Iannone |
| Publisher | : CRC Press |
| Total Pages | : 1351 |
| Release | : 2018-09-03 |
| Genre | : Medical |
| ISBN | : 1351832069 |
Labs on Chip: Principles, Design and Technology provides a complete reference for the complex field of labs on chip in biotechnology. Merging three main areas— fluid dynamics, monolithic micro- and nanotechnology, and out-of-equilibrium biochemistry—this text integrates coverage of technology issues with strong theoretical explanations of design techniques. Analyzing each subject from basic principles to relevant applications, this book: Describes the biochemical elements required to work on labs on chip Discusses fabrication, microfluidic, and electronic and optical detection techniques Addresses planar technologies, polymer microfabrication, and process scalability to huge volumes Presents a global view of current lab-on-chip research and development Devotes an entire chapter to labs on chip for genetics Summarizing in one source the different technical competencies required, Labs on Chip: Principles, Design and Technology offers valuable guidance for the lab-on-chip design decision-making process, while exploring essential elements of labs on chip useful both to the professional who wants to approach a new field and to the specialist who wants to gain a broader perspective.
| Author | : John Kieffer |
| Publisher | : John Wiley & Sons |
| Total Pages | : 290 |
| Release | : 2009-09-28 |
| Genre | : Technology & Engineering |
| ISBN | : 0470295058 |
This volume is part of the Ceramic Engineering and Science Proceeding (CESP) series. This series contains a collection of papers dealing with issues in both traditional ceramics (i.e., glass, whitewares, refractories, and porcelain enamel) and advanced ceramics. Topics covered in the area of advanced ceramic include bioceramics, nanomaterials, composites, solid oxide fuel cells, mechanical properties and structural design, advanced ceramic coatings, ceramic armor, porous ceramics, and more.
| Author | : Kim S. Siow |
| Publisher | : Springer |
| Total Pages | : 292 |
| Release | : 2019-01-29 |
| Genre | : Technology & Engineering |
| ISBN | : 3319992562 |
This book presents the scientific principles, processing conditions, probable failure mechanisms, and a description of reliability performance and equipment required for implementing high-temperature and lead-free die attach materials. In particular, it addresses the use of solder alloys, silver and copper sintering, and transient liquid-phase sintering. While different solder alloys have been used widely in the microelectronics industry, the implementation of sintering silver and transient liquid-phase sintering remains limited to a handful of companies. Hence, the book devotes many chapters to sintering technologies, while simultaneously providing only a cursory coverage of the more widespread techniques employing solder alloys. Addresses the differences between sintering and soldering (the current die-attach technologies), thereby comprehensively addressing principles, methods, and performance of these high-temperature die-attach materials; Emphasizes the industrial perspective, with chapters written by engineers who have hands-on experience using these technologies; Baker Hughes, Bosch and ON Semiconductor, are represented as well as materials suppliers such as Indium; Simultaneously provides the detailed science underlying these technologies by leading academic researchers in the field.
| Author | : Jie Zhang |
| Publisher | : John Wiley & Sons |
| Total Pages | : 368 |
| Release | : 2017-05-09 |
| Genre | : Technology & Engineering |
| ISBN | : 1118890094 |
At the crossroads of artificial intelligence, manufacturing engineering, operational research and industrial engineering and management, multi-agent based production planning and control is an intelligent and industrially crucial technology with increasing importance. This book provides a complete overview of multi-agent based methods for today’s competitive manufacturing environment, including the Job Shop Manufacturing and Re-entrant Manufacturing processes. In addition to the basic control and scheduling systems, the author also highlights advance research in numerical optimization methods and wireless sensor networks and their impact on intelligent production planning and control system operation. Enables students, researchers and engineers to understand the fundamentals and theories of multi-agent based production planning and control Written by an author with more than 20 years’ experience in studying and formulating a complete theoretical system in production planning technologies Fully illustrated throughout, the methods for production planning, scheduling and controlling are presented using experiments, numerical simulations and theoretical analysis Comprehensive and concise, Multi-Agent Based Production Planning and Control is aimed at the practicing engineer and graduate student in industrial engineering, operational research, and mechanical engineering. It is also a handy guide for advanced students in artificial intelligence and computer engineering.
| Author | : EUROFORUM Deutschland GmbH |
| Publisher | : Springer Nature |
| Total Pages | : 368 |
| Release | : 2019-11-13 |
| Genre | : Technology & Engineering |
| ISBN | : 3662588668 |
Every year, the international transmission and drive community meets up at the International CTI SYMPOSIA – automotive drivetrains, intelligent, electrified – in Germany, China and USA to discuss the best strategies and technologies for tomorrow’s cars, busses and trucks. From efficiency, comfort or costs to electrification, energy storage and connectivity, these premier industry meetings cover all the key issues in depth.
| Author | : Chong Leong, Gan |
| Publisher | : Springer Nature |
| Total Pages | : 223 |
| Release | : 2023-05-30 |
| Genre | : Computers |
| ISBN | : 3031267087 |
This book explains mechanical and thermal reliability for modern memory packaging, considering materials, processes, and manufacturing. In the past 40 years, memory packaging processes have evolved enormously. This book discusses the reliability and technical challenges of first-level interconnect materials, packaging processes, advanced specialty reliability testing, and characterization of interconnects. It also examines the reliability of wire bonding, lead-free solder joints such as reliability testing and data analyses, design for reliability in hybrid packaging and HBM packaging, and failure analyses. The specialty of this book is that the materials covered are not only for second-level interconnects, but also for packaging assembly on first-level interconnects and for the semiconductor back-end on 2.5D and 3D memory interconnects. This book can be used as a text for college and graduate students who have the potential to become our future leaders, scientists, and engineers in the electronics and semiconductor industry.
