Hyperlynx

Hyperlynx
Author: John McGrath
Publisher: Bloomsbury Publishing
Total Pages: 41
Release: 2015-09-23
Genre: Drama
ISBN: 1783194669

A sunny September day. Heather Smithson, a senior MI5 controller, has a dilemma. Her job is on the line. She pauses in the sunshine to brood on recent events and what they mean in her life. Seattle, Genoa, New York: What is the battleground? Who is the enemy? Hyperlynx was performed as a one act rehearsed reading at the Edinburgh Festival in August 2001. Its grim premonition of the terrorist activity of September 11th, necessitated that John McGrath wrote a second act. He completed the play in November before his death in January 2002. Hyperlynx was the winner of the Fringe First Award, Edinburgh 2002

Interconnect Noise Optimization in Nanometer Technologies

Interconnect Noise Optimization in Nanometer Technologies
Author: Mohamed Elgamel
Publisher: Springer Science & Business Media
Total Pages: 145
Release: 2006-03-20
Genre: Technology & Engineering
ISBN: 0387293663

Presents a range of CAD algorithms and techniques for synthesizing and optimizing interconnect Provides insight & intuition into layout analysis and optimization for interconnect in high speed, high complexity integrated circuits

SiP System-in-Package Design and Simulation

SiP System-in-Package Design and Simulation
Author: Suny Li (Li Yang)
Publisher: John Wiley & Sons
Total Pages: 508
Release: 2017-07-24
Genre: Technology & Engineering
ISBN: 1119045932

An advanced reference documenting, in detail, every step of a real System-in-Package (SiP) design flow Written by an engineer at the leading edge of SiP design and implementation, this book demonstrates how to design SiPs using Mentor EE Flow. Key topics covered include wire bonding, die stacks, cavity, flip chip and RDL (redistribution layer), Embedded Passive, RF design, concurrent design, Xtreme design, 3D real-time DRC (design rule checking), and SiP manufacture. Extensively illustrated throughout, System in Package Design and Simulation covers an array of issues of vital concern for SiP design and fabrication electronics engineers, as well as SiP users, including: Cavity and sacked dies design FlipChip and RDL design Routing and coppering 3D Real-Time DRC check SiP simulation technology Mentor SiP Design and Simulation Platform Designed to function equally well as a reference, tutorial, and self-study, System in Package Design and Simulation is an indispensable working resource for every SiP designer, especially those who use Mentor design tools.

Digital Design for Interference Specifications

Digital Design for Interference Specifications
Author: David Terrell
Publisher: Newnes
Total Pages: 360
Release: 1999-12-08
Genre: Science
ISBN: 9780750672825

Based on over twenty years of hands-on experience with electromagnetic interference (EMI), Digital Design for Interference Specifications provides circuit designers concrete rules that can be applied immediately to the design of new digital products. The authors' techniques emphasize EMI source suppression at the printed circuit board level and considers shielding only as a last resort. The material is written in a how-to format with brief qualitative explanations of why or how design recommendations suppress emissions or reduce susceptibility. The described approaches toward design and prevention of EMI will save manufacturers time, product cost, and enhance manufacturability. Best of all, designers will not have to be EMI gurus to implement these processes but they will definitely look like experts when the final outcome is assessed. Digital Design for Interference Specifications is a very well written book targeted directly toward circuit designers and EMI professionals. The authors built a consulting company out of the knowledge presented in the book working with a huge list of clients over the years. The material is written to directly apply to circuit designers' projects helping them save money and time on each design. The book is heavily and clearly illustrated. A practical, hands-on guide to EMI suppression and prevention. Written by circuit designers for use by circuit designers. Heavily illustrated and easy to read.

MicroSystem Based on SiP Technology

MicroSystem Based on SiP Technology
Author: Suny Li
Publisher: Springer Nature
Total Pages: 867
Release: 2022-05-28
Genre: Technology & Engineering
ISBN: 9811900833

