IEEE/CPMT International Electronic Manufacturing Technology Symposium : [proceedings].
Author | : |
Publisher | : |
Total Pages | : 194 |
Release | : 1998 |
Genre | : Electronic apparatus and appliances |
ISBN | : |
Download Ieee Cpmt International Electronics Manufacturing Technology Symposium Iemt 1 full books in PDF, epub, and Kindle. Read online free Ieee Cpmt International Electronics Manufacturing Technology Symposium Iemt 1 ebook anywhere anytime directly on your device. Fast Download speed and no annoying ads. We cannot guarantee that every ebooks is available!
Author | : |
Publisher | : |
Total Pages | : 194 |
Release | : 1998 |
Genre | : Electronic apparatus and appliances |
ISBN | : |
Author | : |
Publisher | : |
Total Pages | : 420 |
Release | : 1994 |
Genre | : Electronic apparatus and appliances |
ISBN | : |
Author | : Walt Trybula |
Publisher | : Institute of Electrical & Electronics Engineers(IEEE) |
Total Pages | : 536 |
Release | : 1995 |
Genre | : Electronic apparatus and appliances |
ISBN | : |
Author | : |
Publisher | : |
Total Pages | : 426 |
Release | : 1993 |
Genre | : Electronic apparatus and appliances |
ISBN | : |
Author | : Yash Agrawal |
Publisher | : Springer Nature |
Total Pages | : 286 |
Release | : 2023-10-17 |
Genre | : Technology & Engineering |
ISBN | : 9819944767 |
This contributed book provides a thorough understanding of the basics along with detailed state-of-the-art emerging interconnect technologies for integrated circuit design and flexible electronics. It focuses on the investigation of advanced on-chip interconnects which match the current as well as future technology requirements. The contents focus on different aspects of interconnects such as material, physical characteristics, parasitic extraction, design, structure, modeling, machine learning, and neural network-based models for interconnects, signaling schemes, varying signal integrity performance analysis, variability, reliability aspects, associated electronic design automation tools. The book also explores interconnect technologies for flexible electronic systems. It also highlights the integration of sensors with stretchable interconnects to demonstrate the concept of a stretchable sensing network for wearable and flexible applications. This book is a useful guide for those working in academia and industry to understand the fundamentals and application of interconnect technologies.
Author | : John D. Cressler |
Publisher | : CRC Press |
Total Pages | : 1041 |
Release | : 2017-12-19 |
Genre | : Technology & Engineering |
ISBN | : 143987431X |
Unfriendly to conventional electronic devices, circuits, and systems, extreme environments represent a serious challenge to designers and mission architects. The first truly comprehensive guide to this specialized field, Extreme Environment Electronics explains the essential aspects of designing and using devices, circuits, and electronic systems intended to operate in extreme environments, including across wide temperature ranges and in radiation-intense scenarios such as space. The Definitive Guide to Extreme Environment Electronics Featuring contributions by some of the world’s foremost experts in extreme environment electronics, the book provides in-depth information on a wide array of topics. It begins by describing the extreme conditions and then delves into a description of suitable semiconductor technologies and the modeling of devices within those technologies. It also discusses reliability issues and failure mechanisms that readers need to be aware of, as well as best practices for the design of these electronics. Continuing beyond just the "paper design" of building blocks, the book rounds out coverage of the design realization process with verification techniques and chapters on electronic packaging for extreme environments. The final set of chapters describes actual chip-level designs for applications in energy and space exploration. Requiring only a basic background in electronics, the book combines theoretical and practical aspects in each self-contained chapter. Appendices supply additional background material. With its broad coverage and depth, and the expertise of the contributing authors, this is an invaluable reference for engineers, scientists, and technical managers, as well as researchers and graduate students. A hands-on resource, it explores what is required to successfully operate electronics in the most demanding conditions.
Author | : John J. Stephens |
Publisher | : ASM International |
Total Pages | : 430 |
Release | : 2006-01-01 |
Genre | : Technology & Engineering |
ISBN | : 1615031170 |
Author | : Eugenio Iannone |
Publisher | : CRC Press |
Total Pages | : 1351 |
Release | : 2018-09-03 |
Genre | : Medical |
ISBN | : 1351832069 |
Labs on Chip: Principles, Design and Technology provides a complete reference for the complex field of labs on chip in biotechnology. Merging three main areas— fluid dynamics, monolithic micro- and nanotechnology, and out-of-equilibrium biochemistry—this text integrates coverage of technology issues with strong theoretical explanations of design techniques. Analyzing each subject from basic principles to relevant applications, this book: Describes the biochemical elements required to work on labs on chip Discusses fabrication, microfluidic, and electronic and optical detection techniques Addresses planar technologies, polymer microfabrication, and process scalability to huge volumes Presents a global view of current lab-on-chip research and development Devotes an entire chapter to labs on chip for genetics Summarizing in one source the different technical competencies required, Labs on Chip: Principles, Design and Technology offers valuable guidance for the lab-on-chip design decision-making process, while exploring essential elements of labs on chip useful both to the professional who wants to approach a new field and to the specialist who wants to gain a broader perspective.
Author | : Preeti S Chauhan |
Publisher | : Springer Science & Business Media |
Total Pages | : 254 |
Release | : 2013-09-20 |
Genre | : Technology & Engineering |
ISBN | : 1461457610 |
This critical volume provides an in-depth presentation of copper wire bonding technologies, processes and equipment, along with the economic benefits and risks. Due to the increasing cost of materials used to make electronic components, the electronics industry has been rapidly moving from high cost gold to significantly lower cost copper as a wire bonding material. However, copper wire bonding has several process and reliability concerns due to its material properties. Copper Wire Bonding book lays out the challenges involved in replacing gold with copper as a wire bond material, and includes the bonding process changes—bond force, electric flame off, current and ultrasonic energy optimization, and bonding tools and equipment changes for first and second bond formation. In addition, the bond–pad metallurgies and the use of bare and palladium-coated copper wires on aluminum are presented, and gold, nickel and palladium surface finishes are discussed. The book also discusses best practices and recommendations on the bond process, bond–pad metallurgies, and appropriate reliability tests for copper wire-bonded electronic components. In summary, this book: Introduces copper wire bonding technologies Presents copper wire bonding processes Discusses copper wire bonding metallurgies Covers recent advancements in copper wire bonding including the bonding process, equipment changes, bond–pad materials and surface finishes Covers the reliability tests and concerns Covers the current implementation of copper wire bonding in the electronics industry Features 120 figures and tables Copper Wire Bonding is an essential reference for industry professionals seeking detailed information on all facets of copper wire bonding technology.
Author | : Anshuman Tripathi |
Publisher | : Springer Nature |
Total Pages | : 775 |
Release | : 2022-06-13 |
Genre | : Technology & Engineering |
ISBN | : 9811902526 |
This book compiles the best selected research papers presented during the 2nd International Conference on Intelligent Computing Techniques for Smart Energy Systems (ICTSES 2021), held at Manipal University, Jaipur, Rajasthan, India. It presents the diligent work of the research community where intelligent computing techniques are applied in allied fields of engineering ranging from engineering materials to electrical engineering to electronics and communication engineering- to computer-related fields. The theoretical research concepts are supported with extensive reviews highlighting the trends in the possible and real-life applications of computational intelligence. The high-quality content with broad range of the topics is thoroughly peer-reviewed and published on suitable recommendations.