This book is a comprehensive SiP design guide book. It is divided into three parts: concept and technology, design and simulation, project and case, for a total of 30 chapters. In Part one, the author proposes some new original concepts and thoughts, such as Function Density Law,Si3P and 4D integration. Part one also covers the latest technology of SiP and Advanced Packaging. Part two covers the latest SiP and Advanced Packaging design and simulation technologies, such as wire bonding, multi-step cavity, chip stacking, 2.5D TSV, 3D TSV, RDL, Fan- In, Fan-Out, Flip Chip, Embedded Passive, Embedded Chip, RF design, Rigid-Flex design, 4D SiP design, Multi-layout project and Team design, as well as SI, PI, thermal simulation, electrical verification and physical verification. Based on a real design case, part three introduces the design, simulation and implementation methods of different types of SiP, which has a -important reference significance for the research and development of SiP projects. This book comprehensively and deeply expounds the latest development, design ideas and design methods of contemporary SiP technology from three aspects: concept and technology, design and simulation, project and case. Through the detailed introduction of new concepts, design methods, actual projects and cases, this book describes the whole process of SiP products from the beginning of conception to the final realization and makes readers benefit from it.

Radiolocation in Ubiquitous Wireless Communication

Radiolocation in Ubiquitous Wireless Communication
Author: Danko Antolovic
Publisher: Springer Science & Business Media
Total Pages: 195
Release: 2010-01-05
Genre: Technology & Engineering
ISBN: 1441916326

Thisvolumehasitsbeginningsinalaboratoryproject,developmentofaradiolocator for the Wi-Fi network that was growing by leaps and bounds on the campus of Indiana University at that time. What started as a very focused and practical attempt to improve network management, touched in its lifetime upon broader issues of the use of radio spectrum, design of system architectures for the wireless medium, and image formation outside the limits of geometrical optics. Ihaveintendedthisbookmostlyfortheaudienceofengineersandsystemdesi- ers, in the growing ?eld of radio communication among small, portable, ubiquitous devices that have become hybrid platforms for personal communication and p- sonal computing. It is also a book addressed to network professionals, people to whom radio is largely a black box, a medium that they usually rely upon, but s- dom fully understand. In fact, in the course of my work in the ?eld, I have witnessed, to my dismay, a wide disconnect between the networking world and the radio technology that n- working has come to depend upon so heavily. Perhaps, because digital wireless communication is seen as digital ?rst and wireless second, there is often a m- placed emphasis on its information-processingside, with the methodologycentered around the discrete symbol, and with little intuition of the underlying physics. I had it once suggested to me, in apparent seriousness, to use radio cards for intra-system communication within a radiolocator! Wireless communication is radio, plain and simple.

High-Speed System and Analog Input/Output Design

High-Speed System and Analog Input/Output Design
Author: Thanh T. Tran
Publisher: Springer Nature
Total Pages: 225
Release: 2022-08-17
Genre: Technology & Engineering
ISBN: 3031049543

The new edition of this textbook is based on Dr. Thanh T. Tran’s 10+ years’ experience teaching high-speed digital and analog design courses at Rice University and 30+ years’ experience working in high-speed system design, including signal and power integrity in digital signal processing (DSP), computer, and embedded system. The book provides hands-on, practical instruction on high-speed digital and analog design for students and working engineers. The author first presents good high-speed digital and analog design practices that minimize both component and system noise and ensure system design success. He then presents guidelines to be used throughout the design process to reduce noise and radiation and to avoid common pitfalls while improving quality and reliability. The book is filled with tips on design and system simulation that minimize late stage redesign costs and product shipment delays. Hands-on design examples focusing on audio, video, analog filters, DDR memory, and power supplies are featured throughout. In addition, the author provides a practical approach to design multi-gigahertz high-speed serial busses (USB-C, PCIe, HDMI, DP) and simulate printed circuit board insertion and return loss using s-parameter models.

Network World

Network World
Author:
Publisher:
Total Pages: 152
Release: 1994-05-02
Genre:
ISBN:

For more than 20 years, Network World has been the premier provider of information, intelligence and insight for network and IT executives responsible for the digital nervous systems of large organizations. Readers are responsible for designing, implementing and managing the voice, data and video systems their companies use to support everything from business critical applications to employee collaboration and electronic commerce.

Signal Integrity Issues and Printed Circuit Board Design

Signal Integrity Issues and Printed Circuit Board Design
Author: Douglas Brooks
Publisher: Prentice Hall Professional
Total Pages: 418
Release: 2003
Genre: Computers
ISBN: 9780131418844

Complicated concepts explained succinctly and in laymen's terms to both experienced and novice PCB designers. Numerous examples allow reader to visualize how high-end software simulators see various types of SI problems and then their solutions. Author is a frequent and recognized seminar leader in the industry.